MAX4684EBC+ Analog Devices Integrated Circuit (BGA) In Stock

The MAX4684EBC+ is a single-pole double-throw (SPDT) analog switch from Analog Devices offering 64 dB off-state isolation, 0.06 Ω on-resistance matching, and a single-channel CMOS switching function. Housed in a 12-ball WLCSP package measuring just millimeters across, it targets RF signal routing, audio path switching, and high-density portable electronics applications.

ACTIVEIntegrated CircuitVerified Jun 2026
Package / Visual Reference
MAX4684EBC+BGA
Quick Facts
Manufacturer
Analog Devices
Package
BGA
Pin Count
12
Lifecycle
ACTIVE
Category
Integrated Circuit
Temp Range
-40.0°C to 85.0°C
RoHS
Compliant
Lead Time
3–7 business days
Shipping
DHL Express · Worldwide

Key Features

  • SPDT analog switch with 64 dB off-state isolation for clean signal separation in RF and audio paths
  • 0.06 Ω on-resistance matching between switch states for minimal signal distortion
  • 12-ball WLCSP package for ultra-compact, high-density portable PCB integration
  • Single-channel SPDT topology in a 2-function configuration for flexible routing
  • Low on-resistance enables low insertion loss in audio, video, and high-frequency signal paths

Applications

The MAX4684EBC+ is used in portable consumer electronics such as smartphones, tablets, and wearable devices where antenna switching, audio jack routing, or baseband signal muxing must be implemented in minimal board space. Its 64 dB off-state isolation makes it suitable for RF front-end applications where signal bleed between switched paths must be suppressed. Industrial and medical handheld instruments also use it for precision analog signal routing where low on-resistance and tight resistance matching prevent measurement errors.

Specifications

Manufacturer Package Code12-WLCSP-N/A
Date Of Intro2001-01-03
YTEOL10
Analog IC - Other TypeSPDT
JESD-30 CodeR-PBGA-B12
JESD-609 Codee1
Number of Channels1
Number of Functions2
Off-state Isolation-Nom64dB
On-state Resistance Match-Nom0.06Ω
On-state Resistance-Max (Ron)0.8Ω
OutputSEPARATE OUTPUT
Package Body MaterialPLASTIC/EPOXY
Package Equivalence CodeBGA12,3X4,20
Package ShapeRECTANGULAR
Package StyleGRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)260
Qualification StatusNot Qualified
Signal Current-Max0.3A
Supply Current-Max (Isup)0.0002mA
Supply Voltage-Max (Vsup)5.5V
Supply Voltage-Min (Vsup)1.8V
Supply Voltage-Nom (Vsup)3V
Surface MountYES
Switch-off Time-Max30ns
Switch-on Time-Max50ns
SwitchingBREAK-BEFORE-MAKE
TechnologyBICMOS
Temperature GradeINDUSTRIAL
Terminal FinishTin/Silver/Copper (Sn/Ag/Cu)
Terminal FormBALL
Terminal Pitch0.5mm
Terminal PositionBOTTOM
Time@Peak Reflow Temperature-Max (s)30
PackageBGA

Compliance & Regulatory

RoHS StatusCompliant
Lead-FreeYes (Pb-Free)
Moisture Sensitivity LevelMSL 1
HTS Code8542.39.00.60
Country of OriginJapan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

Datasheet

MAX4684EBC+ Datasheet Download

Official datasheet from Analog Devices

Alternate & Equivalent Parts

No known alternates. Submit an RFQ and our team can suggest alternatives.

Frequently Asked Questions

What off-state isolation does the MAX4684EBC+ provide, and why does that matter for RF signal switching?

The MAX4684EBC+ provides 64 dB nominal off-state isolation. In an RF switching application, 64 dB of isolation means the signal on the unselected path is attenuated by a factor of 1,600,000:1 in power, preventing leakage from interfering with the active signal path. This level of isolation is important in antenna diversity switches and receive-path selectors operating up to several hundred megahertz.

How closely matched is the on-resistance between the two switch positions of the MAX4684EBC+?

The MAX4684EBC+ specifies on-resistance matching of 0.06 Ω nominal between its two switch states. This tight matching ensures that signal gain and insertion loss remain consistent regardless of which switch position is active, which is critical in audio calibration circuits and instrumentation switches where path-dependent gain variation would cause measurement errors.

What package does the MAX4684EBC+ come in, and how does it compare to a standard SOT-23 in terms of board area?

The MAX4684EBC+ is housed in a 12-ball WLCSP (wafer-level chip-scale package). A WLCSP is essentially the bare die with solder balls, making it significantly smaller than a SOT-23 footprint by typically 50% to 70% in board area. This size advantage is valuable in smartphones and wearables where every square millimeter of PCB space is contested.

Is the MAX4684EBC+ still a viable choice for new designs, given its introduction date of 2001?

The MAX4684EBC+ has a YTEOL (years to end of life) of 10 from its database entry and was introduced in January 2001. Designers should verify current lifecycle status with Analog Devices or authorized distributors before committing to new designs, and evaluate whether newer SPDT switches with lower on-resistance or smaller WLCSP footprints better match current requirements.

Related Guides

Why Buy from FindMyChip

Authorized Source
Verified supply chain with full traceability & inspection
$
Competitive Pricing
Factory-direct from China distributors, low MOQ
Fast Shipping
DHL Express 3–5 days · FedEx/UPS 5–7 days worldwide
Quality Guaranteed
30-day replacement for defective parts, no questions asked

About Analog Devices

Analog Devices (ADI) is a global leader in high-performance analog, mixed-signal, and digital signal processing integrated circuits used in virtually all types of electronic equipment.

AvailabilityIn Stock
Reference Price (USD)
Contact for Price
Buy from 1pc · Factory-direct pricing
pcs

In Stock · 24h Response · Worldwide Shipping

Lead Time3-7 business days
MOQFrom 1 piece
ShippingDHL / FedEx / UPS
OriginChina (Authorized)

Response within 24 hours · Worldwide shipping

We've been using FindMyChip for 2 years. Pricing is consistently 20-30% below Mouser/DigiKey for volume orders.

SK
Sarah Kim
VP Engineering, NovaBit Electronics, South Korea