MAX77504AAWE+ Analog Devices Integrated Circuit (BGA) In Stock

Analog Devices MAX77504AAWE+ is a synchronous step-down DC/DC converter operating at 1.5 MHz with 2.6 V to 14 V input range. It uses current-mode PWM control in a compact 16-bump WLCSP package rated to 125°C, ideal for space-constrained power rails.

ACTIVEIntegrated CircuitVerified Jun 2026
Package / Visual Reference
MAX77504AAWE+BGA
Quick Facts
Manufacturer
Analog Devices
Package
BGA
Pin Count
16
Lifecycle
ACTIVE
Category
Integrated Circuit
Temp Range
-40.0°C to 125.0°C
RoHS
Compliant
Lead Time
3–7 business days
Shipping
DHL Express · Worldwide

Key Features

  • Current-mode PWM synchronous buck converter switching at 1.5 MHz for reduced inductor size and fast transient response
  • Wide 2.6 V to 14 V input voltage range with 12 V nominal, accommodating automotive and industrial supply rails
  • Ultra-compact 16-bump WLCSP package enabling minimal PCB footprint in battery-powered and space-constrained designs

Applications

MAX77504AAWE+ is well suited for generating regulated low-voltage rails in portable consumer electronics, wearable devices, and IoT modules where board space is at a premium. Its 1.5 MHz switching frequency and current-mode control allow the use of small ceramic capacitors and inductors, making it equally effective in industrial sensor nodes and automotive subsystems operating up to 125°C.

Specifications

Manufacturer Package Code16-WLCSP-N/A
Date Of Intro2019-12-11
YTEOL9
Analog IC - Other TypeSWITCHING REGULATOR
Control ModeCURRENT-MODE
Control TechniquePULSE WIDTH MODULATION
Input Voltage-Max14V
Input Voltage-Min2.6V
Input Voltage-Nom12V
JESD-30 CodeS-XBGA-B16
Number of Functions1
Output Current-Max3A
Output Voltage-Max6V
Output Voltage-Min0.6V
Package Body MaterialUNSPECIFIED
Package Equivalence CodeBGA16,4X4,16
Package ShapeSQUARE
Package StyleGRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)260
Supply Current-Max (Isup)1.5mA
Surface MountYES
Switcher ConfigurationBUCK
Switching Frequency-Max1575kHz
Terminal FinishTin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)
Terminal FormBALL
Terminal Pitch0.4mm
Terminal PositionBOTTOM
Time@Peak Reflow Temperature-Max (s)30
PackageBGA

Compliance & Regulatory

RoHS StatusCompliant
Lead-FreeYes (Pb-Free)
Moisture Sensitivity LevelMSL 1
ECCNEAR99
HTS Code8542.39.00.60

Datasheet

MAX77504AAWE+ Datasheet Download

Official datasheet from Analog Devices

Alternate & Equivalent Parts

No known alternates. Submit an RFQ and our team can suggest alternatives.

Frequently Asked Questions

What input voltage range and switching frequency does MAX77504AAWE+ support for a 12 V bus step-down design?

MAX77504AAWE+ accepts a 2.6 V to 14 V input (12 V nominal) and switches at 1.5 MHz, allowing the use of a 1 µH or smaller inductor and X5R ceramic output capacitors under 10 µF, which significantly reduces solution size on a 12 V bus step-down rail.

How does the WLCSP package of MAX77504AAWE+ compare to an SOIC or QFN package for thermal and board-space considerations?

The 16-bump WLCSP package measures approximately 1.6 mm × 1.6 mm with 0.5 mm bump pitch, saving over 80% PCB area versus an equivalent SOIC-16 outline, and direct die attachment to the PCB improves thermal dissipation at junction temperatures up to 125°C.

In which operating temperature environments can MAX77504AAWE+ be reliably deployed?

MAX77504AAWE+ is rated for an operating junction temperature of -40°C to +125°C, covering automotive Grade 2, industrial, and consumer application profiles, making it suitable for under-hood sensors, ruggedized handhelds, and outdoor IoT gateways across wide ambient temperature swings.

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About Analog Devices

Analog Devices (ADI) is a global leader in high-performance analog, mixed-signal, and digital signal processing integrated circuits used in virtually all types of electronic equipment.

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Lead Time3-7 business days
MOQFrom 1 piece
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OriginChina (Authorized)

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