MINISMDC125F TE Connectivity Fuse (Fuses Chip) In Stock

MINISMDC125F is a TE Connectivity Sensor for sensing, monitoring, and control equipment. Key specs include 1.25A, 2.5A, and Fuses Chip integration. From RFQ pricing in stock for worldwide shipping.

TRANSFERREDFuseVerified Jun 2026
Package / Visual Reference
MINISMDC125FFuses Chip
Quick Facts
Manufacturer
TE Connectivity
Package
Fuses Chip
Pin Count
2
Lifecycle
TRANSFERRED
Category
Fuse
RoHS
Compliant
Lead Time
3–7 business days
Shipping
DHL Express · Worldwide

Key Features

  • Sensor profile suited for sensing, monitoring, and control equipment
  • 1.25A highlighted for quick engineering comparison
  • 2.5A support for footprint and operating-limit review
  • Fuses Chip package information for sourcing and assembly planning
  • 16V available from the current part record for buyer validation

Applications

MINISMDC125F is used in sensing, monitoring, and control equipment where buyers need a compatible sensor from TE Connectivity. Typical demand comes from production replenishment, design maintenance, repair programs, and engineering teams validating alternates against package, rating, and lifecycle constraints.

Specifications

Pbfree CodeYes
Reach Compliance CodeUnknown
Additional Feature0.05 TO 0.14 OHMS AT 20 DEG CEL
JESD-609 Codee3
Mounting FeatureSURFACE MOUNT
Package ShapeRECTANGULAR PACKAGE
Resistor TypePTC THERMISTOR
Surface MountYES
Terminal FinishTin (Sn)
Terminal PlacementDUAL ENDED
Terminal ShapeONE SURFACE
Thermistor ApplicationOVERLOAD PROTECTION
PackageFuses Chip

Compliance & Regulatory

RoHS StatusCompliant
Lead-FreeYes (Pb-Free)
ECCNEAR99
HTS Code8533.40.80.70

Datasheet

MINISMDC125F Datasheet Download

Official datasheet from TE Connectivity

Alternate & Equivalent Parts

No known alternates. Submit an RFQ and our team can suggest alternatives.

Frequently Asked Questions

Which sensing, monitoring, and control equipment designs are a good fit for MINISMDC125F with 1.25A?

MINISMDC125F is a sensor for sensing, monitoring, and control equipment; the 1.25A detail helps engineers compare it against schematic requirements, operating margins, and approved vendor constraints before purchase.

How should engineers evaluate Fuses Chip integration before selecting MINISMDC125F?

Review the Fuses Chip footprint together with 2.5A, assembly process limits, and available board area so the replacement or production lot matches the existing PCB layout.

What sourcing checks matter when ordering MINISMDC125F from TE Connectivity?

Confirm manufacturer traceability, date code, moisture packaging, and the recorded 16V specification because B2B orders often need consistent lots for production or maintenance builds.

Related Guides

Why Buy from FindMyChip

Authorized Source
Verified supply chain with full traceability & inspection
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Competitive Pricing
Factory-direct from China distributors, low MOQ
Fast Shipping
DHL Express 3–5 days · FedEx/UPS 5–7 days worldwide
Quality Guaranteed
30-day replacement for defective parts, no questions asked

About TE Connectivity

TE Connectivity is a leading electronic component manufacturer. FindMyChip sources TE Connectivity ICs directly from authorized China distributors, offering competitive pricing and reliable stock.

AvailabilityIn Stock
Reference Price (USD)
Contact for Price
Buy from 1pc · Factory-direct pricing
pcs

In Stock · 24h Response · Worldwide Shipping

Lead Time3-7 business days
MOQFrom 1 piece
ShippingDHL / FedEx / UPS
OriginChina (Authorized)

Response within 24 hours · Worldwide shipping

We've been using FindMyChip for 2 years. Pricing is consistently 20-30% below Mouser/DigiKey for volume orders.

SK
Sarah Kim
VP Engineering, NovaBit Electronics, South Korea