MCR03EZPFX4703 ROHM Semiconductor Resistor (Resistor Chip) In Stock

ROHM MCR03EZPFX4703 is a 470 kΩ ±1% thick film chip resistor in a 0603 (1608M) surface mount package rated at 0.1 W with ±100 ppm/°C temperature coefficient. Compact 1.6 mm × 0.8 mm footprint suits high-density PCB designs with RoHS-compliant lead-free termination. In stock at authorized distributors with worldwide shipping.

NOT RECOMMENDEDResistorVerified Jun 2026
Package / Visual Reference
MCR03EZPFX4703Resistor Chip
Quick Facts
Manufacturer
ROHM Semiconductor
Package
Resistor Chip
Pin Count
2
Lifecycle
NOT RECOMMENDED
Category
Resistor
Temp Range
-55.0°C to 155.0°C
RoHS
Compliant
Lead Time
3–7 business days
Shipping
DHL Express · Worldwide

Key Features

  • 470 kΩ resistance with ±1% tolerance and ±100 ppm/°C TCR in a 0603 package, providing precision voltage-divider and pull-up/pull-down performance in analog and digital circuits
  • 0.1 W power rating in a 1.6 mm × 0.8 mm × 0.45 mm package enables high-density SMT placement on 4-layer PCBs with component spacing as tight as 0.1 mm
  • RoHS-compliant lead-free (Pb-free) e3 termination finish meets JESD-609 requirements and EU RoHS Directive 2011/65/EU for global market distribution

Applications

The MCR03EZPFX4703 is used in precision voltage dividers, bias networks, and pull-up/pull-down resistor arrays in analog signal conditioning, microcontroller I/O interfaces, and sensor front-end circuits where 470 kΩ ±1% is required in a compact 0603 footprint. Its ±100 ppm/°C TCR ensures resistance drift below 4.7 kΩ across a 100°C operating range, making it suitable for temperature-sensitive ADC reference dividers and comparator threshold networks in industrial instrumentation. The 0.1 W rating handles signal-level currents up to 462 µA at rated voltage, covering most digital pull-up and analog biasing applications in 3.3 V and 5 V systems.

Specifications

Pbfree CodeYes
Reach Compliance CodeCompliant
YTEOL9
ConstructionRectangular
JESD-609 Codee3
Mounting FeatureSURFACE MOUNT
Package Height0.45mm
Package Length1.6mm
Package ShapeRECTANGULAR PACKAGE
Package StyleSMT
Package Width0.8mm
Packing MethodTR, PAPER, 7 INCH
Rated Power Dissipation (P)0.1W
Rated Temperature70°C
Reference StandardAEC-Q200; IATF 16949
Resistance470000Ω
Resistor TypeFIXED RESISTOR
Size Code0603
Surface MountYES
TechnologyMETAL GLAZE/THICK FILM
Temperature Coefficient100ppm/°C
Terminal FinishTin (Sn) - with Nickel (Ni) barrier
Terminal ShapeWRAPAROUND
Tolerance1%
Working Voltage50V
PackageResistor Chip

Compliance & Regulatory

RoHS StatusCompliant
Lead-FreeYes (Pb-Free)
ECCNEAR99
HTS Code8533.21.00.30
Country of OriginPhilippines, Thailand

Datasheet

MCR03EZPFX4703 Datasheet Download

Official datasheet from ROHM Semiconductor

Alternate & Equivalent Parts

No known alternates. Submit an RFQ and our team can suggest alternatives.

Frequently Asked Questions

What resistance, tolerance, and power rating does the MCR03EZPFX4703 offer in its 0603 package?

The MCR03EZPFX4703 provides 470 kΩ resistance with ±1% tolerance and a 0.1 W power rating in a 0603 (1608M) package measuring 1.6 mm × 0.8 mm × 0.45 mm. At 0.1 W, the maximum continuous voltage across the resistor is approximately 217 V, and the maximum DC current through it at 5 V is 10.6 µA — well within signal-level biasing applications.

How does the ±100 ppm/°C TCR of MCR03EZPFX4703 affect a precision voltage divider in an industrial sensor operating from -40°C to +85°C?

With a ±100 ppm/°C TCR and a 125°C operating range (-40°C to +85°C), the MCR03EZPFX4703 resistance can shift by up to ±1.25% (100 ppm × 125°C), adding up to ±5.875 kΩ of drift to the nominal 470 kΩ. In a resistor-divider ADC reference, this limits uncompensated ratio error to ±0.63% — acceptable for 10-bit ADC accuracy but marginal for 12-bit designs without temperature compensation.

For an MCU GPIO pull-up circuit running at 3.3 V, how much current does the MCR03EZPFX4703 draw when the line is pulled low?

With 3.3 V across 470 kΩ, the pull-up current is 3.3 V ÷ 470,000 Ω = 7.02 µA per pin. This very low current makes MCR03EZPFX4703 ideal for weak pull-ups on I²C SDA/SCL lines where multiple devices share the bus and pull-up current must be minimized to reduce power consumption in battery-operated IoT systems targeting supply currents below 10 µA in standby.

Can MCR03EZPFX4703 be placed on a high-density PCB with 0.1 mm minimum spacing, and does ROHM provide a recommended land pattern?

Yes, the 0603 package (1.6 mm × 0.8 mm body, 0.45 mm height) supports 0.1 mm inter-component spacing on standard 4-layer PCBs with 100 µm trace/space design rules. ROHM's MCR series datasheet specifies a recommended land pattern with 1.5 mm pitch between pad centers and 0.9 mm × 0.9 mm pad size, compliant with IPC-7351 0603 Nominal footprint guidelines.

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Lead Time3-7 business days
MOQFrom 1 piece
ShippingDHL / FedEx / UPS
OriginChina (Authorized)

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