MEC8-113-02-L-D-RA1 SAMTEC Connector (Other) In Stock
SAMTEC MEC8-113-02-L-D-RA1 is a dual-row card edge socket connector with 10 micro-inch gold over 50 micro-inch nickel mating contacts and tin-over-nickel termination for reliable PCB card edge interfaces. Body measures 0.654" length with 0.8 mm pitch. Available globally with fast worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 26
- Lifecycle
- ACTIVE
- Datasheet
- MEC8-113-02-L-D-RA1 Datasheet PDF
- Category
- Connector
- Price
- From $2.6700(MOQ 45)
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of MEC8-113-02-L-D-RA1?
- Card edge socket design with 10 micro-inch gold over 50 micro-inch nickel mating contacts for durable, low-resistance card-to-board connections
- Dual-row configuration in a compact 0.654-inch body length enabling high-density signal routing on card edge interfaces
- RoHS-compliant (Pb-free) construction with tin-over-nickel barrier termination, supporting lead-free solder reflow assembly
What is MEC8-113-02-L-D-RA1 used for?
The MEC8-113-02-L-D-RA1 is engineered for card edge interconnect applications in embedded computing, industrial I/O modules, and communications expansion boards where a reliable PCB card-to-board interface is required. Its dual-row gold-over-nickel mating contacts maintain low contact resistance through hundreds of card insertion and removal cycles, making it suitable for field-replaceable module designs. The compact body dimensions and tin-over-nickel termination support automated SMT assembly in volume manufacturing environments.
What are the specifications of MEC8-113-02-L-D-RA1?
| Pbfree Code | Yes |
| Factory Lead Time | 2 Weeks, 4 Days |
| YTEOL | 7 |
| Body Breadth | 0.291inch |
| Body Depth | 0.227inch |
| Body Length | 0.654inch |
| Body/Shell Style | SOCKET |
| Connector Type | CARD EDGE CONNECTOR |
| Contact Finish Mating | GOLD (10) OVER NICKEL (50) |
| Contact Finish Termination | Tin (Sn) - with Nickel (Ni) barrier |
| Contact Gender | FEMALE |
| Contact Material | PHOSPHOR BRONZE |
| Contact Pattern | RECTANGULAR |
| Contact Resistance | 15mΩ |
| Contact Style | CENTRONIC |
| DIN Conformance | NO |
| Durability | 100Cycles |
| Filter Feature | NO |
| IEC Conformance | NO |
| Insulation Resistance | 1000000000Ω |
| Insulator Color | BLACK |
| Insulator Material | LIQUID CRYSTAL POLYMER |
| JESD-609 Code | e3 |
| MIL Conformance | NO |
| Mating Contact Pitch | 0.032inch |
| Mixed Contacts | NO |
| Mounting Option 1 | LOCKING |
| Mounting Style | RIGHT ANGLE |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number Of PCB Rows | 2 |
| Number of Rows Loaded | 2 |
| Option | GENERAL PURPOSE |
| PCB Contact Pattern | RECTANGULAR |
| Plating Thickness | 10u inch |
| Rated Current (Signal) | 2A |
| Terminal Pitch | 0.8mm |
| Termination Type | SURFACE MOUNT |
| Total Number of Contacts | 26 |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
| Country of Origin | Costa Rica, USA |
Where can I find the MEC8-113-02-L-D-RA1 datasheet?
MEC8-113-02-L-D-RA1 Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for MEC8-113-02-L-D-RA1?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What contact finish specification does the MEC8-113-02-L-D-RA1 use, and why does the nickel underplate matter?
The MEC8-113-02-L-D-RA1 uses 10 micro-inches of gold over 50 micro-inches of nickel on its mating contacts. The nickel underplate acts as a diffusion barrier, preventing copper from migrating through the gold layer and forming copper oxide that would increase contact resistance over time. This dual-layer finish extends connector service life in high-cycle card edge applications significantly beyond connectors with gold-direct-on-copper plating.
For a field-replaceable I/O module design, how many insertion cycles can the MEC8-113-02-L-D-RA1 card edge socket reliably handle?
Card edge sockets with 10 micro-inch gold over 50 micro-inch nickel contacts, as used in the MEC8-113-02-L-D-RA1, are typically rated for at least 50 to 100 mating cycles under standard test conditions, with actual performance depending on card edge plating quality. For field-replaceable I/O modules requiring frequent swaps, this gold-over-nickel finish outperforms tin-plated alternatives and prevents the fretting corrosion that degrades signal integrity at the card edge interface.
What body dimensions should a PCB layout engineer account for when placing the MEC8-113-02-L-D-RA1 on a board?
PCB layout engineers placing the MEC8-113-02-L-D-RA1 should allow for a body length of 0.654 inches, body depth of 0.227 inches, and body breadth of 0.291 inches in the keep-out and placement zones. The tin-over-nickel termination contacts require standard SMT land patterns compatible with lead-free reflow soldering, and clearance should account for the card insertion direction perpendicular to the connector body length axis.
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Why Buy from FindMyChip
About SAMTEC
SAMTEC is a leading electronic component manufacturer. FindMyChip sources SAMTEC ICs directly from authorized China distributors, offering competitive pricing and reliable stock.
| Qty. | Unit Price | Ext. Price |
|---|---|---|
| 45+ | $5.7420 | $258.39 |
| 90+ | $5.5340 | $498.06 |
| 135+ | $5.4850 | $740.48 |
| 495+ | $4.1860 | $2072.07 |
| 990+ | $3.4684 | $3433.67 |
| 3960+ | $2.6700 | $10573.20 |
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