MC74LCX373DTG ON Semiconductor Integrated Circuit (Small Outline Packages) In Stock
IOFF Specification Guarantees High Impedance When VCC = 0V; Latchup Performance Exceeds 500mA; Near Zero Static Supply Current in All Three Logic States (10µA) Substantially Reduces System Power Requirements; LVTTL Compatible; 5V Tolerant Interface Capability With 5V TTL Logic; 24mA Balanced Output Sink and Source Capability; Designed for 2.3 to 3.6V VCC Operation; ESD Performance: Human Body Model >2000V; Machine Model >200V; LVCMOS Compatible; Supports Live Insertion and Withdrawal; Pb-Free Packages are A
- Manufacturer
- ON Semiconductor
- Package
- Small Outline Packages
- Pin Count
- 20
- Lifecycle
- ACTIVE
- Datasheet
- MC74LCX373DTG Datasheet PDF
- Category
- Integrated Circuit
- Price
- From $0.2400(MOQ 300)
- Temp Range
- -40.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Specifications
| Pbfree Code | Yes |
| Manufacturer Package Code | 9.48 |
| Factory Lead Time | 9Weeks |
| YTEOL | 6 |
| Family | LVC/LCX/Z |
| JESD-30 Code | R-PDSO-G20 |
| JESD-609 Code | e4 |
| Load Capacitance (CL) | 50pF |
| Logic IC Type | BUS DRIVER |
| Number of Bits | 8 |
| Number of Functions | 1 |
| Number of Ports | 2 |
| Output Characteristics | 3-STATE |
| Output Polarity | TRUE |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | TSSOP20,.25 |
| Package Shape | RECTANGULAR |
| Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| Packing Method | RAIL |
| Peak Reflow Temperature (Cel) | 260 |
| Prop. Delay@Nom-Sup | 8ns |
| Propagation Delay (tpd) | 10.5ns |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 3.6V |
| Supply Voltage-Min (Vsup) | 2V |
| Supply Voltage-Nom (Vsup) | 3.3V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | Nickel/Palladium/Gold (Ni/Pd/Au) |
| Terminal Form | GULL WING |
| Terminal Pitch | 0.65mm |
| Terminal Position | DUAL |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Package | Small Outline Packages |
Compliance & Regulatory
| RoHS Status | Compliant |
| Moisture Sensitivity Level | MSL 1 |
| HTS Code | 8542.39.00.60 |
| Country of Origin | Mainland China, Malaysia |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the price of MC74LCX373DTG?
MC74LCX373DTG is priced from $0.2400 USD depending on quantity. Submit an RFQ on FindMyChip for the best current pricing from authorized China distributors.
Is MC74LCX373DTG in stock?
MC74LCX373DTG is listed as in stock at FindMyChip, sourced from authorized distributors, and ships worldwide with typical 3-7 business day lead time. Submit an RFQ for current quantity pricing, MOQ, and confirmed availability.
Where can I buy MC74LCX373DTG?
You can buy MC74LCX373DTG from FindMyChip, a B2B electronic component platform sourcing from China distributors. We offer competitive pricing and low MOQ for MC74LCX373DTG from ON Semiconductor.
What is the datasheet for MC74LCX373DTG?
The official MC74LCX373DTG datasheet from ON Semiconductor contains full specifications including pin configuration, electrical characteristics, and application notes. Download it directly from the datasheet section above.
What package does MC74LCX373DTG come in?
MC74LCX373DTG is available in Small Outline Packages packaging. See the package diagram and pinout above for detailed dimensional information.
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About ON Semiconductor
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| Qty. | Unit Price | Ext. Price |
|---|---|---|
| 300+ | $0.2619 | $78.57 |
| 600+ | $0.2606 | $156.33 |
| 1200+ | $0.2400 | $288.00 |
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