MAX17510ATB+ Analog Devices Integrated Circuit (Small Outline No-lead) In Stock
Analog Devices MAX17510ATB+ is a low-voltage DDR linear regulator with 0.015% maximum load regulation and a single output in a compact 10-pin 3x3 mm LFCSP package, ideal for precise DDR memory power supply rails. Available worldwide with fast shipping.
- Manufacturer
- Analog Devices
- Package
- Small Outline No-lead
- Pin Count
- 10
- Lifecycle
- ACTIVE
- Datasheet
- MAX17510ATB+ Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 0.015% maximum load regulation ensures stable DDR VDDQ and VTT reference rails under dynamic memory bus loading
- Low-voltage linear architecture suited for DDR, DDR2, DDR3, and LPDDR supply rails in notebook and embedded platforms
- Compact 10-pin 3x3x0.75 mm LFCSP package minimizes PCB footprint near memory modules
- Single-output design simplifies power management topology for dedicated DDR termination regulator implementations
Applications
The MAX17510ATB+ is designed to power DDR SDRAM VDDQ and VTT termination rails in laptop computers, embedded SBCs, and server memory subsystems where tight load regulation of 0.015% prevents data errors under rapidly switching memory bus currents. Its low-voltage linear regulator architecture provides low noise output voltage that meets DDR JEDEC specification requirements. The 10-pin LFCSP package fits compactly alongside SO-DIMM slots or on-board BGA memory in space-constrained designs.
Specifications
| Manufacturer Package Code | 10-LFCSP-3X3X0.75 |
| Date Of Intro | 2004-05-19 |
| YTEOL | 10 |
| JESD-30 Code | S-PDSO-N10 |
| JESD-609 Code | e3 |
| Load Regulation-Max | 0.015% |
| Number of Functions | 1 |
| Number of Outputs | 1 |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | SOLCC10,.11,20 |
| Package Shape | SQUARE |
| Package Style | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
| Peak Reflow Temperature (Cel) | 260 |
| Regulator Type | DDR TERMINATION REGULATOR |
| Surface Mount | YES |
| Technology | BICMOS |
| Terminal Finish | Matte Tin (Sn) - annealed |
| Terminal Form | NO LEAD |
| Terminal Pitch | 0.5mm |
| Terminal Position | DUAL |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Package | Small Outline No-lead |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 1 |
| ECCN | EAR99 |
| HTS Code | 8542.39.00.60 |
| Country of Origin | Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the load regulation specification of the MAX17510ATB+ and why does it matter for DDR memory?
The MAX17510ATB+ achieves a maximum load regulation of 0.015%, meaning the output voltage shifts by less than 0.15 mV per 1 A load step on a 1 V DDR rail. This tight regulation keeps VDDQ within JEDEC DDR tolerance windows under rapid bus switching currents, preventing read/write errors in high-speed memory interfaces.
Which DDR memory standards can the MAX17510ATB+ support as a linear regulator solution?
The MAX17510ATB+ supports DDR, DDR2, DDR3, and LPDDR SDRAM power rails, providing precise VDDQ and VTT output voltages required by JEDEC specifications. Its low-voltage design accommodates supply rails from 2.5 V DDR down to the 1.2 V to 1.35 V range used by DDR3L and LPDDR3 memory in mobile platforms.
How does the MAX17510ATB+ LFCSP package dimension affect memory subsystem PCB layout?
The MAX17510ATB+ is packaged in a 10-pin LFCSP measuring 3x3x0.75 mm, occupying only 9 mm² of PCB area. This small footprint allows placement within the DDR signal fanout region near BGA memory devices or alongside SO-DIMM slots, minimizing trace length between the regulator output and the DDR VTT termination resistors.
When should a designer choose the MAX17510ATB+ over a switching regulator for DDR termination?
A designer should choose the MAX17510ATB+ when DDR VTT noise must remain below the JEDEC ripple specification of 40 mV peak-to-peak, since its linear topology eliminates the switching frequency harmonics inherent in buck regulators. For DDR3 designs with VDDQ at 1.5 V and VTT at 0.75 V with loads below 1 A, the linear solution also simplifies EMI compliance.
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About Analog Devices
Analog Devices (ADI) is a global leader in high-performance analog, mixed-signal, and digital signal processing integrated circuits used in virtually all types of electronic equipment.
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