MCP607-I/ST Microchip Integrated Circuit (Small Outline Packages) In Stock
MCP607-I/ST is a integrated circuit for board-level control by Microchip. Key specs: SOIC package, 8 pins, -40°C to 85°C. From inquiry pricing, in stock with worldwide shipping.
- Manufacturer
- Microchip
- Package
- Small Outline Packages
- Pin Count
- 8
- Lifecycle
- ACTIVE
- Datasheet
- MCP607-I/ST Datasheet PDF
- Category
- Integrated Circuit
- Price
- From $0.9580(MOQ 1)
- Temp Range
- -40.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- Microchip integrated circuit for board-level control selected for SOIC package requirements
- Key MCP607-I/ST configuration supports 8 pins matching and approved sourcing
- -40°C to 85°C detail helps buyers compare alternates and reduce procurement risk
- Suitable for maintenance, prototype, and production builds that require exact manufacturer part-number traceability
Applications
MCP607-I/ST is used in industrial electronics, embedded systems, communications hardware, and repair programs that need exact component traceability. It is suited for buyers validating replacements against the original BOM, datasheet limits, package fit, and lifecycle status.
Specifications
| Pbfree Code | Yes |
| Manufacturer Package Code | TSSOP-8 |
| Factory Lead Time | 6Weeks |
| YTEOL | 8 |
| Amplifier Type | OPERATIONAL AMPLIFIER |
| Architecture | VOLTAGE-FEEDBACK |
| Average Bias Current-Max (IIB) | 0.00008 µA |
| Common-mode Reject Ratio-Min | 75dB |
| Common-mode Reject Ratio-Nom | 91dB |
| Frequency Compensation | YES |
| Input Offset Voltage-Max | 250 µV |
| JESD-30 Code | R-PDSO-G8 |
| JESD-609 Code | e3 |
| Low-Bias | YES |
| Low-Offset | YES |
| Micropower | YES |
| Number of Functions | 2 |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | TSSOP8,.25 |
| Package Shape | RECTANGULAR |
| Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| Packing Method | TUBE |
| Peak Reflow Temperature (Cel) | 260 |
| Power | NO |
| Programmable Power | NO |
| Qualification Status | Not Qualified |
| Screening Level | TS 16949 |
| Slew Rate-Nom | 0.08V/us |
| Supply Current-Max | 0.05mA |
| Supply Voltage Limit-Max | 7V |
| Supply Voltage-Nom (Vsup) | 5V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | Matte Tin (Sn) |
| Terminal Form | GULL WING |
| Terminal Pitch | 0.65mm |
| Terminal Position | DUAL |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Unity Gain BW-Nom | 155 |
| Voltage Gain-Min | 100000 |
| Wideband | NO |
| Package | Small Outline Packages |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 1 |
| ECCN | EAR99 |
| HTS Code | 8542.33.00.01 |
| Country of Origin | Malaysia, Philippines, Thailand |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
Which designs are a good fit for MCP607-I/ST?
MCP607-I/ST fits designs that need a integrated circuit for board-level control with 8 pins. Buyers should compare the manufacturer part number, electrical role, and lifecycle before approving production use.
How should buyers validate MCP607-I/ST before a production order?
For package or assembly planning, verify -40°C to 85°C against the existing footprint, sourcing suffix, and approved vendor list. That keeps purchasing aligned with engineering requirements.
When is MCP607-I/ST suitable as a replacement candidate?
Use MCP607-I/ST as a replacement candidate only after confirming datasheet limits, compliance, and application fit, including 25uA. This reduces requalification risk.
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| Qty. | Unit Price | Ext. Price |
|---|---|---|
| 1+ | $1.3400 | $1.34 |
| 25+ | $1.1000 | $27.50 |
| 100+ | $0.9580 | $95.80 |
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