MCR03EZPFX1801 ROHM Semiconductor Resistor (Resistor Chip) In Stock
The MCR03EZPFX1801 is a ROHM MCR Series thick-film surface mount resistor in an 0603 (1.6 mm x 0.8 mm) package with a resistance of 1.8 kΩ, ±1% tolerance, and 0.1 W power rating. It features a ±100 ppm/°C temperature coefficient and REACH/RoHS-compliant, lead-free construction for use in modern electronic assemblies. Widely available from global distributors with tape-and-reel packaging for automated SMT production lines.
- Manufacturer
- ROHM Semiconductor
- Package
- Resistor Chip
- Pin Count
- 2
- Lifecycle
- NOT RECOMMENDED
- Datasheet
- MCR03EZPFX1801 Datasheet PDF
- Category
- Resistor
- Temp Range
- -55.0°C to 155.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 1.8 kΩ resistance with ±1% tight tolerance ensures precise current limiting and voltage division in analog and digital circuits
- 0.1 W power rating in a compact 0603 (1.6 mm x 0.8 mm) package enables high-density PCB placement with minimal thermal footprint
- ±100 ppm/°C temperature coefficient maintains resistance stability across wide temperature ranges from -55°C to +155°C
- REACH and RoHS compliant lead-free construction meets global environmental regulations for use in consumer, industrial, and automotive electronics
Applications
The MCR03EZPFX1801 is commonly used in voltage divider networks, pull-up/pull-down resistor arrays, and current-limiting circuits in microcontroller-based consumer electronics, IoT devices, and industrial sensor interfaces. Its 1.8 kΩ value and ±1% tolerance make it appropriate for precision analog signal conditioning, ADC input filtering, and LED current control applications. The 0603 SMT package and tape-and-reel availability support high-volume automated PCB assembly in telecommunications equipment, medical devices, and automotive electronics.
Specifications
| Pbfree Code | Yes |
| Reach Compliance Code | Compliant |
| YTEOL | 9 |
| Construction | Rectangular |
| JESD-609 Code | e3 |
| Mounting Feature | SURFACE MOUNT |
| Package Height | 0.45mm |
| Package Length | 1.6mm |
| Package Shape | RECTANGULAR PACKAGE |
| Package Style | SMT |
| Package Width | 0.8mm |
| Packing Method | TR, PAPER, 7 INCH |
| Rated Power Dissipation (P) | 0.1W |
| Rated Temperature | 70°C |
| Reference Standard | AEC-Q200; IATF 16949 |
| Resistance | 1800Ω |
| Resistor Type | FIXED RESISTOR |
| Size Code | 0603 |
| Surface Mount | YES |
| Technology | METAL GLAZE/THICK FILM |
| Temperature Coefficient | 100ppm/°C |
| Terminal Finish | Tin (Sn) - with Nickel (Ni) barrier |
| Terminal Shape | WRAPAROUND |
| Tolerance | 1% |
| Working Voltage | 50V |
| Package | Resistor Chip |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8533.21.00.30 |
| Country of Origin | Philippines, Thailand |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does the ±100 ppm/°C TCR of MCR03EZPFX1801 affect circuit performance across temperature extremes?
The MCR03EZPFX1801's temperature coefficient of resistance (TCR) of ±100 ppm/°C means the 1.8 kΩ nominal value drifts by no more than 180 Ω per 1000°C change, or approximately 18 Ω across a 100°C operating range from -55°C to +155°C. This low drift makes it suitable for precision analog divider networks and sensor bias circuits that must maintain better than 1% accuracy across automotive and industrial temperature ranges.
What power dissipation can the MCR03EZPFX1801 handle in a typical PCB application?
The MCR03EZPFX1801 is rated at 0.1 W (100 mW) maximum continuous power dissipation in an 0603 package measuring 1.6 mm x 0.8 mm x 0.45 mm. At 1.8 kΩ, this corresponds to a maximum continuous current of approximately 7.45 mA or a maximum voltage of approximately 13.4 V across the resistor, providing comfortable headroom for most 3.3 V and 5 V logic circuit applications.
For which PCB assembly processes is the MCR03EZPFX1801 best suited given its 0603 form factor?
The MCR03EZPFX1801's 0603 SMT package (1.6 mm x 0.8 mm, 0.45 mm height) is compatible with standard reflow soldering at peak temperatures up to 260°C per IPC/JEDEC J-STD-020, as well as automated pick-and-place at placement rates exceeding 20,000 components per hour. Tape-and-reel packaging is available for reel diameters of 178 mm or 330 mm, supporting both low-volume prototyping and high-volume production runs in consumer and industrial electronics.
How does MCR03EZPFX1801 compare to a 0402 package resistor of the same value for high-density board designs?
Compared to a 0402 resistor of the same 1.8 kΩ, ±1% value, the MCR03EZPFX1801 in 0603 offers a larger pad footprint of 1.6 mm x 0.8 mm, making it more suitable for hand-soldering during prototyping and reducing placement sensitivity to ±0.2 mm misalignment. The 0603 also handles up to 0.1 W versus approximately 0.063 W for the 0402 format, providing greater thermal margin in current-limiting and pull-up applications in 5 V circuits.
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