MC33164D-3GAlternatives & Equivalent Parts

About MC33164D-3G

MC33164D-3G is a Integrated Circuit component manufactured by ON Semiconductor. It comes in a Small Outline Packages package. Below you'll find known alternative and equivalent parts that can serve as replacements in your design.

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Specification Comparison

ParameterMC33164D-3GSourceNCP301LSN33T1GREF3112AIDBZTMCP795W10-I/SL640454-4LM2596T-ADJ12103C824JAT2A
ManufacturerON SemiconductorON SemiconductorTexas InstrumentsMicrochipTE ConnectivityTexas InstrumentsAVX
Package TypeSmall Outline PackagesSOT23 (5-Pin)OtherSmall Outline PackagesHeader, VerticalOther
Pin Count8531442
Temperature Range-40.0°C ~ 125.0°C-40.0°C ~ 125.0°C-40.0°C ~ 125.0°C-40.0°C ~ 85.0°C-55.0°C ~ 105.0°C-55.0°C ~ 125.0°C
Price$0.2650$0.1575$0.3970$0.6550$0.0600$0.3654$0.2335
StockIn StockIn StockIn StockIn StockIn StockIn StockIn Stock
LifecycleACTIVEOBSOLETEACTIVEACTIVEACTIVEACTIVEACTIVE
Electrical Parameters
Pbfree CodeYesYesYesYesYes
Manufacturer Package Code751-07483SOIC-14
Factory Lead Time20 Weeks4 Weeks7 Weeks12 Weeks
YTEOL5.59015149.16
Adjustable ThresholdNONO
Analog IC - Other TypeVOLTAGE SUPERVISOR/RESET ICVOLTAGE DETECTORTHREE TERMINAL VOLTAGE REFERENCE
JESD-30 CodeR-PDSO-G8R-PDSO-G5R-PDSO-G3R-PDSO-G14
JESD-609 Codee3e3e4e3e3
Number of Channels11
Number of Functions111
Package Body MaterialPLASTIC/EPOXYPLASTIC/EPOXYPLASTIC/EPOXYPLASTIC/EPOXY
Package Equivalence CodeSOP8,.25TSOP5/6,.11,37TO-236SOP14,.25
Package ShapeRECTANGULARRECTANGULARRECTANGULARRECTANGULARRECTANGULAR PACKAGE
Package StyleSMALL OUTLINESMALL OUTLINE, THIN PROFILE, SHRINK PITCHSMALL OUTLINE, THIN PROFILE, SHRINK PITCHSMALL OUTLINESMT
Peak Reflow Temperature (Cel)260260260260
Qualification StatusNot QualifiedNot QualifiedNot QualifiedNot Qualified
Supply Current-Max (Isup)0.04 mA0.0013 mA
Supply Voltage-Max (Vsup)10 V10 V5.5 V
Supply Voltage-Min (Vsup)1 V0.8 V1.8 V
Supply Voltage-Nom (Vsup)2.4 V1.5 V5 V
Surface MountYESYESYESYESYES
TechnologyBIPOLARCMOSCMOSCMOS
Temperature GradeAUTOMOTIVEAUTOMOTIVEAUTOMOTIVEINDUSTRIAL
Terminal FinishMatte Tin (Sn) - annealedMATTE TINNickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)Matte Tin (Sn)MATTE TIN OVER NICKEL
Terminal FormGULL WINGGULL WINGGULL WINGGULL WING
Terminal Pitch1.27 mm0.95 mm0.95 mm1.27 mm2.54 mm
Terminal PositionDUALDUALDUALDUAL
Threshold Voltage-Nom+2.7V+3.3V
Time@Peak Reflow Temperature-Max (s)30303040
Input Voltage-Max5.5 V
Input Voltage-Min1.8 V
Number of Outputs1
Output Current-Max0.01 A
Output Voltage-Max1.252 V
Output Voltage-Min1.247 V
Output Voltage-Nom1.25 V
Temp Coef of Voltage-Max20 ppm/°C
Trim/Adjustable OutputNO
Voltage Tolerance-Max0.2%
## REF3112AIDBZT Alternates Showing resultsImage
Clock Frequency-Max5 MHz
Information Access MethodSERIAL(SPI)
Interrupt CapabilityY
Supply Current-Max5 mA
Supply Voltage-Max3.6 V
Supply Voltage-Min2.5 V
Supply Voltage-Nom3 V
Time-MinSECONDS
VolatileNO
uPs/uCs/Peripheral ICs TypeTIMER, REAL TIME CLOCK
Reach Compliance CodeCompliantCompliant
Additional FeaturePOLARIZED
Body Breadth0.225 inch
Body Depth0.305 inch
Body Length0.5 inch
Connector TypeBOARD CONNECTOR
Contact Finish MatingNOT APPLICABLE
Contact GenderMALE
Contact MaterialNOT APPLICABLE
Contact PatternRECTANGULAR
Contact Resistance6 mΩ
Contact StyleSQ PIN-SKT
DIN ConformanceNO
EMI ShieldedNO
Empty ShellYES
Filter FeatureNO
IEC ConformanceNO
Insertion Force-Max8.896 N
Insulation Resistance5000000000 Ω
Insulator ColorNATURAL
Insulator MaterialGLASS FILLED POLYESTER
MIL ConformanceNO
Mains Connector Rating5A
Mating Contact Pitch0.1 inch
Mating InformationMULTIPLE MATING PARTS AVAILABLE
Mixed ContactsNO
Mounting Option 1LOCKING
Mounting StyleSTRAIGHT
Mounting TypeBOARD
Number Of ConnectorsONE
Number Of PCB Rows1
Number of Ports1
Number of Rows Loaded1
OptionGENERAL PURPOSE
PCB Contact PatternRECTANGULAR
Panel MountNO
Plating Thickness150u inch
Polarization KeyPOLARIZED
Rated Current (Signal)5 A
Reference StandardCSA, LR, U
Terminal Length0.14 inch
Termination TypeSOLDER
Total Number of Contacts4
UL Flammability Code94V-0
Withdrawl Force-Min3.614 N
Configuration Features: PCB Mount Orientation VerticalNumber of Rows 1
Contact Features: Contact Mating Area Plating Material TinPCB Contact Termination Area Plating Material Thickness 150 MICIN
Contact Mating Area Plating Material Thickness 3.81 MICMContact Mating Area Plating Material Thickness 150 MICIN
Capacitance0.82 µF
Capacitor TypeCERAMIC CAPACITOR
Dielectric MaterialCERAMIC
Height1.52 mm
Mounting FeatureSURFACE MOUNT
MultilayerYes
Negative Tolerance5%
Packing MethodTR, EMBOSSED, 7 INCH
Positive Tolerance5%
Rated (DC) Voltage (URdc)25 V
Size Code1210
Temperature Characteristics CodeX7R
Temperature Coefficient15% ppm/°C
Terminal ShapeWRAPAROUND

Cells highlighted in yellow indicate differing values across parts. Always verify with official datasheets before substitution.

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Get one quote covering all 6 alternatives for MC33164D-3G — response within 24 hours.

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Why Look for Alternatives?

Finding alternatives for MC33164D-3G is essential for supply chain resilience. Component shortages, long lead times, and end-of-life notices can disrupt production schedules. Having verified alternative parts ensures your designs remain manufacturable.

When evaluating MC33164D-3G replacements, consider key parameters such as package compatibility, electrical specifications, and operating temperature range. Our engineering team can help verify pin-to-pin compatibility for your specific application.

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FAQ

What is equivalent to MC33164D-3G?

Known equivalents for MC33164D-3G include NCP301LSN33T1G, REF3112AIDBZT, MCP795W10-I/SL. Contact FindMyChip for a full compatibility analysis for your specific application.

Can I use a different manufacturer's part instead of MC33164D-3G?

In many cases, yes. Cross-manufacturer alternatives exist for most standard components. However, always verify pin compatibility, electrical specs, and package dimensions before substituting in production.

How do I verify MC33164D-3G alternatives?

Compare the datasheet specifications including pinout, voltage ratings, timing parameters, and package dimensions. FindMyChip's engineering team can help with compatibility verification — submit an RFQ to get started.