MC33079DG ON Semiconductor Integrated Circuit (Small Outline Packages) In Stock
MC33079DG is a ON Semiconductor integrated circuit for industrial electronics and embedded systems. It combines 14 pins, SOIC-14 NB, -40°C to 85°C for reliable board-level integration. Quote-based sourcing supports stock checks and worldwide shipping.
- Manufacturer
- ON Semiconductor
- Package
- Small Outline Packages
- Pin Count
- 14
- Lifecycle
- OBSOLETE
- Datasheet
- MC33079DG Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 14 pins configuration for integrated circuit placement in production PCB assemblies
- SOIC-14 NB design detail captured from available manufacturer data
- SOIC-14 NB package or mounting style for layout and assembly review
- obsolete lifecycle status to support sourcing risk review
Applications
MC33079DG is used in industrial electronics, embedded systems, maintenance spares, and production PCB assemblies where a ON Semiconductor integrated circuit must be matched to the board design and purchasing plan. Designs commonly review 14 pins, SOIC-14 NB, -40°C to 85°C before release to purchasing. It suits engineering and sourcing teams validating alternates, lifecycle exposure, and production availability.
Specifications
| Pbfree Code | Yes |
| Manufacturer Package Code | 751A-03 |
| YTEOL | 0 |
| Amplifier Type | OPERATIONAL AMPLIFIER |
| Architecture | VOLTAGE-FEEDBACK |
| Average Bias Current-Max (IIB) | 0.8 µA |
| Bias Current-Max (IIB) @25C | 0.75 µA |
| Common-mode Reject Ratio-Min | 80dB |
| Common-mode Reject Ratio-Nom | 100dB |
| Frequency Compensation | YES |
| Input Offset Voltage-Max | 3500 µV |
| JESD-30 Code | R-PDSO-G14 |
| JESD-609 Code | e3 |
| Low-Bias | NO |
| Low-Offset | NO |
| Micropower | NO |
| Neg Supply Voltage Limit-Max | -18 V |
| Neg Supply Voltage-Nom (Vsup) | -15 V |
| Number of Functions | 4 |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | SOP14,.25 |
| Package Shape | RECTANGULAR |
| Package Style | SMALL OUTLINE |
| Packing Method | TUBE |
| Peak Reflow Temperature (Cel) | 260 |
| Power | NO |
| Programmable Power | NO |
| Qualification Status | Not Qualified |
| Slew Rate-Min | 5V/us |
| Slew Rate-Nom | 7V/us |
| Supply Current-Max | 11mA |
| Supply Voltage Limit-Max | 18V |
| Supply Voltage-Nom (Vsup) | 15V |
| Surface Mount | YES |
| Technology | BIPOLAR |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | Tin (Sn) |
| Terminal Form | GULL WING |
| Terminal Pitch | 1.27mm |
| Terminal Position | DUAL |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Unity Gain BW-Nom | 9000 |
| Voltage Gain-Min | 17780 |
| Wideband | NO |
| Package | Small Outline Packages |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 1 |
| ECCN | EAR99 |
| HTS Code | 8542.33.00.01 |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
Which designs can use MC33079DG when 14 pins are required?
MC33079DG fits industrial electronics and embedded systems that need a ON Semiconductor integrated circuit. The known configuration includes 14 pins plus SOIC-14 NB, -40°C to 85°C, giving engineers concrete limits for schematic and BOM review.
How should the package or layout style be checked for MC33079DG?
Review the SOIC-14 NB details against the PCB footprint and assembly process. This integrated circuit listing includes 14 pins, so layout, inspection, and purchasing teams can align on the same physical requirement.
What procurement details matter before approving MC33079DG for a production build?
Before ordering, confirm manufacturer ON Semiconductor, 14 pins, lifecycle status, required quantity, and acceptable alternates. Those checks help avoid a mismatch when stock, lead time, or worldwide shipping options change.
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About ON Semiconductor
ON Semiconductor (onsemi) provides intelligent power and sensing technologies for automotive, industrial, IoT, and cloud infrastructure applications.
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