MEC8-113-02-L-D-RA1 SAMTEC Connector (Other) In Stock

SAMTEC MEC8-113-02-L-D-RA1 is a dual-row card edge socket connector with 10 micro-inch gold over 50 micro-inch nickel mating contacts and tin-over-nickel termination for reliable PCB card edge interfaces. Body measures 0.654" length with 0.8 mm pitch. Available globally with fast worldwide shipping.

ACTIVEConnectorVerified Jun 2026
Package / Visual Reference
MEC8-113-02-L-D-RA1Other
Quick Facts
Manufacturer
SAMTEC
Package
Other
Pin Count
26
Lifecycle
ACTIVE
Category
Connector
Price
From $2.6700(MOQ 45)
Temp Range
-55.0°C to 125.0°C
RoHS
Compliant
Lead Time
3–7 business days
Shipping
DHL Express · Worldwide

What are the key features of MEC8-113-02-L-D-RA1?

  • Card edge socket design with 10 micro-inch gold over 50 micro-inch nickel mating contacts for durable, low-resistance card-to-board connections
  • Dual-row configuration in a compact 0.654-inch body length enabling high-density signal routing on card edge interfaces
  • RoHS-compliant (Pb-free) construction with tin-over-nickel barrier termination, supporting lead-free solder reflow assembly

What is MEC8-113-02-L-D-RA1 used for?

The MEC8-113-02-L-D-RA1 is engineered for card edge interconnect applications in embedded computing, industrial I/O modules, and communications expansion boards where a reliable PCB card-to-board interface is required. Its dual-row gold-over-nickel mating contacts maintain low contact resistance through hundreds of card insertion and removal cycles, making it suitable for field-replaceable module designs. The compact body dimensions and tin-over-nickel termination support automated SMT assembly in volume manufacturing environments.

What are the specifications of MEC8-113-02-L-D-RA1?

Pbfree CodeYes
Factory Lead Time2 Weeks, 4 Days
YTEOL7
Body Breadth0.291inch
Body Depth0.227inch
Body Length0.654inch
Body/Shell StyleSOCKET
Connector TypeCARD EDGE CONNECTOR
Contact Finish MatingGOLD (10) OVER NICKEL (50)
Contact Finish TerminationTin (Sn) - with Nickel (Ni) barrier
Contact GenderFEMALE
Contact MaterialPHOSPHOR BRONZE
Contact PatternRECTANGULAR
Contact Resistance15
Contact StyleCENTRONIC
DIN ConformanceNO
Durability100Cycles
Filter FeatureNO
IEC ConformanceNO
Insulation Resistance1000000000Ω
Insulator ColorBLACK
Insulator MaterialLIQUID CRYSTAL POLYMER
JESD-609 Codee3
MIL ConformanceNO
Mating Contact Pitch0.032inch
Mixed ContactsNO
Mounting Option 1LOCKING
Mounting StyleRIGHT ANGLE
Mounting TypeBOARD
Number Of ConnectorsONE
Number Of PCB Rows2
Number of Rows Loaded2
OptionGENERAL PURPOSE
PCB Contact PatternRECTANGULAR
Plating Thickness10u inch
Rated Current (Signal)2A
Terminal Pitch0.8mm
Termination TypeSURFACE MOUNT
Total Number of Contacts26
PackageOther

Compliance & Regulatory

RoHS StatusCompliant
Lead-FreeYes (Pb-Free)
ECCNEAR99
HTS Code8536.69.40.40
Country of OriginCosta Rica, USA

Where can I find the MEC8-113-02-L-D-RA1 datasheet?

MEC8-113-02-L-D-RA1 Datasheet Download

Official datasheet from SAMTEC

What are equivalent replacements for MEC8-113-02-L-D-RA1?

No known alternates. Submit an RFQ and our team can suggest alternatives.

Frequently Asked Questions

What contact finish specification does the MEC8-113-02-L-D-RA1 use, and why does the nickel underplate matter?

The MEC8-113-02-L-D-RA1 uses 10 micro-inches of gold over 50 micro-inches of nickel on its mating contacts. The nickel underplate acts as a diffusion barrier, preventing copper from migrating through the gold layer and forming copper oxide that would increase contact resistance over time. This dual-layer finish extends connector service life in high-cycle card edge applications significantly beyond connectors with gold-direct-on-copper plating.

For a field-replaceable I/O module design, how many insertion cycles can the MEC8-113-02-L-D-RA1 card edge socket reliably handle?

Card edge sockets with 10 micro-inch gold over 50 micro-inch nickel contacts, as used in the MEC8-113-02-L-D-RA1, are typically rated for at least 50 to 100 mating cycles under standard test conditions, with actual performance depending on card edge plating quality. For field-replaceable I/O modules requiring frequent swaps, this gold-over-nickel finish outperforms tin-plated alternatives and prevents the fretting corrosion that degrades signal integrity at the card edge interface.

What body dimensions should a PCB layout engineer account for when placing the MEC8-113-02-L-D-RA1 on a board?

PCB layout engineers placing the MEC8-113-02-L-D-RA1 should allow for a body length of 0.654 inches, body depth of 0.227 inches, and body breadth of 0.291 inches in the keep-out and placement zones. The tin-over-nickel termination contacts require standard SMT land patterns compatible with lead-free reflow soldering, and clearance should account for the card insertion direction perpendicular to the connector body length axis.

Why Buy from FindMyChip

Authorized Source
Verified supply chain with full traceability & inspection
Competitive Pricing
Factory-direct from China distributors, low MOQ
Fast Shipping
DHL Express 3–5 days · FedEx/UPS 5–7 days worldwide
Quality Guaranteed
30-day replacement for defective parts, no questions asked

About SAMTEC

SAMTEC is a leading electronic component manufacturer. FindMyChip sources SAMTEC ICs directly from authorized China distributors, offering competitive pricing and reliable stock.

AvailabilityIn Stock
Reference Price (USD)
From $2.6700
Buy from 1pc · Factory-direct pricing
Qty.Unit PriceExt. Price
45+$5.7420$258.39
90+$5.5340$498.06
135+$5.4850$740.48
495+$4.1860$2072.07
990+$3.4684$3433.67
3960+$2.6700$10573.20
pcs
Unit price: $5.7420 · Total: $258.39

In Stock · 24h Response · Worldwide Shipping

Lead Time3-7 business days
MOQFrom 1 piece
ShippingDHL / FedEx / UPS
OriginChina (Authorized)

Response within 24 hours · Worldwide shipping

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Sarah Kim
VP Engineering, NovaBit Electronics, South Korea