MC14040BDGAlternatives & Equivalent Parts

About MC14040BDG

MC14040BDG is a Integrated Circuit component manufactured by ON Semiconductor. It comes in a Small Outline Packages package. Below you'll find known alternative and equivalent parts that can serve as replacements in your design.

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Specification Comparison

ParameterMC14040BDGSourceAMC1311BQDWVRQ1S5JC-13-F1734035-4EVQ-PE105KATSAMC21N18A-ANT
ManufacturerON SemiconductorTexas InstrumentsDiodes Inc.TE ConnectivityPanasonicMicrochip
Package TypeSmall Outline PackagesSmall Outline PackagesDiodes MouldedOtherOtherQuad Flat Packages
Pin Count168292100
Temperature Range-55.0°C ~ 125.0°C-40.0°C ~ 125.0°C-65.0°C ~ 150.0°C-40.0°C ~ 85.0°C-40.0°C ~ 105.0°C
Price$0.1795$1.3800$0.2029$0.9099$0.2632$3.6800
StockIn StockIn StockIn StockIn StockIn StockIn Stock
LifecycleACTIVEACTIVEACTIVEACTIVEACTIVE
Electrical Parameters
Pbfree CodeYesYesNoYes
Manufacturer Package Code751B-05SMCTQFP-100
Factory Lead Time11 Weeks12 Weeks8 Weeks, 6 Days14 Weeks
YTEOL5156718
Count DirectionUP
Family4000/14000/40000
JESD-30 CodeR-PDSO-G16R-PDSO-G8R-PDSO-C2S-PQFP-G100
JESD-609 Codee3e4e3e3
Load Capacitance (CL)50 pF
Load/Preset InputNO
Logic IC TypeBINARY COUNTER
Max Frequency@Nom-Sup1500000 Hz
Max I(ol)0.004200000000000001 A
Mode of OperationASYNCHRONOUS
Number of Bits12
Number of Functions11
Package Body MaterialPLASTIC/EPOXYPLASTIC/EPOXYPLASTIC/EPOXYPLASTIC/EPOXY
Package Equivalence CodeSOP16,.25TQFP100,.63SQ
Package ShapeRECTANGULARRECTANGULARRECTANGULARSQUARE
Package StyleSMALL OUTLINESMALL OUTLINESMALL OUTLINEFLATPACK, THIN PROFILE, FINE PITCH
Packing MethodRAILTR
Peak Reflow Temperature (Cel)260260260260
Prop. Delay@Nom-Sup520 ns
Propagation Delay (tpd)3250 ns
Qualification StatusNot QualifiedNot Qualified
Supply Voltage-Max (Vsup)18 V
Supply Voltage-Min (Vsup)3 V
Supply Voltage-Nom (Vsup)5 V3.3 V
Surface MountYESYESYESYES
TechnologyCMOSCMOSCMOS
Temperature GradeMILITARYAUTOMOTIVEINDUSTRIAL
Terminal FinishMatte Tin (Sn) - annealedNickel/Palladium/Gold (Ni/Pd/Au)MATTE TINMatte Tin (Sn)
Terminal FormGULL WINGGULL WINGC BENDGULL WING
Terminal Pitch1.27 mm1.27 mm0.8 mm0.5 mm
Terminal PositionDUALDUALDUALQUAD
Time@Peak Reflow Temperature-Max (s)303030
Trigger TypeNEGATIVE EDGE
fmax-Min4.5 MHz
Amplifier TypeISOLATION AMPLIFIER
Analog Input Voltage-Max2 V
Analog Input Voltage-Min-2 V
Bandwidth (3dB)-Nom275 MHz
Common Mode Voltage-Max1.49 V
Isolation Voltage-Min1500 V
Non-linearity-Max0.04%
Screening LevelAEC-Q100
SubcategoryIsolation Amplifier
Supply Current-Max10 mA6.6 mA
Supply Voltage Limit-Max6.5 V
ApplicationGENERAL PURPOSE
ConfigurationSINGLE
Diode Element MaterialSILICON
Diode TypeRECTIFIER DIODE
Forward Voltage-Max (VF)1.15 V
Non-rep Pk Forward Current-Max100 A
Number of Elements1
Number of Phases1
Output Current-Max5 A
Rep Pk Reverse Voltage-Max600 V
Board Mounting OptionLOCATING POST
Body Breadth0.155 inch
Body Depth0.333 inch
Body Length0.303 inch
Body/Shell StyleRECEPTACLE
Connector TypeUSB CONNECTOR
Contact Finish MatingNOT APPLICABLE
Contact GenderFEMALE
Contact MaterialNOT APPLICABLE
Contact PatternRECTANGULAR
Contact Resistance50 mΩ
Contact StyleUSB2.0 B
DIN ConformanceNO
Durability5000 Cycles
EMI ShieldedNO
Empty ShellNO
Filter FeatureNO
IEC ConformanceNO
Insulation Resistance100000000 Ω
Insulator ColorBLACK
Insulator MaterialGLASS FILLED POLYAMIDE9T
MIL ConformanceNO
Mains Connector Rating1A
Mixed ContactsYES
Mounting Option 1MOUNTING FLANGE
Mounting Option 2LOCKING
Mounting StyleRIGHT ANGLE
Mounting TypeBOARD
Number Of ConnectorsONE
Number Of PCB Rows1
Number of Ports1
Number of Rows Loaded1
OptionGENERAL PURPOSE
PCB Contact PatternRECTANGULAR
Panel MountNO
Plating Thickness29.92u inch
Polarization KeyPOLARIZED HOUSING
Rated Current (Signal)1 A
Reference StandardUL
Shell FinishNICKEL
Shell MaterialCOPPER ALLOY
Terminal Length0.045 inch
Termination TypeSURFACE MOUNT
Total Number of Contacts5
UL Flammability Code94V-0
Offset 0 MMShell Plating Material Nickel
Number of Positions 5Contact Features: Contact Mating Area Plating Material Thickness 29.92 MICIN
Contact Mating Area Plating Material Thickness .76 MICMContact Current Rating (Max) 1 AMP
Reach Compliance CodeCompliant
Has ADCYES
Bit Size32
Boundary ScanNO
CPU FamilyCORTEX-M0
Clock Frequency-Max48 MHz
DAC ChannelsYES
DMA ChannelsYES
FormatFIXED POINT
Integrated CacheYES
Low Power ModeYES
Number of DMA Channels12
Number of External Interrupts16
Number of I/O Lines84
Number of Serial I/Os8
Number of Timers11
On Chip Data RAM Width8
On Chip Program ROM Width8
PWM ChannelsYES
RAM (bytes)32768
RAM (words)32768
ROM (words)262144
ROM ProgrammabilityFLASH
Speed48 MHz
Supply Voltage-Max5.5 V
Supply Voltage-Min2.7 V
Supply Voltage-Nom5 V
uPs/uCs/Peripheral ICs TypeMICROCONTROLLER, RISC
## ATSAMC21N18A-ANT Alternates Showing resultsImage

Cells highlighted in yellow indicate differing values across parts. Always verify with official datasheets before substitution.

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Get one quote covering all 5 alternatives for MC14040BDG — response within 24 hours.

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Why Look for Alternatives?

Finding alternatives for MC14040BDG is essential for supply chain resilience. Component shortages, long lead times, and end-of-life notices can disrupt production schedules. Having verified alternative parts ensures your designs remain manufacturable.

When evaluating MC14040BDG replacements, consider key parameters such as package compatibility, electrical specifications, and operating temperature range. Our engineering team can help verify pin-to-pin compatibility for your specific application.

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FAQ

What is equivalent to MC14040BDG?

Known equivalents for MC14040BDG include AMC1311BQDWVRQ1, S5JC-13-F, 1734035-4. Contact FindMyChip for a full compatibility analysis for your specific application.

Can I use a different manufacturer's part instead of MC14040BDG?

In many cases, yes. Cross-manufacturer alternatives exist for most standard components. However, always verify pin compatibility, electrical specs, and package dimensions before substituting in production.

How do I verify MC14040BDG alternatives?

Compare the datasheet specifications including pinout, voltage ratings, timing parameters, and package dimensions. FindMyChip's engineering team can help with compatibility verification — submit an RFQ to get started.