MCP2022-330E/SL Microchip Integrated Circuit (Small Outline Packages) In Stock
MCP2022-330E/SL is a single-channel LIN bus transceiver from Microchip with integrated 3.3 V LDO regulator and protected bus interface in a SOIC-14 package. It features JESD-609 e3 lead-free compliance and supports automotive and industrial LIN 2.x network communication. Available from stock worldwide with fast shipping.
- Manufacturer
- Microchip
- Package
- Small Outline Packages
- Pin Count
- 14
- Lifecycle
- NOT RECOMMENDED
- Datasheet
- MCP2022-330E/SL Datasheet PDF
- Category
- Integrated Circuit
- Price
- From $1.4600(MOQ 1)
- Temp Range
- -40.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- Integrated 3.3 V LDO voltage regulator eliminates external power supply components in LIN node designs
- Single LIN bus transceiver with robust bus protection against short circuits, overvoltage, and reverse polarity
- JESD-609 e3 lead-free, RoHS-compliant SOIC-14 package suitable for automotive and industrial temperature ranges
- Supports LIN 2.x protocol for in-vehicle networks and industrial sensor communication nodes
Applications
The MCP2022-330E/SL is used in automotive body electronics and industrial sensor nodes requiring a compact LIN transceiver with an on-chip 3.3 V supply regulator. Typical applications include door modules, seat control units, HVAC actuator nodes, and lighting cluster controllers connected to a LIN 2.x master. Its integrated LDO simplifies PCB layout by reducing the bill of materials in cost-sensitive automotive sub-node designs.
Specifications
| Manufacturer Package Code | SOIC-14 |
| YTEOL | 3 |
| JESD-30 Code | R-PDSO-G14 |
| JESD-609 Code | e3 |
| Number of Functions | 1 |
| Number of Transceivers | 1 |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | SOP14,.25 |
| Package Shape | RECTANGULAR |
| Package Style | SMALL OUTLINE |
| Screening Level | TS 16949 |
| Supply Voltage-Nom | 12V |
| Surface Mount | YES |
| Telecom IC Type | LIN TRANSCEIVER |
| Temperature Grade | AUTOMOTIVE |
| Terminal Finish | Matte Tin (Sn) |
| Terminal Form | GULL WING |
| Terminal Pitch | 1.27mm |
| Terminal Position | DUAL |
| Package | Small Outline Packages |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8542.39.00.01 |
| Country of Origin | Thailand |
Alternate & Equivalent Parts
Compatible alternatives and drop-in replacements for MCP2022-330E/SL:
Frequently Asked Questions
What integrated voltage regulator output does MCP2022-330E/SL provide for connected microcontrollers?
The MCP2022-330E/SL integrates a 3.3 V LDO linear voltage regulator, which can supply power directly to a co-located microcontroller or sensor on the same PCB. This eliminates the need for a discrete regulator and reduces the overall BOM cost and board area in LIN slave node designs for automotive and industrial applications.
Which LIN protocol versions does MCP2022-330E/SL support and how does it protect against bus faults?
MCP2022-330E/SL supports LIN 2.x protocol versions used in automotive in-vehicle networks operating at up to 20 kbps. The bus interface includes protection against short circuits to VBAT (up to 40 V), reverse polarity, and electrostatic discharge (ESD) events, ensuring reliable operation across the automotive temperature range of -40°C to 125°C.
For a compact automotive sensor node PCB, how does the SOIC-14 package of MCP2022-330E/SL simplify design?
The SOIC-14 package (3.90 mm body width) provides a standard through-reflow footprint that is easy to place and solder in automated SMT assembly lines. With 14 pins accommodating both the LIN transceiver and 3.3 V LDO regulator functions in one device, designers save at least 1 component and reduce board area versus using a discrete transceiver plus separate regulator in automotive door or seat control modules.
When would MCP2022-330E/SL be preferred over a standalone LIN transceiver without an integrated regulator?
MCP2022-330E/SL is preferred when a LIN slave node must be powered directly from the 12 V automotive bus with no separate 3.3 V rail available. Its built-in 3.3 V LDO can source sufficient current to power a small MCU and sensors, which reduces external component count by at least 2 to 3 parts and shrinks the PCB footprint in cost-sensitive, space-constrained body electronics modules.
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| Qty. | Unit Price | Ext. Price |
|---|---|---|
| 1+ | $1.8500 | $1.85 |
| 10+ | $1.7200 | $17.20 |
| 25+ | $1.6900 | $42.25 |
| 100+ | $1.6300 | $163.00 |
| 1000+ | $1.5900 | $1590.00 |
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