MAX3669ETG+ Analog Devices Integrated Circuit (Quad Flat No-Lead) In Stock

MAX3669ETG+ is a high-speed laser driver IC supporting data rates up to 622 Mbps for fiber-optic transmitter applications in a 24-pin TQFN (4 mm × 4 mm) package. Provides precise modulation current and bias current control for laser diode driving in SONET/SDH and ATM optical links. Suited for telecom line cards, SFP modules, and optical network equipment operating at OC-12 rates.

NOT RECOMMENDEDIntegrated CircuitVerified Jun 2026
Package / Visual Reference
MAX3669ETG+Quad Flat No-Lead
Quick Facts
Manufacturer
Analog Devices
Package
Quad Flat No-Lead
Pin Count
24
Lifecycle
NOT RECOMMENDED
Category
Integrated Circuit
Temp Range
-40.0°C to 85.0°C
RoHS
Compliant
Lead Time
3–7 business days
Shipping
DHL Express · Worldwide

Key Features

  • Supports laser diode driving at data rates up to 622 Mbps (OC-12/STM-4)
  • Separate modulation current and bias current control for precise laser operating point
  • Compact 24-pin LFCSP/TQFN package (4 mm × 4 mm × 0.75 mm)
  • Designed for SONET/SDH, ATM, and Gigabit Ethernet optical fiber links
  • Automatic power control (APC) loop compatibility for laser aging compensation
  • Single-function interface IC optimized for direct laser diode connection
  • Low-jitter output for clean eye-diagram performance at 622 Mbps

Applications

MAX3669ETG+ is deployed in fiber-optic transceiver modules, SFP and SFP+ line cards, and SONET/SDH OC-12 optical network equipment where precise laser diode modulation at 622 Mbps is required. Its independent control of modulation and bias currents enables accurate laser extinction ratio optimization and automatic power control (APC) loop integration to compensate for laser aging over the product's operating life. The device also suits metro Ethernet access equipment, optical add-drop multiplexers (OADMs), and industrial fiber-optic links where compact, reliable laser driving is needed.

Specifications

Manufacturer Package Code24-LFCSP-4X4X0.75
Date Of Intro1999-10-23
YTEOL3
Interface IC TypeINTERFACE CIRCUIT
JESD-30 CodeS-XQCC-N24
JESD-609 Codee3
Number of Functions1
Package Body MaterialUNSPECIFIED
Package Equivalence CodeLCC24,.16SQ,20
Package ShapeSQUARE
Package StyleCHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel)260
Qualification StatusNot Qualified
Supply Voltage-Max5.5V
Supply Voltage-Min3.14V
Supply Voltage-Nom3.3V
Surface MountYES
Temperature GradeINDUSTRIAL
Terminal FinishMatte Tin (Sn) - annealed
Terminal FormNO LEAD
Terminal Pitch0.5mm
Terminal PositionQUAD
Time@Peak Reflow Temperature-Max (s)30
PackageQuad Flat No-Lead

Compliance & Regulatory

RoHS StatusCompliant
Lead-FreeYes (Pb-Free)
Moisture Sensitivity LevelMSL 1
HTS Code8542.39.00.01
Country of OriginJapan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

Datasheet

MAX3669ETG+ Datasheet Download

Official datasheet from Analog Devices

Alternate & Equivalent Parts

No known alternates. Submit an RFQ and our team can suggest alternatives.

Frequently Asked Questions

What is the maximum supported data rate of MAX3669ETG+, and which fiber-optic standard does it primarily target?

MAX3669ETG+ supports data rates up to 622 Mbps, which corresponds to the OC-12 (STM-4) SONET/SDH standard. This makes it directly applicable to telecom line cards and optical transceiver modules designed for metropolitan and wide-area fiber-optic networks at that rate.

How does independent modulation and bias current control benefit laser aging compensation in an SFP module?

Laser diodes shift their threshold current upward as they age. By allowing separate adjustment of the bias current (which sets the laser's DC operating point) and the modulation current (which sets the optical power swing), MAX3669ETG+ enables an APC loop to increase bias current over time, maintaining a stable extinction ratio and optical power output throughout the device's multi-year field lifetime.

What are the package dimensions, and how does the 4 mm × 4 mm LFCSP footprint aid SFP module PCB layout?

The 24-pin LFCSP package measures 4 mm × 4 mm × 0.75 mm body height, providing a very compact footprint that fits within the tight PCB area constraints of an SFP module. The exposed thermal pad on the underside also improves heat dissipation compared to a leaded package of similar size.

What end-of-life risk should procurement teams consider when sourcing MAX3669ETG+ for a multi-year production run?

MAX3669ETG+ has a YTEOL (years to end-of-life) value of 3, indicating it may reach end-of-life status within approximately 3 years. Procurement teams should evaluate last-time-buy quantities, identify alternative laser driver ICs rated at 622 Mbps or higher, and assess the impact on service and repair inventory for long-life telecom equipment programs.

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About Analog Devices

Analog Devices (ADI) is a global leader in high-performance analog, mixed-signal, and digital signal processing integrated circuits used in virtually all types of electronic equipment.

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Lead Time3-7 business days
MOQFrom 1 piece
ShippingDHL / FedEx / UPS
OriginChina (Authorized)

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