LX5591LQ-TR Microchip Integrated Circuit (Quad Flat No-Lead) In Stock
Microchip LX5591LQ-TR is an industrial-grade dual-band RF front-end IC supporting 2.4 GHz–2.5 GHz and 5.15 GHz–5.85 GHz 802.11n/ac WLAN, operating at 3.3 V supply in a compact 28-pin QFN package with integrated heat slug for efficient thermal dissipation. Available in stock with worldwide shipping.
- Manufacturer
- Microchip
- Package
- Quad Flat No-Lead
- Pin Count
- 29
- Lifecycle
- OBSOLETE
- Datasheet
- LX5591LQ-TR Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of LX5591LQ-TR?
- Dual-band RF front-end covering 2.4 GHz (802.11b/g/n) and 5 GHz (802.11a/n/ac) bands in a single IC, eliminating the need for separate front-end modules per band
- 3.3 V supply voltage with industrial temperature grade enables use in access points, gateways, and IoT devices operating across wide ambient temperature ranges
- 28-pin QFN package with integrated heat sink slug provides low junction-to-board thermal resistance for reliable continuous RF transmission at elevated output power
- Supports 802.11ac (Wi-Fi 5) 5 GHz operation up to 5.85 GHz, covering all DFS and non-DFS channels required for global regulatory compliance
What is LX5591LQ-TR used for?
LX5591LQ-TR is used in Wi-Fi access points, residential and enterprise WLAN routers, and IoT gateways that require a dual-band 2.4 GHz and 5 GHz RF front-end in a compact, single-chip solution. Its industrial temperature grade makes it suitable for outdoor access points and industrial wireless sensor networks where ambient temperatures exceed the 0°C to 70°C commercial range. Embedded module designers integrate it into USB Wi-Fi dongles and M.2 WLAN cards for laptop and embedded computing platforms requiring 802.11ac dual-band connectivity.
What are the specifications of LX5591LQ-TR?
| YTEOL | 0 |
| JESD-30 Code | R-XQCC-N28 |
| Number of Functions | 1 |
| Package Body Material | UNSPECIFIED |
| Package Shape | RECTANGULAR |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG |
| Supply Voltage-Nom | 3.3V |
| Surface Mount | YES |
| Telecom IC Type | RF AND BASEBAND CIRCUIT |
| Temperature Grade | INDUSTRIAL |
| Terminal Form | NO LEAD |
| Terminal Pitch | 0.4mm |
| Terminal Position | QUAD |
| Package | Quad Flat No-Lead |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8542.31.00.01 |
| Country of Origin | Thailand |
Where can I find the LX5591LQ-TR datasheet?
LX5591LQ-TR Datasheet DownloadOfficial datasheet from Microchip
What are equivalent replacements for LX5591LQ-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
Which frequency bands and Wi-Fi standards does LX5591LQ-TR support?
LX5591LQ-TR supports both the 2.4 GHz to 2.5 GHz band for 802.11b/g/n and the 5.15 GHz to 5.85 GHz band for 802.11a/n/ac (Wi-Fi 5). This dual-band coverage in a single 28-pin QFN IC enables system designers to address all major WLAN frequency allocations without adding a second discrete front-end component.
How does the industrial temperature grade of LX5591LQ-TR benefit outdoor WLAN access point deployments?
The industrial temperature grade ensures LX5591LQ-TR operates reliably from -40°C to +85°C, covering the full range of ambient temperatures found in outdoor enclosures mounted in direct sunlight or in cold-weather climates. Standard commercial-grade WLAN front-ends rated only to 70°C can experience gain compression or increased noise figure above 70°C, reducing range by several dB in hot environments, a degradation that the industrial rating avoids.
What role does the integrated heat sink slug in the LX5591LQ-TR QFN package play in RF performance?
The exposed heat sink slug on the bottom of the 28-pin QFN package transfers heat directly to the PCB copper ground plane, keeping junction temperature below the maximum rating even during sustained 5 GHz 802.11ac transmissions at maximum output power. Without this slug, the chip's internal PA stages could thermally throttle at ambient temperatures above 50°C, reducing effective transmit power by 1 dB to 3 dB and degrading link budget in a 5 GHz 802.11ac deployment.
For a dual-band Wi-Fi router design, when should an engineer consider LX5591LQ-TR over using two separate single-band front-end ICs?
LX5591LQ-TR consolidates 2.4 GHz and 5 GHz front-end functions into a single 28-pin QFN, saving at least 30 mm² of PCB area and reducing BOM count by 1 IC and associated passives compared to two dedicated single-band front-ends. For router PCBs constrained to under 100 cm² with aggressive cost targets below $3 per radio chain, the integration advantage outweighs any per-band optimization that separate ICs might offer.
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