MAX32650GWQ+ Analog Devices Integrated Circuit (BGA) In Stock
Analog Devices MAX32650GWQ+ is an ultra-low-power 32-bit ARM Cortex-M4 with FPU microcontroller featuring 3 MB Flash and 1 MB SRAM in a 96-ball WLCSP package. It integrates hardware security, DMA, ADC, and boundary scan for IoT and wearable applications. Available in compact wafer-level packaging for space-constrained designs with worldwide distribution.
- Manufacturer
- Analog Devices
- Package
- BGA
- Pin Count
- 96
- Lifecycle
- ACTIVE
- Datasheet
- MAX32650GWQ+ Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 105.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- ARM Cortex-M4 core with FPU running up to 120 MHz for efficient DSP-class computation
- 3 MB internal Flash and 1 MB SRAM providing ample storage and runtime memory for IoT applications
- Ultra-low-power design with multiple sleep modes enabling long battery life in wearable and sensor devices
- Integrated hardware security engine with AES-128/256 and secure boot for IoT endpoint protection
- Compact 96-ball WLCSP package minimizing PCB footprint in space-constrained portable designs
Applications
The MAX32650GWQ+ targets ultra-low-power IoT endpoints, wearable health monitors, and portable medical devices where Cortex-M4 compute performance must coexist with stringent energy budgets. Its 3 MB Flash and 1 MB SRAM support complex firmware stacks including BLE host, sensor fusion algorithms, and secure OTA updates in a single-chip solution. The hardware security engine makes it well suited for connected industrial sensors and smart metering applications requiring AES-256 encryption.
Specifications
| Manufacturer Package Code | 96-WLCSP-N/A |
| Date Of Intro | 2018-03-15 |
| YTEOL | 9 |
| Has ADC | YES |
| Bit Size | 32 |
| Boundary Scan | YES |
| CPU Family | CORTEX-M4 |
| Clock Frequency-Max | 0.032MHz |
| DAC Channels | NO |
| DMA Channels | YES |
| Format | FLOATING POINT |
| Integrated Cache | YES |
| JESD-30 Code | R-PBGA-B96 |
| Low Power Mode | YES |
| Number of DMA Channels | 16 |
| Number of I/O Lines | 67 |
| Number of Serial I/Os | 3 |
| Number of Timers | 6 |
| On Chip Data RAM Width | 8 |
| On Chip Program ROM Width | 8 |
| PWM Channels | YES |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | BGA96,10X10,16 |
| Package Shape | RECTANGULAR |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| RAM (bytes) | 1048576 |
| ROM (words) | 3145728 |
| ROM Programmability | FLASH |
| Speed | 120MHz |
| Supply Voltage-Max | 1.21V |
| Supply Voltage-Min | 0.99V |
| Supply Voltage-Nom | 1.1V |
| Surface Mount | YES |
| Technology | CMOS |
| Terminal Form | BALL |
| Terminal Pitch | 0.4mm |
| Terminal Position | BOTTOM |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |
| Package | BGA |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| HTS Code | 8542.31.00.25 |
| Country of Origin | Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How much embedded memory does the MAX32650GWQ+ provide for firmware and runtime data?
The MAX32650GWQ+ integrates 3 MB of internal Flash memory for code storage and 1 MB of SRAM for runtime data, enabling complex firmware stacks with BLE host software, sensor fusion algorithms, and secure bootloaders to run entirely on-chip without external memory in IoT or wearable designs.
Which security features does the MAX32650GWQ+ offer for connected IoT endpoint protection?
The MAX32650GWQ+ includes a hardware security engine supporting AES-128/256-bit encryption, secure boot with root-of-trust verification, and a true random number generator (TRNG). These 32-bit security primitives protect firmware integrity and data confidentiality in industrial IoT sensors, medical monitors, and smart energy meters without software overhead.
What package is the MAX32650GWQ+ available in and how does it compare to the LQFP variant for board area?
The MAX32650GWQ+ uses a 96-ball WLCSP (wafer-level chip-scale package) with a die-sized footprint below 5 mm x 5 mm, versus a standard LQFP-100 body of 14 mm x 14 mm. This roughly 8x reduction in board area makes the WLCSP variant preferable for wearable devices and compact IoT modules where PCB real estate is tightly constrained.
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About Analog Devices
Analog Devices (ADI) is a global leader in high-performance analog, mixed-signal, and digital signal processing integrated circuits used in virtually all types of electronic equipment.
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