MIC39300-2.5BU Microchip Integrated Circuit (Other) In Stock
The MIC39300-2.5BU is a fixed 2.5 V, 3 A low-dropout linear regulator in a TO-263-3 surface-mount package, accepting input voltages from 2.5 V up to 16 V. It features a typical dropout voltage of 385 mV at full load. Suited for post-regulation of switching supplies, FPGA core rails, and high-current embedded system power applications.
- Manufacturer
- Microchip
- Package
- Other
- Pin Count
- 4
- Lifecycle
- OBSOLETE
- Datasheet
- MIC39300-2.5BU Datasheet PDF
- Category
- Integrated Circuit
- Price
- From $2.1200(MOQ 1)
- RoHS
- Non-compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- Fixed 2.5 V output at up to 3 A continuous output current
- Low dropout voltage of 385 mV typical at 3 A
- Wide input voltage range from 2.5 V to 16 V
- TO-263-3 surface-mount package with exposed tab for heat sinking
- Internal current limiting and thermal shutdown protection
- Stable with low-ESR ceramic output capacitors
Applications
The MIC39300-2.5BU is used to provide clean, regulated 2.5 V rails for FPGAs, DSPs, and mixed-signal circuits that draw up to 3 A. Its low dropout characteristic allows efficient post-regulation directly from a 3.3 V bus without a large input-output headroom penalty. The device is also common in telecom line cards and industrial power supplies where robust thermal protection and high output current are required.
Specifications
| Reach Compliance Code | Not Compliant |
| YTEOL | 0 |
| Adjustability | FIXED |
| Dropout Voltage1-Max | 0.55V |
| Dropout Voltage1-Nom | 0.385V |
| Input Voltage Absolute-Max | 20V |
| Input Voltage-Max | 16V |
| Input Voltage-Min | 2.5V |
| JESD-30 Code | R-PSSO-G3 |
| JESD-609 Code | e0 |
| Line Regulation-Max | 0.0125% |
| Load Regulation-Max | 0.025% |
| Number of Functions | 1 |
| Number of Outputs | 1 |
| Operating Temperature TJ-Max | 125°C |
| Operating Temperature TJ-Min | -40 °C |
| Output Current1-Max | 3A |
| Output Voltage1-Max | 2.55V |
| Output Voltage1-Min | 2.45V |
| Output Voltage1-Nom | 2.5V |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | SMSIP3H,.55TB |
| Package Shape | RECTANGULAR |
| Package Style | SMALL OUTLINE |
| Peak Reflow Temperature (Cel) | 240 |
| Qualification Status | Not Qualified |
| Regulator Type | FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR |
| Surface Mount | YES |
| Technology | BIPOLAR |
| Terminal Finish | Tin/Lead (Sn85Pb15) |
| Terminal Form | GULL WING |
| Terminal Pitch | 2.54mm |
| Terminal Position | SINGLE |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Voltage Tolerance-Max | 2% |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Non-compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 3 |
| ECCN | EAR99 |
| HTS Code | 8542.39.00.60 |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the dropout voltage of the MIC39300-2.5BU at its maximum 3 A load, and how does that affect headroom requirements?
At 3 A output current, the MIC39300-2.5BU exhibits a typical dropout voltage of 385 mV and a maximum of 550 mV. This means the input supply must remain at least 2.85 V to 3.05 V above the 2.5 V output, so a 3.3 V input bus provides comfortable headroom for stable regulation in most industrial and embedded designs.
What protections are built into the MIC39300-2.5BU, and how do they help in fault conditions?
The MIC39300-2.5BU integrates internal current limiting and thermal shutdown circuitry. If the output is short-circuited or the junction temperature exceeds approximately 150°C, the device clamps the output current and shuts down automatically, preventing damage to itself or the load. Once the fault clears and the junction cools below the reset threshold, the regulator resumes normal 2.5 V regulation.
How does the TO-263-3 package of the MIC39300-2.5BU simplify thermal management compared to a TO-220 version?
The TO-263-3 package mounts directly onto the PCB with its exposed metal tab soldered to a copper pour or thermal via array, eliminating the insulating hardware and clip required by a through-hole TO-220. At 3 A and a 385 mV dropout, the device dissipates roughly 1.15 W, which a modest 2 cm² copper area on 1 oz copper can handle without exceeding a 25°C temperature rise, making the surface-mount form factor practical for dense board layouts.
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