MAX5113GWX+T Analog Devices Integrated Circuit (BGA) In Stock

Analog Devices MAX5113GWX+T is a 9-channel, 14-bit current DAC with SPI serial interface and up to 2.3 V analog output. It delivers 0.049% maximum linearity error in a compact 36-ball WLCSP package, designed for precision optical, telecom, and multi-channel control applications.

ACTIVEIntegrated CircuitVerified Jun 2026
Package / Visual Reference
MAX5113GWX+TBGA
Quick Facts
Manufacturer
Analog Devices
Package
BGA
Pin Count
36
Lifecycle
ACTIVE
Category
Integrated Circuit
Temp Range
-40.0°C to 105.0°C
RoHS
Compliant
Lead Time
3–7 business days
Shipping
DHL Express · Worldwide

Key Features

  • 9 independent output channels with 14-bit resolution per channel
  • Maximum integral linearity error of 0.049% (0.04882%) for precision control
  • SPI-compatible serial input interface for easy microcontroller integration
  • Analog output voltage up to 2.3 V with current-output DAC architecture
  • Ultra-compact 36-ball WLCSP package (S-XBGA-B36) for space-critical designs
  • Binary-coded parallel input format for straightforward code loading

Applications

The MAX5113GWX+T is used in multi-channel optical transceiver bias control, precision analog signal generation, and industrial process control systems requiring 14-bit accuracy across 9 simultaneous outputs. Its compact WLCSP package and SPI interface make it suitable for line cards, medical imaging equipment, and high-channel-count instrumentation where board density is paramount.

Specifications

Manufacturer Package Code36-WLCSP-N/A
Date Of Intro2012-07-13
YTEOL10
Analog Output Voltage-Max2.3V
Converter TypeD/A CONVERTER
Input Bit CodeBINARY
Input FormatSERIAL
JESD-30 CodeS-XBGA-B36
JESD-609 Codee1
Linearity Error-Max (EL)0.04882%
Negative Supply Voltage-Nom-5.2 V
Number of Bits14
Number of Functions1
Package Body MaterialUNSPECIFIED
Package Equivalence CodeBGA36,6X6,20
Package ShapeSQUARE
Package StyleGRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)260
Settling Time-Nom (tstl)15 µs
Supply Current-Max0.6mA
Supply Voltage-Nom3V
Surface MountYES
Temperature GradeINDUSTRIAL
Terminal FinishTin/Silver/Copper (Sn/Ag/Cu)
Terminal FormBALL
Terminal Pitch0.5mm
Terminal PositionBOTTOM
Time@Peak Reflow Temperature-Max (s)30
PackageBGA

Compliance & Regulatory

RoHS StatusCompliant
Lead-FreeYes (Pb-Free)
Moisture Sensitivity LevelMSL 1
HTS Code8542.39.00.40
Country of OriginJapan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

Datasheet

MAX5113GWX+T Datasheet Download

Official datasheet from Analog Devices

Alternate & Equivalent Parts

No known alternates. Submit an RFQ and our team can suggest alternatives.

Frequently Asked Questions

What resolution and linearity does MAX5113GWX+T offer, and what precision applications does that support?

The MAX5113GWX+T provides 14-bit resolution on each of its 9 output channels, with a maximum integral linearity error of 0.04882% (approximately 8 LSB at 14-bit). This level of accuracy supports optical transceiver bias trimming, precision current source arrays, and multi-channel analog calibration systems where tight channel-to-channel matching is required.

How does MAX5113GWX+T communicate with a host microcontroller, and what are the interface requirements?

The MAX5113GWX+T uses an SPI-compatible serial interface with binary-coded input format, requiring a standard 3-wire SPI bus (SCLK, MOSI, CS). This allows straightforward integration with virtually any microcontroller that has an SPI peripheral, with serial clock rates that support fast update rates across all 9 channels.

For optical module bias control needing 9 independent channels, why might MAX5113GWX+T be selected over discrete single-channel DACs?

Using MAX5113GWX+T integrates 9 independent 14-bit current DAC channels in a single 36-ball WLCSP package, which consumes far less PCB area than nine individual single-channel DACs. The shared SPI bus reduces GPIO pin count, while the 2.3 V maximum output and 0.049% linearity satisfy the tight bias accuracy requirements of ROSA/TOSA optical modules.

What is the package type of MAX5113GWX+T and what are the implications for PCB assembly and rework?

The MAX5113GWX+T is housed in a 36-ball WLCSP (wafer-level chip-scale package) with a BGA-style ball layout, offering an extremely small footprint versus equivalent SOIC or QFN alternatives. Assembly requires fine-pitch BGA soldering capability and X-ray inspection for solder joint verification, and rework is more challenging than leaded packages, so boards should allow for test pads where feasible.

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About Analog Devices

Analog Devices (ADI) is a global leader in high-performance analog, mixed-signal, and digital signal processing integrated circuits used in virtually all types of electronic equipment.

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OriginChina (Authorized)

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