MEC1503H-L1-I/SZ Microchip Integrated Circuit (BGA) In Stock
MEC1503H-L1-I/SZ is a Microchip embedded controller with 256 KB SRAM, designed for platform management and keyboard/EC functions in notebook and desktop systems. It integrates power sequencing, thermal management, and PS/2 interfaces in a BGA package for compact motherboard designs.
- Manufacturer
- Microchip
- Package
- BGA
- Pin Count
- 144
- Lifecycle
- ACTIVE
- Datasheet
- MEC1503H-L1-I/SZ Datasheet PDF
- Category
- Integrated Circuit
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 256 KB integrated SRAM enables large firmware images and runtime data buffers for complex platform management tasks
- BGA package with industrial temperature rating (I-grade) supports reliable operation in demanding embedded and commercial computing environments
- Integrated embedded controller core handles keyboard, power sequencing, and thermal management functions without external MCUs
Applications
The MEC1503H-L1-I/SZ is primarily used as a platform embedded controller (EC) in laptop motherboards, desktop systems, and server baseboard management designs. It manages critical functions including keyboard scanning, battery charging control, fan speed regulation, and system power sequencing during boot. Its 256 KB SRAM and BGA form factor make it suitable for high-integration platform designs where minimizing discrete component count is essential.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How much SRAM does the MEC1503H-L1-I/SZ include, and why does it matter for firmware complexity?
The MEC1503H-L1-I/SZ integrates 256 KB of SRAM, providing ample space for complex EC firmware that handles multiple simultaneous platform management tasks such as thermal control, power sequencing, and keyboard scanning. This reduces the need for external memory in notebook and desktop motherboard designs.
What package type is used for MEC1503H-L1-I/SZ and what are the benefits for modern motherboard layouts?
The MEC1503H-L1-I/SZ uses a BGA (Ball Grid Array) package, which provides a very compact footprint compared to QFP alternatives. BGA packages route high pin counts in a small board area, which is essential for thin and light laptop motherboards and compact desktop platforms where PCB real estate is limited.
Which platform management functions does MEC1503H-L1-I/SZ handle in a typical notebook design?
In a notebook design, the MEC1503H-L1-I/SZ manages keyboard matrix scanning, lid switch detection, battery charge control, fan speed via PWM outputs, power rail sequencing during S0/S3/S4/S5 state transitions, and thermal sensor monitoring. These functions reduce external component count and consolidate platform management into a single 256 KB SRAM-integrated controller.
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