MAX3390EEBC+T Analog Devices Integrated Circuit (BGA) In Stock
The MAX3390EEBC+T is a ±15 kV ESD-protected quad low-voltage level translator from Analog Devices, supporting up to 16 Mbps data rates for SPI, I2C, and MICROWIRE interfaces in a 12-ball UCSP BGA package. It translates logic levels between different voltage domains in portable and industrial systems. Available from stock with worldwide shipping.
- Manufacturer
- Analog Devices
- Package
- BGA
- Pin Count
- 12
- Lifecycle
- ACTIVE
- Datasheet
- MAX3390EEBC+T Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- ±15 kV ESD protection on all I/O pins guards against electrostatic discharge in harsh industrial and consumer environments
- Up to 16 Mbps bidirectional level translation supports SPI and I2C buses between 1.2 V to 5.5 V logic families
- Quad-channel configuration (4 independent translators) reduces component count versus single-channel devices in multi-bus designs
- Ultra-small 12-ball UCSP package occupies less than 1 mm² of PCB area, ideal for wearable and mobile designs
Applications
The MAX3390EEBC+T is designed for portable electronics, IoT modules, and wearable devices where a 3.3 V host microcontroller must communicate over SPI or I2C with 1.8 V sensors, displays, or memory devices. Its ±15 kV ESD protection on every I/O pin makes it suitable for interfaces exposed to user contact or long cable runs in industrial handheld terminals. Medical monitors and battery management systems also use this device to bridge logic-level mismatches between different IC families while maintaining signal integrity at up to 16 Mbps.
Specifications
| Reach Compliance Code | Compliant |
| YTEOL | 9 |
| Additional Feature | USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION |
| Delay-Max | 1600ns |
| Input Characteristics | STANDARD |
| Interface IC Type | VOLTAGE LEVEL TRANSLATOR |
| JESD-30 Code | R-PBGA-B12 |
| Number of Bits | 1 |
| Number of Functions | 4 |
| Output Characteristics | OPEN-DRAIN |
| Output Latch or Register | NONE |
| Output Polarity | TRUE |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | BGA12,3X4,20 |
| Package Shape | RECTANGULAR |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH |
| Qualification Status | Not Qualified |
| Supply Current-Max | 0.3mA |
| Supply Voltage-Max | 5.5V |
| Supply Voltage-Min | 1.2V |
| Supply Voltage-Nom | 3.3V |
| Supply Voltage1-Max | 5.5V |
| Supply Voltage1-Min | 1.65V |
| Supply Voltage1-Nom | 3.3V |
| Surface Mount | YES |
| Technology | BICMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Form | BALL |
| Terminal Pitch | 0.5mm |
| Terminal Position | BOTTOM |
| Package | BGA |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 1 |
| ECCN | EAR99 |
| HTS Code | 8542.39.00.60 |
| Country of Origin | Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What voltage ranges does MAX3390EEBC+T support for bidirectional level translation?
MAX3390EEBC+T translates between logic levels spanning 1.2 V to 5.5 V on both ports independently. This covers translation between 1.8 V low-power sensors and 3.3 V microcontrollers, between 3.3 V and 5 V legacy peripherals, and between 2.5 V FPGAs and 1.2 V DDR I/O, all within a single quad-channel device rated at 16 Mbps.
How does the ±15 kV ESD rating of MAX3390EEBC+T protect a system compared to a standard CMOS device?
Standard CMOS inputs typically withstand only 1 kV to 2 kV Human Body Model ESD events, while MAX3390EEBC+T's ±15 kV rating (HBM per JESD22-A114) provides 7x to 15x more protection. In connector-facing applications such as USB accessories, RS-232 adapters, or industrial sensor plugs, this higher ESD tolerance prevents latch-up and permanent damage during hot-plug or user-handling events.
For a compact IoT wearable, how does the UCSP package of MAX3390EEBC+T reduce board space?
The 12-ball UCSP (Ultra-CSP) package measures approximately 1.5 mm x 1.5 mm with 0.5 mm ball pitch, occupying under 2.5 mm² including land pads. Compared to a TSSOP-14 translator of similar function at roughly 32 mm², this is a 12x footprint reduction, freeing critical PCB space on wristbands, hearing aids, and medical patches where every square millimeter is contested.
Can MAX3390EEBC+T handle the clock rates used in SPI flash memories at high speed?
MAX3390EEBC+T supports data rates up to 16 Mbps with a maximum propagation delay of 1600 ns from input to output. For SPI flash devices running at 8 Mbps to 12 Mbps during page-read operations, the translator introduces less than one bit-period of latency, maintaining SPI timing margins and avoiding setup/hold violations in microcontroller SPI master controllers clocked at up to 10 MHz.
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About Analog Devices
Analog Devices (ADI) is a global leader in high-performance analog, mixed-signal, and digital signal processing integrated circuits used in virtually all types of electronic equipment.
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