MCP608-I/STAlternatives & Equivalent Parts
About MCP608-I/ST
MCP608-I/ST is a Integrated Circuit component manufactured by Microchip. It comes in a Small Outline Packages package. Below you'll find known alternative and equivalent parts that can serve as replacements in your design.
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Specification Comparison
| Parameter | MCP608-I/STSource | MCP608-I/SN |
|---|---|---|
| Manufacturer | Microchip | Microchip |
| Package Type | Small Outline Packages | Small Outline Packages |
| Pin Count | 8 | 8 |
| Temperature Range | -40.0°C ~ 85.0°C | -40.0°C ~ 85.0°C |
| Price | $0.6950 | $0.6950 |
| Stock | In Stock | In Stock |
| Lifecycle | ACTIVE | ACTIVE |
| Electrical Parameters | ||
| Pbfree Code | Yes | Yes |
| Manufacturer Package Code | TSSOP-8 | SOIC-8 |
| Factory Lead Time | 6 Weeks | 6 Weeks |
| YTEOL | 8 | 8 |
| Amplifier Type | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER |
| Architecture | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK |
| Average Bias Current-Max (IIB) | 0.00008 µA | 0.00008 µA |
| Common-mode Reject Ratio-Min | 75 dB | 75 dB |
| Common-mode Reject Ratio-Nom | 91 dB | 91 dB |
| Frequency Compensation | YES | YES |
| Input Offset Voltage-Max | 250 µV | 250 µV |
| JESD-30 Code | R-PDSO-G8 | R-PDSO-G8 |
| JESD-609 Code | e3 | e3 |
| Low-Bias | YES | YES |
| Low-Offset | YES | YES |
| Micropower | YES | YES |
| Number of Functions | 1 | 1 |
| Package Body Material | PLASTIC/EPOXY | PLASTIC/EPOXY |
| Package Equivalence Code | TSSOP8,.25 | SOP8,.25 |
| Package Shape | RECTANGULAR | RECTANGULAR |
| Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE |
| Packing Method | TUBE | TUBE |
| Peak Reflow Temperature (Cel) | 260 | 260 |
| Power | NO | NO |
| Programmable Power | NO | NO |
| Qualification Status | Not Qualified | Not Qualified |
| Screening Level | TS 16949 | TS 16949 |
| Slew Rate-Nom | 0.08 V/us | 0.08 V/us |
| Supply Current-Max | 0.025 mA | 0.025 mA |
| Supply Voltage Limit-Max | 7 V | 7 V |
| Supply Voltage-Nom (Vsup) | 5 V | 5 V |
| Surface Mount | YES | YES |
| Technology | CMOS | CMOS |
| Temperature Grade | INDUSTRIAL | INDUSTRIAL |
| Terminal Finish | Matte Tin (Sn) | Matte Tin (Sn) |
| Terminal Form | GULL WING | GULL WING |
| Terminal Pitch | 0.65 mm | 1.27 mm |
| Terminal Position | DUAL | DUAL |
| Time@Peak Reflow Temperature-Max (s) | 40 | — |
| Unity Gain BW-Nom | 155 | 155 |
| Voltage Gain-Min | 100000 | 100000 |
| Wideband | NO | NO |
Cells highlighted in yellow indicate differing values across parts. Always verify with official datasheets before substitution.
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Quick Links
Why Look for Alternatives?
Finding alternatives for MCP608-I/ST is essential for supply chain resilience. Component shortages, long lead times, and end-of-life notices can disrupt production schedules. Having verified alternative parts ensures your designs remain manufacturable.
When evaluating MCP608-I/ST replacements, consider key parameters such as package compatibility, electrical specifications, and operating temperature range. Our engineering team can help verify pin-to-pin compatibility for your specific application.
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FAQ
What is equivalent to MCP608-I/ST?
Known equivalents for MCP608-I/ST include MCP608-I/SN. Contact FindMyChip for a full compatibility analysis for your specific application.
Can I use a different manufacturer's part instead of MCP608-I/ST?
In many cases, yes. Cross-manufacturer alternatives exist for most standard components. However, always verify pin compatibility, electrical specs, and package dimensions before substituting in production.
How do I verify MCP608-I/ST alternatives?
Compare the datasheet specifications including pinout, voltage ratings, timing parameters, and package dimensions. FindMyChip's engineering team can help with compatibility verification — submit an RFQ to get started.