MCP2150-I/P Microchip Integrated Circuit (Dual-In-Line Packages) In Stock
Microchip MCP2150-I/P is an IrDA standard serial infrared controller that handles all IrDA protocol layers from the physical layer to the IrDA Link Access Protocol (IRLAPHDL) in a single 18-pin PDIP IC. It interfaces via UART to a host microcontroller and manages 115.2 kbps IrDA communications, simplifying wireless data exchange in handheld and embedded devices.
- Manufacturer
- Microchip
- Package
- Dual-In-Line Packages
- Pin Count
- 18
- Lifecycle
- ACTIVE
- Datasheet
- MCP2150-I/P Datasheet PDF
- Category
- Integrated Circuit
- Price
- From $3.7100(MOQ 1)
- Temp Range
- -40.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- Full IrDA SIR (Serial Infrared) protocol stack up to 115.2 kbps in hardware
- UART host interface for easy integration with any microcontroller serial port
- Handles IrDA IRLAP framing, CRC, and collision detection automatically
- On-chip oscillator support reduces external component count
- 18-pin PDIP package simplifies through-hole prototyping and socketed assembly
- 3.3 V and 5 V compatible signaling for flexible host interface connections
Applications
The MCP2150-I/P is used to add IrDA wireless data transfer capability to handheld instruments, PDAs, and embedded data loggers without requiring a full software IrDA stack on the host MCU. It is also employed in point-of-sale terminals, medical measurement devices, and industrial handheld scanners where short-range, cable-free communication at up to 115.2 kbps is needed.
Specifications
| Pbfree Code | Yes |
| Manufacturer Package Code | PDIP-18 |
| Factory Lead Time | 6Weeks |
| YTEOL | 8 |
| JESD-30 Code | R-PDIP-T18 |
| JESD-609 Code | e3 |
| Number of Functions | 1 |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | DIP18,.3 |
| Package Shape | RECTANGULAR |
| Package Style | IN-LINE |
| Qualification Status | Not Qualified |
| Screening Level | TS 16949 |
| Supply Voltage-Nom | 3.3V |
| Surface Mount | NO |
| Technology | CMOS |
| Telecom IC Type | TELECOM CIRCUIT |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | Matte Tin (Sn) |
| Terminal Form | THROUGH-HOLE |
| Terminal Pitch | 2.54mm |
| Terminal Position | DUAL |
| Package | Dual-In-Line Packages |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8542.39.00.01 |
| Country of Origin | Thailand |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What maximum data rate does MCP2150-I/P support for IrDA Serial Infrared communication?
The MCP2150-I/P implements the IrDA SIR physical layer supporting data rates up to 115.2 kbps. This speed is sufficient for transferring small data packets, configuration files, and measurement records between handheld devices and base stations in typical IrDA short-range link applications.
How does MCP2150-I/P simplify IrDA integration compared to implementing the IrDA stack in firmware on the host MCU?
The MCP2150-I/P offloads all IrDA IRLAP framing, CRC generation, and protocol negotiation to dedicated on-chip hardware, freeing the host MCU from implementing a complex multi-layer stack. The host only sends and receives plain UART data at up to 115.2 kbps, typically reducing firmware development time by several weeks.
Is MCP2150-I/P compatible with 3.3 V microcontrollers, or does it require a 5 V interface level?
The MCP2150-I/P supports both 3.3 V and 5 V logic levels on its host UART interface pins, making it compatible with modern low-voltage 3.3 V MCUs as well as legacy 5 V systems. Designers should confirm the exact VIH and VIL thresholds in the datasheet when operating at the boundary of these voltage levels.
What is the lead time for MCP2150-I/P, and should designers plan for IrDA alternative sourcing given its legacy status?
Microchip lists approximately 6 weeks factory lead time for MCP2150-I/P. The device has an 8-year YTEOL indicator, so buyers maintaining designs with IrDA should consider building buffer stock or evaluate Bluetooth Low Energy modules as a longer-term wireless replacement, since IrDA adoption has declined in new consumer and industrial designs.
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