MCP2122-E/P Microchip Integrated Circuit (Dual-In-Line Packages) In Stock
The MCP2122-E/P is an IrDA infrared encoder/decoder IC from Microchip that converts asynchronous serial UART data to the IrDA SIR protocol at up to 115.2 kbps. It operates from a 5V supply in a compact 8-pin PDIP package. Suitable for wireless data transfer in remote controls, handheld devices, and point-of-sale terminals.
- Manufacturer
- Microchip
- Package
- Dual-In-Line Packages
- Pin Count
- 8
- Lifecycle
- ACTIVE
- Datasheet
- MCP2122-E/P Datasheet PDF
- Category
- Integrated Circuit
- Price
- From $0.7600(MOQ 1)
- Temp Range
- -40.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- IrDA SIR encoder/decoder supporting data rates up to 115.2 kbps
- Operates from a single 5V supply with low standby current
- Direct UART interface requiring no software protocol translation
- 8-pin PDIP package enabling straightforward prototyping and breadboarding
- Compatible with standard IR LED and photodiode front-ends
- Meets IrDA 1.0 physical layer specification
Applications
The MCP2122-E/P is designed for systems requiring short-range wireless data transfer compliant with the IrDA SIR standard, such as point-of-sale terminals, handheld industrial scanners, and embedded control panels. Its direct UART interface allows any microcontroller with a standard serial port to add IrDA connectivity without firmware changes. The through-hole 8-pin PDIP package makes it accessible for prototyping, educational projects, and low-volume production runs.
Specifications
| Pbfree Code | Yes |
| Manufacturer Package Code | PDIP-8 |
| Factory Lead Time | 8Weeks |
| YTEOL | 8 |
| JESD-30 Code | R-PDIP-T8 |
| JESD-609 Code | e3 |
| Number of Functions | 1 |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | DIP8,.3 |
| Package Shape | RECTANGULAR |
| Package Style | IN-LINE |
| Qualification Status | Not Qualified |
| Supply Current-Max | 0.001mA |
| Supply Voltage-Nom | 5V |
| Surface Mount | NO |
| Technology | CMOS |
| Telecom IC Type | TELECOM CIRCUIT |
| Temperature Grade | AUTOMOTIVE |
| Terminal Finish | Matte Tin (Sn) |
| Terminal Form | THROUGH-HOLE |
| Terminal Pitch | 2.54mm |
| Terminal Position | DUAL |
| Package | Dual-In-Line Packages |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8542.39.00.01 |
| Country of Origin | Thailand |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What maximum data rate does the MCP2122-E/P support over its IrDA link?
The MCP2122-E/P supports IrDA SIR data rates up to 115.2 kbps, which is sufficient for transferring configuration files, short data logs, or firmware parameters between a host and an embedded device within a 1-meter range without any cable connection.
How does the MCP2122-E/P interface with a microcontroller's UART peripheral?
The device connects directly to a standard 3-wire UART (TX, RX, ground) operating at 5V logic levels, requiring no firmware changes or software protocol stack. The MCP2122-E/P handles all IrDA pulse encoding and decoding internally, making integration straightforward for any 8-bit or 32-bit microcontroller with a hardware UART.
Which applications benefit most from using the MCP2122-E/P instead of a Bluetooth or Wi-Fi module?
Applications needing deterministic point-to-point communication within 1 meter, such as medical device programming, retail POS terminals, or industrial calibration tools, benefit from IrDA's line-of-sight security model. The MCP2122-E/P costs significantly less than a Bluetooth module and requires only 5V power with no pairing or radio certification overhead.
Does the 8-pin PDIP package of the MCP2122-E/P support hand-soldering for prototype builds?
Yes, the 8-pin PDIP package with 0.3-inch row spacing is fully hand-solderable on standard perfboard or 2.54 mm pitch PCB pads. This through-hole form factor suits prototyping, classroom labs, and low-volume production where SMD assembly equipment is unavailable, while keeping the total BOM footprint under 50 mm² board area.
Related Guides
How to Choose a BAS70 Schottky Diode for Signal Clamping: Selection Guide
A practical BAS70KFILM and BAS70-family Schottky diode selection guide for signal clamping, RF detection, leakage, and topology choices.
Jul 4, 2026
AMC1202DWVR Design Guide for Isolated Current Sensing
Practical AMC1202DWVR design guide covering shunt sizing, isolation layout, input filtering, ADC scaling, and sourcing choices.
Jul 4, 2026
1206 100 uF MLCC Design Guide for Compact Bulk Decoupling
Design guidance for applying CL31A107MQHNNNE and related 1206 MLCCs in compact bulk decoupling networks.
Jul 3, 2026
0402 10 nF MLCC Design Guide for High-Speed Decoupling
Practical design guidance for using CL05B103KB5NNNC and related 0402 MLCCs in high-speed decoupling networks.
Jul 3, 2026
Why Buy from FindMyChip
About Microchip
Microchip is a leading electronic component manufacturer. FindMyChip sources Microchip ICs directly from authorized China distributors, offering competitive pricing and reliable stock.
| Qty. | Unit Price | Ext. Price |
|---|---|---|
| 1+ | $1.0600 | $1.06 |
| 25+ | $0.8800 | $22.00 |
| 100+ | $0.7900 | $79.00 |
| 1000+ | $0.7600 | $760.00 |
In Stock · 24h Response · Worldwide Shipping
Response within 24 hours · Worldwide shipping
“We've been using FindMyChip for 2 years. Pricing is consistently 20-30% below Mouser/DigiKey for volume orders.”