MCP2562T-H/SN Microchip Integrated Circuit (Small Outline Packages) In Stock
The MCP2562T-H/SN is a high-speed CAN bus transceiver from Microchip supporting data rates up to 1 Mbps in an 8-pin SOIC package. It provides differential bus drive and reception with robust EMI performance for automotive and industrial CAN networks. Available in tape-and-reel format for volume manufacturing.
- Manufacturer
- Microchip
- Package
- Small Outline Packages
- Pin Count
- 8
- Lifecycle
- NOT RECOMMENDED
- Datasheet
- MCP2562T-H/SN Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 150.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- Supports CAN bus data rates up to 1 Mbps, enabling high-speed communication in time-critical automotive and industrial networks
- High ESD protection and EMI-optimized differential output reduce system-level filtering requirements
- Low-power standby mode reduces quiescent current, extending battery life in vehicle and remote sensor nodes
Applications
The MCP2562T-H/SN is designed for use in automotive body control modules, engine control units, and industrial automation equipment requiring robust CAN 2.0 communication up to 1 Mbps. It serves as the physical layer interface between a CAN controller and the two-wire differential bus, ensuring reliable data transmission in electrically noisy environments. This transceiver is also suitable for building automation networks, motor drive systems, and off-highway vehicle platforms where CAN connectivity is mandated.
Specifications
| Manufacturer Package Code | SOIC-8 |
| Factory Lead Time | 6Weeks |
| YTEOL | 3 |
| Data Rate | 1000Mbps |
| JESD-30 Code | R-PDSO-G8 |
| JESD-609 Code | e3 |
| Number of Functions | 1 |
| Number of Transceivers | 1 |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | SOP8,.25 |
| Package Shape | RECTANGULAR |
| Package Style | SMALL OUTLINE |
| Peak Reflow Temperature (Cel) | 260 |
| Screening Level | TS 16949 |
| Supply Current-Max | 70mA |
| Supply Voltage-Nom | 5V |
| Surface Mount | YES |
| Telecom IC Type | CAN TRANSCEIVER |
| Temperature Grade | AUTOMOTIVE |
| Terminal Finish | Matte Tin (Sn) |
| Terminal Form | GULL WING |
| Terminal Pitch | 1.27mm |
| Terminal Position | DUAL |
| Package | Small Outline Packages |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 1 |
| HTS Code | 8542.39.00.01 |
| Country of Origin | Thailand |
Alternate & Equivalent Parts
Compatible alternatives and drop-in replacements for MCP2562T-H/SN:
Frequently Asked Questions
What maximum CAN bus data rate does the MCP2562T-H/SN support?
The MCP2562T-H/SN supports CAN bus data rates up to 1 Mbps (1000 kbps), which satisfies the requirements of both Classical CAN (ISO 11898-2) and high-speed industrial CAN networks. This rate allows transmission of a standard 8-byte CAN frame in approximately 125 µs, supporting real-time control loops in automotive and industrial systems.
Which automotive and industrial systems benefit most from the MCP2562T-H/SN CAN transceiver?
The MCP2562T-H/SN is well suited for automotive body control modules, powertrain ECUs, and ADAS sensor nodes operating on 12 V CAN networks. In industrial automation, it supports PLCs, servo drives, and machine vision systems connected over a 2-wire CAN bus at distances up to 40 m at 1 Mbps, or up to 1 km at lower speeds.
How does the MCP2562T-H/SN compare to the standard MCP2562 when specifying for high-temperature designs?
The -H suffix variant of the MCP2562T extends the operating temperature range to 150°C, compared to the standard 125°C limit of the MCP2562. This makes the MCP2562T-H/SN suitable for underhood automotive applications and industrial environments where junction temperatures consistently exceed 125°C during operation.
What SOIC package dimensions does the MCP2562T-H/SN use and how does this affect PCB routing?
The MCP2562T-H/SN is housed in an 8-pin SOIC package with a body height of 3.90 mm and a standard 1.27 mm pin pitch, occupying approximately 4.9 mm x 3.9 mm of PCB footprint. The standard SOIC-8 outline is compatible with common EDA library footprints and supports hand-soldering rework in addition to automated SMT assembly.
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