LSHM-150-06.0-F-DV-A-S-K-TR SAMTEC Connector (Other) In Stock
Samtec LSHM-150-06.0-F-DV-A-S-K-TR is a 100-position shielded board stacking connector with a 6.0 mm stack height, 0.50 mm pitch, and a 1.169 inch body for high-density mezzanine board-to-board interconnect. It features integrated EMI shielding, peg-mount PCB anchoring, and matte tin termination. Available in tape-and-reel format from global distributors with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 102
- Lifecycle
- ACTIVE
- Category
- Connector
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 6.0 mm stack height shielded board stacking connector supports mezzanine layouts that need up to 6 mm component clearance between boards while providing EMI shielding
- Integrated EMI shield on a 100-position, 0.50 mm pitch body reduces radiated emissions and susceptibility in RF-sensitive or high-speed signal applications
- Peg-mount board attachment and tape-and-reel packaging ensure accurate SMT placement and strong mechanical retention under shock and vibration loads
Applications
The LSHM-150-06.0-F-DV-A-S-K-TR suits high-density mezzanine stacking in telecommunications equipment, wireless modules, and RF-sensitive embedded systems that require 100 connections at a 0.50 mm pitch within a 6.0 mm board-to-board gap. Its integrated EMI shielding distinguishes it from unshielded alternatives, making it the preferred choice for LTE modem cards, 5G baseband modules, and compact radar sensor boards where signal integrity must be maintained alongside high interconnect density.
Specifications
| Factory Lead Time | 1Week |
| YTEOL | 8.68 |
| Additional Feature | SHIELDED |
| Board Mounting Option | PEG |
| Body Breadth | 0.196inch |
| Body Depth | 0.293inch |
| Body Length | 1.169inch |
| Connector Type | BOARD STACKING CONNECTOR |
| Contact Finish Mating | NOT SPECIFIED |
| Contact Finish Termination | Matte Tin (Sn) - with Nickel (Ni) barrier |
| Contact Gender | HERMAPHRODITIC |
| Contact Material | NOT SPECIFIED |
| Contact Pattern | RECTANGULAR |
| Contact Resistance | 15mΩ |
| Contact Style | BELLOWED TYPE |
| DIN Conformance | NO |
| Dielectric Withstanding Voltage | 470VAC V |
| Durability | 100Cycles |
| Filter Feature | NO |
| IEC Conformance | NO |
| Insulation Resistance | 1000000000Ω |
| Insulator Color | BLACK |
| Insulator Material | LIQUID CRYSTAL POLYMER |
| JESD-609 Code | e3 |
| MIL Conformance | NO |
| Mating Contact Pitch | 0.02inch |
| Mating Information | MULTIPLE MATING PARTS AVAILABLE |
| Mixed Contacts | NO |
| Mounting Option 1 | LOCKING |
| Mounting Style | STRAIGHT |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number Of PCB Rows | 2 |
| Number of Rows Loaded | 2 |
| Option | GENERAL PURPOSE |
| PCB Contact Pattern | RECTANGULAR |
| PCB Contact Row Spacing | 3.7mm |
| Plating Thickness | 3u inch |
| Polarization Key | POLARIZED HOUSING |
| Rated Current (Signal) | 2A |
| Reference Standard | UL |
| Terminal Pitch | 0.5mm |
| Termination Type | SURFACE MOUNT |
| Total Number of Contacts | 100 |
| UL Flammability Code | 94V-0 |
| Withdrawl Force-Min | 2.22N |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
| Country of Origin | Costa Rica, USA |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does the integrated EMI shielding of the LSHM-150-06.0-F-DV-A-S-K-TR benefit high-speed signal integrity in mezzanine board stacking?
The built-in EMI shield surrounding the 100-position, 0.50 mm pitch contact array attenuates crosstalk and radiated emissions across the stacked board interface, which is especially important for differential pairs and signals above 1 GHz, reducing the need for additional shielding enclosures or ferrite beads in designs such as LTE or 5G modem cards.
What component clearance does the 6.0 mm stack height of the LSHM-150-06.0-F-DV-A-S-K-TR provide between mating boards?
The 6.0 mm stack height provides approximately 5 mm to 5.5 mm of usable component clearance between the two PCB surfaces after accounting for board thickness, which is sufficient to accommodate standard 0402 and 0603 SMT passives, small ICs up to 4 mm body height, and chip antenna modules commonly placed on mezzanine boards.
How does the 100-position LSHM-150-06.0-F-DV-A-S-K-TR compare to its 3.0 mm stack-height sibling for designs with taller mid-board components?
Where the 3.0 mm stack-height variant only accommodates very low-profile SMT components under 2 mm tall between boards, the 6.0 mm version of the LSHM-150 series allows placement of taller ICs, inductors, or connectors up to approximately 4 mm high on the inner board surfaces while still maintaining the same 100-position, 0.50 mm pitch footprint with integrated shielding.
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