MCP9701AT-E/TO Microchip Integrated Circuit (SOT23 (3-Pin)) In Stock
Microchip MCP9701AT-E/TO is a low-power linear active thermistor IC temperature sensor with ±4°C accuracy, 3.1V to 5.5V supply, and 0.015 mA operating current in a through-hole TO-92 package. Suitable for cost-sensitive temperature monitoring in consumer and industrial applications.
- Manufacturer
- Microchip
- Package
- SOT23 (3-Pin)
- Pin Count
- 3
- Lifecycle
- ACTIVE
- Datasheet
- MCP9701AT-E/TO Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- Ultra-low operating current of 0.015 mA enabling battery-powered and energy-harvesting temperature sensing
- Linear analog output voltage with 19.5 mV/°C sensitivity for direct ADC interfacing without lookup tables
- Wide supply voltage range of 3.1V to 5.5V compatible with both 3.3V and 5V microcontroller systems
- Maximum accuracy of ±4°C over the operating temperature range in a compact TO-92 through-hole package
Applications
The MCP9701AT-E/TO is designed for low-cost, low-power temperature monitoring in portable consumer electronics, HVAC systems, and battery-operated IoT nodes. Its linear analog output voltage simplifies integration with 8-bit or higher ADCs on microcontrollers, avoiding the need for complex digital bus protocols. Industrial applications such as motor thermal protection and PCB ambient monitoring also benefit from its simple two-wire analog interface.
Specifications
| Pbfree Code | Yes |
| YTEOL | 6 |
| Accuracy-Max (Cel) | 4Cel |
| Body Height | 4.826mm |
| Body Length or Diameter | 4.826mm |
| Housing | PLASTIC |
| JESD-609 Code | e3 |
| Mounting Feature | THROUGH HOLE MOUNT |
| Number of Bits | 8 |
| Operating Current-Max | 0.015mA |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | SIP3,.1,50 |
| Package Shape/Style | ROUND |
| Screening Level | TS 16949 |
| Sensors/Transducers Type | TEMPERATURE SENSOR,ANALOG,RESISTANCE BASED |
| Supply Voltage-Max | 5.5V |
| Supply Voltage-Min | 3.1V |
| Surface Mount | NO |
| Terminal Finish | MATTE TIN |
| Termination Type | SOLDER |
| Package | SOT23 (3-Pin) |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Country of Origin | Thailand |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does the MCP9701AT-E/TO output temperature data and what ADC resolution is needed?
The MCP9701AT-E/TO provides a linear analog voltage output with a sensitivity of 19.5 mV/°C. For a 0°C to 70°C range, the output spans approximately 1.365V. A 10-bit ADC at 3.3V reference yields about 0.32°C resolution per LSB, which comfortably meets the ±4°C accuracy specification for most consumer and industrial monitoring applications.
What is the supply current requirement of the MCP9701AT-E/TO and how long can it run on a coin cell?
The MCP9701AT-E/TO draws a maximum of 0.015 mA (15 µA) from its 3.1V to 5.5V supply. On a typical 225 mAh CR2032 coin cell at 3V, the sensor alone could theoretically run for over 15,000 hours, making it an excellent choice for long-life battery-operated wireless sensor nodes.
Is the MCP9701AT-E/TO suitable for outdoor temperature monitoring applications requiring a wide temperature range?
Yes, the MCP9701AT-E/TO is rated for an operating temperature range of -40°C to +125°C, covering most outdoor and automotive ambient monitoring scenarios. Its ±4°C maximum accuracy is acceptable for HVAC control, weather stations, and outdoor equipment thermal management, especially at this low 0.015 mA current consumption.
When would a designer choose MCP9701AT-E/TO over a digital temperature sensor like the MCP9808?
A designer would choose the MCP9701AT-E/TO when analog output is preferred to avoid I2C/SPI bus overhead and when ±4°C accuracy is sufficient. At 0.015 mA, it consumes significantly less power than most digital sensors, and the TO-92 through-hole package suits prototyping or rugged through-hole assembly processes where SOT-23 SMD parts are harder to hand-solder.
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