MCP23S17-E/ML Microchip Integrated Circuit (Quad Flat No-Lead) In Stock
Microchip MCP23S17-E/ML is a 16-bit SPI I/O expander providing 16 additional GPIO pins via a 10 MHz SPI interface. It operates at 1.8 V to 5.5 V and is housed in a compact 28-pin QFN package.
- Manufacturer
- Microchip
- Package
- Quad Flat No-Lead
- Pin Count
- 28
- Lifecycle
- ACTIVE
- Datasheet
- MCP23S17-E/ML Datasheet PDF
- Category
- Integrated Circuit
- Price
- From $1.5042(MOQ 1)
- Temp Range
- -40.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 16-bit GPIO expander over SPI at up to 10 MHz, adding 16 I/O lines to any microcontroller with minimal pin usage
- Wide 1.8 V to 5.5 V supply range with 3-wire SPI interface enabling compatibility with low-voltage and 5 V systems
- Cascadable up to 8 devices on a single SPI bus via hardware address pins, scaling to 128 additional I/O pins
- 28-pin QFN package with exposed pad supports compact board layouts with efficient heat sinking
Applications
The MCP23S17-E/ML is used to expand the GPIO capacity of microcontrollers in applications such as industrial control panels, keyboard matrix scanning, LED array driving, and relay bank control. Its 10 MHz SPI interface allows fast I/O updates while consuming only 3 MCU pins for CS, MOSI, and SCK, freeing other peripherals for dedicated functions. The ability to cascade 8 devices on one bus makes it ideal for large-scale I/O expansion in PLCs, HMI panels, and embedded test fixtures.
Specifications
| Pbfree Code | Yes |
| Manufacturer Package Code | VQFN-28 |
| Factory Lead Time | 7Weeks |
| YTEOL | 8 |
| CPU Family | MCP23X17 |
| Clock Frequency-Max | 10MHz |
| JESD-30 Code | S-PQCC-N28 |
| JESD-609 Code | e3 |
| Number of Bits | 16 |
| Number of I/O Lines | 16 |
| Number of Ports | 2 |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | LCC28,.24SQ,25 |
| Package Shape | SQUARE |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| Peak Reflow Temperature (Cel) | 260 |
| Qualification Status | Not Qualified |
| Supply Current-Max | 1mA |
| Supply Voltage-Max | 5.5V |
| Supply Voltage-Min | 4.5V |
| Supply Voltage-Nom | 5V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | AUTOMOTIVE |
| Terminal Finish | Matte Tin (Sn) |
| Terminal Form | NO LEAD |
| Terminal Pitch | 0.65mm |
| Terminal Position | QUAD |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| uPs/uCs/Peripheral ICs Type | PARALLEL IO PORT, GENERAL PURPOSE |
| Package | Quad Flat No-Lead |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 1 |
| ECCN | EAR99 |
| HTS Code | 8542.39.00.01 |
| Country of Origin | Philippines, Thailand |
Alternate & Equivalent Parts
Compatible alternatives and drop-in replacements for MCP23S17-E/ML:
Frequently Asked Questions
How many GPIO pins does the MCP23S17-E/ML add, and what interface does it use?
The MCP23S17-E/ML adds 16 GPIO pins through a 3-wire SPI interface operating at up to 10 MHz. This allows a microcontroller with as few as 3 dedicated SPI pins to gain a full 16-bit I/O port, which can be configured as inputs, outputs, or mixed in 8-bit bank groups.
Can multiple MCP23S17-E/ML devices share a single SPI bus, and how many can be connected?
Yes, up to 8 MCP23S17-E/ML devices can share a single SPI bus by using the 3 hardware address pins (A0, A1, A2) to assign unique addresses. This cascading capability extends I/O expansion to 128 additional pins at 10 MHz SPI clock, making it practical for industrial panels with dozens of inputs and relay outputs.
What supply voltage range does the MCP23S17-E/ML support for mixed-voltage system integration?
The MCP23S17-E/ML operates from a supply range of 1.8 V to 5.5 V, covering both 3.3 V and 5 V logic domains. This wide range allows direct interfacing with modern low-voltage microcontrollers as well as legacy 5 V systems without level-shifting circuitry, reducing design complexity and BOM cost.
How does the QFN-28 package of the MCP23S17-E/ML compare to the SOIC-28 package variant?
The MCP23S17-E/ML in the 28-pin QFN (VQFN-28) package occupies significantly less PCB area than the SOIC-28 variant, with a footprint of approximately 6 mm x 6 mm versus the SOIC's elongated profile. The QFN also offers better thermal performance due to the exposed bottom pad, making it the preferred choice for compact, thermally demanding I/O expansion applications.
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| Qty. | Unit Price | Ext. Price |
|---|---|---|
| 1+ | $1.5042 | $1.50 |
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