MCP25025-I/SL Microchip Integrated Circuit (Small Outline Packages) In Stock
The MCP25025-I/SL is a Microchip 8-bit CAN bus I/O expander in a 14-pin SOIC package. It communicates via SPI and provides 8 general-purpose I/O pins with interrupt capability, extending microcontroller I/O over a CAN network for industrial and automotive control applications.
- Manufacturer
- Microchip
- Package
- Small Outline Packages
- Pin Count
- 14
- Lifecycle
- NOT RECOMMENDED
- Datasheet
- MCP25025-I/SL Datasheet PDF
- Category
- Integrated Circuit
- Price
- From $2.9900(MOQ 1)
- Temp Range
- -40.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 8-bit SPI-controlled I/O expansion with interrupt output simplifies GPIO extension over existing SPI buses
- CAN bus interface compliance enables robust communication in electrically noisy automotive and industrial environments
- 14-pin SOIC package with 0.15-inch body width suits compact PCB layouts with standard reflow soldering
- 3.3 V to 5 V supply range with RoHS-compliant packaging supports mixed-voltage embedded system designs
Applications
The MCP25025-I/SL is used in automotive body control modules and industrial PLCs where additional I/O channels must be distributed over a CAN network without adding dedicated microcontrollers. Its SPI interface allows a host MCU to read and write 8 remote digital I/O lines simultaneously while the on-chip interrupt output signals state changes without polling, reducing CPU overhead. Designers of factory automation panels, smart lighting controllers, and vehicle door modules rely on this device to extend digital control lines across noisy 12 V or 24 V environments.
Specifications
| Pbfree Code | Yes |
| Manufacturer Package Code | SOIC-14 |
| Factory Lead Time | 7Weeks |
| YTEOL | 3 |
| JESD-30 Code | R-PDSO-G14 |
| JESD-609 Code | e3 |
| Number of Bits | 8 |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | SOP14,.24 |
| Package Shape | RECTANGULAR |
| Package Style | SMALL OUTLINE |
| Qualification Status | Not Qualified |
| Screening Level | TS 16949 |
| Supply Voltage-Max | 5.5V |
| Supply Voltage-Min | 2.7V |
| Supply Voltage-Nom | 5V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | Matte Tin (Sn) |
| Terminal Form | GULL WING |
| Terminal Pitch | 1.27mm |
| Terminal Position | DUAL |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |
| Package | Small Outline Packages |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 1 |
| ECCN | EAR99 |
| HTS Code | 8542.39.00.01 |
| Country of Origin | Thailand |
Alternate & Equivalent Parts
Compatible alternatives and drop-in replacements for MCP25025-I/SL:
Frequently Asked Questions
How many I/O pins does MCP25025-I/SL expose, and what logic voltage levels are supported?
The MCP25025-I/SL provides 8 general-purpose I/O pins configurable as inputs or outputs. It operates from a 2.7 V to 5.5 V supply, meaning its I/O logic thresholds scale accordingly — approximately 0.8 V low and 2.0 V high at 3.3 V supply — making it compatible with both 3.3 V and 5 V MCU GPIO outputs without level-shifting circuitry.
In a CAN-based industrial network, how does MCP25025-I/SL reduce microcontroller pin count compared to direct GPIO expansion?
Rather than consuming 8 dedicated MCU pins for remote I/O, MCP25025-I/SL routes those 8 channels over a 4-wire SPI bus shared with other peripherals. A single interrupt line notifies the host MCU of any pin change, so a 32-pin MCU can manage 8 additional remote I/O channels while freeing at least 7 GPIO lines for other functions such as UART, PWM, or analog inputs.
What is the factory lead time for MCP25025-I/SL and how should designers plan for procurement?
The MCP25025-I/SL currently carries a 7-week factory lead time. Design teams targeting volume production builds should issue purchase orders at least 10 weeks before their PCB assembly date to allow 3 weeks of buffer for shipping and incoming inspection. For prototype quantities, stocking distributors typically carry small quantities available for same-week delivery.
How does the SOIC-14 package of MCP25025-I/SL compare to a TSSOP-14 in a space-constrained design?
The SOIC-14 package used by MCP25025-I/SL measures approximately 8.65 mm × 6.0 mm with 1.27 mm lead pitch, while a TSSOP-14 occupies roughly 5.0 mm × 4.4 mm at 0.65 mm pitch. If board area is critical and fine-pitch solder capability is available, a TSSOP variant would save approximately 40% footprint area; however, the SOIC-14 tolerates hand soldering and standard 0.8 mm solder masks with lower assembly cost.
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