M50-3600942 Harwin Connector (Other) In Stock
Harwin M50-3600942 is a 1.27 mm (0.05") pitch dual-in-line (DIL) vertical SMT pin header with 18 contacts (9+9) featuring selective gold and tin plating for reliable high-cycle mating. Compact SMT body measures approximately 11.4 mm x 1.68 mm x 5.72 mm. In stock worldwide with global shipping.
- Manufacturer
- Harwin
- Package
- Other
- Pin Count
- 18
- Lifecycle
- ACTIVE
- Datasheet
- M50-3600942 Datasheet PDF
- Category
- Connector
- Temp Range
- -40.0°C to 105.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 1.27 mm (0.05") ultra-fine pitch DIL layout with 9+9 contacts for high-density 18-signal SMT interconnects
- Selective gold and tin contact plating for extended mating cycles and corrosion resistance in demanding environments
- Compact vertical SMT pin header form factor (11.4 mm x 1.68 mm) enabling dense board stacking and miniaturized system designs
Applications
The M50-3600942 is designed for compact embedded modules, wireless IoT devices, and wearable electronics where 18 signals must be routed through an ultra-fine 1.27 mm pitch SMT header with minimal board footprint. Its selective gold plating suits high-cycle mating applications such as removable daughter-card interfaces and test fixture contacts. The vertical orientation and SMT termination make it ideal for automated assembly in space-constrained PCB layouts.
Specifications
| Pbfree Code | Yes |
| YTEOL | 9.4 |
| Additional Feature | ROHS COMPLIANT |
| Body Breadth | 0.134inch |
| Body Depth | 0.066inch |
| Body Length | 0.45inch |
| Body/Shell Style | RECEPTACLE |
| Connector Type | BOARD CONNECTOR |
| Contact Finish Mating | NOT APPLICABLE |
| Contact Finish Termination | Tin (Sn) - with Nickel (Ni) barrier |
| Contact Gender | MALE |
| Contact Material | NOT APPLICABLE |
| Contact Pattern | RECTANGULAR |
| Contact Resistance | 20mΩ |
| DIN Conformance | NO |
| Dielectric Withstanding Voltage | 1000VAC V |
| Durability | 300Cycles |
| Filter Feature | NO |
| IEC Conformance | NO |
| Insulation Resistance | 1000000000Ω |
| Insulator Color | BLACK |
| Insulator Material | POLYETHYLENE |
| JESD-609 Code | e3 |
| MIL Conformance | NO |
| Mating Contact Pitch | 0.05inch |
| Mating Contact Row Spacing | 0.05inch |
| Mixed Contacts | NO |
| Mounting Option 1 | LOCKING |
| Mounting Style | STRAIGHT |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number Of PCB Rows | 2 |
| Number of Rows Loaded | 2 |
| Option | GENERAL PURPOSE |
| PCB Contact Pattern | RECTANGULAR |
| Rated Current (Signal) | 1A |
| Reference Standard | UL |
| Terminal Pitch | 1.27mm |
| Termination Type | SURFACE MOUNT |
| Total Number of Contacts | 18 |
| UL Flammability Code | 94V-0 |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
| Country of Origin | Taiwan |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the contact pitch and total pin count of the Harwin M50-3600942, and how does this affect PCB layout density?
The M50-3600942 uses a 1.27 mm (0.05") pitch with 18 total contacts in a 9+9 dual-row arrangement. At half the spacing of standard 2.54 mm pitch headers, this connector occupies roughly 50% less board length for the same pin count, making it suitable for high-density PCB layouts in compact embedded and IoT modules.
Why does the M50-3600942 use selective gold plating rather than full tin plating across all contacts?
Selective gold plating on the mating contact area provides lower contact resistance (typically below 20 mΩ) and higher cycle life compared to tin alone, while the tin-plated termination area maintains good solder joint reliability. This combination reduces material cost versus full gold plating while meeting the durability requirements for connectors that are mated and unmated frequently in test or field-replaceable module applications.
Can M50-3600942 be used in automated reflow soldering assembly lines?
Yes, the M50-3600942 is an SMT component compatible with standard lead-free reflow soldering at a peak temperature of 260°C per IPC/JEDEC J-STD-020. Its vertical orientation and SMT pads allow placement by pick-and-place machines, and Harwin supplies these parts in tape-and-reel or tray packaging suitable for automated PCB assembly equipment.
How does the M50-3600942 body size constrain the mating board clearance in a stacked board design?
With a body height of approximately 5.72 mm (0.225") above the PCB and a body width of 1.68 mm (0.066"), the M50-3600942 defines the minimum vertical clearance between stacked boards. System designers must allow at least 6 mm to 7 mm of Z-axis spacing to accommodate the connector plus mating tolerances in a dual-PCB stack using the M50-36 series.
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