MC68HC11E1CFNE3Alternatives & Equivalent Parts
About MC68HC11E1CFNE3
MC68HC11E1CFNE3 is a Integrated Circuit component manufactured by NXP. It comes in a Plastic Leaded Chip Carrier package. Below you'll find known alternative and equivalent parts that can serve as replacements in your design.
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Specification Comparison
| Parameter | MC68HC11E1CFNE3Source | MC68HC11E1CFNE2 | CL21B105KBFNNNF | SMBJ5.0CA | 08055F104KAT2A | CR0603-JW-220ELF | CRG0603F2K2 |
|---|---|---|---|---|---|---|---|
| Manufacturer | NXP | NXP | Samsung Electro-Mechanics | STMicroelectronics | AVX | Bourns | TE Connectivity |
| Package Type | Plastic Leaded Chip Carrier | Plastic Leaded Chip Carrier | Capacitor Chip Non-polarised | Other | Capacitor Chip Non-polarised | Resistor Chip | Resistor Chip |
| Pin Count | 52 | 52 | 2 | 2 | 2 | 2 | 2 |
| Temperature Range | -40.0°C ~ 85.0°C | -40.0°C ~ 85.0°C | -55.0°C ~ 125.0°C | -55.0°C ~ 150.0°C | -55.0°C ~ 150.0°C | -55.0°C ~ 155.0°C | -55.0°C ~ 155.0°C |
| Price | $20.5200 | $15.6000 | $0.0095 | $0.0122 | $0.0318 | $0.0011 | $0.0080 |
| Stock | In Stock | In Stock | In Stock | In Stock | In Stock | In Stock | In Stock |
| Lifecycle | OBSOLETE | OBSOLETE | ACTIVE | ACTIVE | ACTIVE | ACTIVE | ACTIVE |
| Electrical Parameters | |||||||
| Date Of Intro | 1988-01-01 | 1988-01-01 | — | — | — | — | — |
| YTEOL | 0 | 0 | 7 | 6.9 | 9 | 12 | 13 |
| Has ADC | YES | YES | — | — | — | — | — |
| Additional Feature | SEATED HT-CALCULATED | SEATED HT-CALCULATED | — | — | — | — | LASER TRIMMABLE |
| Address Bus Width | 16 | 16 | — | — | — | — | — |
| Bit Size | 8 | 8 | — | — | — | — | — |
| Boundary Scan | NO | NO | — | — | — | — | — |
| CPU Family | 6800 | 6800 | — | — | — | — | — |
| Clock Frequency-Max | 12 MHz | 8 MHz | — | — | — | — | — |
| DAC Channels | NO | NO | — | — | — | — | — |
| DMA Channels | NO | NO | — | — | — | — | — |
| External Data Bus Width | 8 | 8 | — | — | — | — | — |
| JESD-30 Code | S-PQCC-J52 | S-PQCC-J52 | — | R-PDSO-C2 | — | — | — |
| JESD-609 Code | e3 | e3 | e3 | e3 | e3 | e3 | e3 |
| Low Power Mode | YES | YES | — | — | — | — | — |
| Number of I/O Lines | 38 | 38 | — | — | — | — | — |
| On Chip Data RAM Width | 8 | 8 | — | — | — | — | — |
| On Chip Program ROM Width | 8 | 8 | — | — | — | — | — |
| PWM Channels | NO | NO | — | — | — | — | — |
| Package Body Material | PLASTIC/EPOXY | PLASTIC/EPOXY | — | PLASTIC/EPOXY | — | — | — |
| Package Equivalence Code | LDCC52,.8SQ | LDCC52,.8SQ | — | — | — | — | — |
| Package Shape | SQUARE | SQUARE | RECTANGULAR PACKAGE | RECTANGULAR | RECTANGULAR PACKAGE | — | RECTANGULAR PACKAGE |
| Package Style | CHIP CARRIER | CHIP CARRIER | SMT | SMALL OUTLINE | SMT | SMT | SMT |
| Peak Reflow Temperature (Cel) | 260 | 260 | — | 260 | — | — | — |
| RAM (bytes) | 512 | 512 | — | — | — | — | — |
| ROM (words) | 512 | 512 | — | — | — | — | — |
| ROM Programmability | OTPROM | OTPROM | — | — | — | — | — |
| Speed | 3 MHz | 2 MHz | — | — | — | — | — |
| Supply Current-Max | 35 mA | 27 mA | — | — | — | — | — |
| Supply Voltage-Max | 5.5 V | 5.5 V | — | — | — | — | — |
| Supply Voltage-Min | 5 V | 5 V | — | — | — | — | — |
| Supply Voltage-Nom | 5 V | 5 V | — | — | — | — | — |
| Surface Mount | YES | YES | YES | YES | YES | YES | YES |
| Technology | HCMOS | HCMOS | — | AVALANCHE | — | METAL GLAZE/THICK FILM | METAL GLAZE/THICK FILM |
| Temperature Grade | INDUSTRIAL | INDUSTRIAL | — | — | — | — | — |
| Terminal Finish | Tin (Sn) | Tin (Sn) | Matte Tin (Sn) - with Nickel (Ni) barrier | Matte Tin (Sn) - annealed | MATTE TIN OVER NICKEL | TIN OVER NICKEL | Matte Tin (Sn) - with Nickel (Ni) barrier |
| Terminal Form | J BEND | J BEND | — | C BEND | — | — | — |
| Terminal Pitch | 1.27 mm | 1.27 mm | — | — | — | — | — |
| Terminal Position | QUAD | QUAD | — | DUAL | — | — | — |
| Time@Peak Reflow Temperature-Max (s) | 40 | 40 | — | 30 | — | — | — |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER | MICROCONTROLLER | — | — | — | — | — |
| Pbfree Code | — | — | Yes | — | Yes | Yes | Yes |
| Reach Compliance Code | — | — | Compliant | Not Compliant | Compliant | Compliant | Compliant |
| Factory Lead Time | — | — | 20 Weeks | — | 12 Weeks | 12 Weeks | 11 Weeks, 1 Day |
| Capacitance | — | — | 1 µF | — | 0.1 µF | — | — |
| Capacitor Type | — | — | CERAMIC CAPACITOR | — | CERAMIC CAPACITOR | — | — |
| Dielectric Material | — | — | CERAMIC | — | CERAMIC | — | — |
| Height | — | — | 1.35 mm | — | 1.4 mm | — | — |
| Mounting Feature | — | — | SURFACE MOUNT | — | SURFACE MOUNT | SURFACE MOUNT | SURFACE MOUNT |
| Multilayer | — | — | Yes | — | Yes | — | — |
| Negative Tolerance | — | — | 10% | — | 10% | — | — |
| Packing Method | — | — | TR, EMBOSSED PLASTIC, 13 INCH | — | TR, EMBOSSED, 7 INCH | TR, PAPER, 7 INCH | TR |
| Positive Tolerance | — | — | 10% | — | 10% | — | — |
| Rated (DC) Voltage (URdc) | — | — | 50 V | — | 50 V | — | — |
| Size Code | — | — | 0805 | — | 0805 | 0603 | 0603 |
| Temperature Characteristics Code | — | — | X7R | — | X8R | — | — |
| Temperature Coefficient | — | — | 15% ppm/°C | — | 15% ppm/°C | 200 ppm/°C | 100 ppm/°C |
| Terminal Shape | — | — | WRAPAROUND | — | WRAPAROUND | WRAPAROUND | WRAPAROUND |
| Breakdown Voltage-Min | — | — | — | 6.4 V | — | — | — |
| Breakdown Voltage-Nom | — | — | — | 6.74 V | — | — | — |
| Clamping Voltage-Max | — | — | — | 9.2 V | — | — | — |
| Configuration | — | — | — | SINGLE, 1 CHANNEL | — | — | — |
| Diode Element Material | — | — | — | SILICON | — | — | — |
| Diode Type | — | — | — | TRANS VOLTAGE SUPPRESSOR DIODE | — | — | — |
| JEDEC-95 Code | — | — | — | DO-214AA | — | — | — |
| Non-rep Peak Rev Power Dis-Max | — | — | — | 600 W | — | — | — |
| Number of Elements | — | — | — | 1 | — | — | — |
| Polarity | — | — | — | BIDIRECTIONAL | — | — | — |
| Reference Standard | — | — | — | IEC-61000-4-2, 4-4, 4-5; MIL-STD-750 | — | — | — |
| Rep Pk Reverse Voltage-Max | — | — | — | 5 V | — | — | — |
| Reverse Current-Max | — | — | — | 20 µA | — | — | — |
| Reverse Test Voltage | — | — | — | 5 V | — | — | — |
| ## SMBJ5.0CA Alternates Showing results | — | — | — | Image | — | — | — |
| Construction | — | — | — | — | — | Rectangular | Rectangular |
| Package Height | — | — | — | — | — | 0.45 mm | 0.45 mm |
| Package Length | — | — | — | — | — | 1.6 mm | 1.6 mm |
| Package Width | — | — | — | — | — | 0.8 mm | 0.8 mm |
| Rated Power Dissipation (P) | — | — | — | — | — | 0.1 W | 0.1 W |
| Rated Temperature | — | — | — | — | — | 70 °C | 70 °C |
| Resistance | — | — | — | — | — | 22 Ω | 2200 Ω |
| Resistor Type | — | — | — | — | — | FIXED RESISTOR | FIXED RESISTOR |
| Tolerance | — | — | — | — | — | 5% | 1% |
| Working Voltage | — | — | — | — | — | 75 V | 75 V |
| Physical Dimension | — | — | — | — | — | — | 1.6mm x .8mm x .45mm |
| Dimensions: Product Length 1.6 MM | — | — | — | — | — | — | Product Height .018 INCH |
| Product Height .45 MM | — | — | — | — | — | — | Product Width .031 INCH |
| Electrical Characteristics: Resistance Value 2.2K OHM | — | — | — | — | — | — | Operating Voltage 50 V |
| Passive Component Tolerance 1 PCT | — | — | — | — | — | — | Power Rating .1 WATT |
| Product Type Features: Element Type Thick Film | — | — | — | — | — | — | Package Size Code 0603 |
Cells highlighted in yellow indicate differing values across parts. Always verify with official datasheets before substitution.
Need pricing on these alternatives?
Get one quote covering all 6 alternatives for MC68HC11E1CFNE3 — response within 24 hours.
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Why Look for Alternatives?
Finding alternatives for MC68HC11E1CFNE3 is essential for supply chain resilience. Component shortages, long lead times, and end-of-life notices can disrupt production schedules. Having verified alternative parts ensures your designs remain manufacturable.
When evaluating MC68HC11E1CFNE3 replacements, consider key parameters such as package compatibility, electrical specifications, and operating temperature range. Our engineering team can help verify pin-to-pin compatibility for your specific application.
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FAQ
What is equivalent to MC68HC11E1CFNE3?
Known equivalents for MC68HC11E1CFNE3 include MC68HC11E1CFNE2, CL21B105KBFNNNF, SMBJ5.0CA. Contact FindMyChip for a full compatibility analysis for your specific application.
Can I use a different manufacturer's part instead of MC68HC11E1CFNE3?
In many cases, yes. Cross-manufacturer alternatives exist for most standard components. However, always verify pin compatibility, electrical specs, and package dimensions before substituting in production.
How do I verify MC68HC11E1CFNE3 alternatives?
Compare the datasheet specifications including pinout, voltage ratings, timing parameters, and package dimensions. FindMyChip's engineering team can help with compatibility verification — submit an RFQ to get started.