LSHM-130-06.0-S-DV-A-S-TR SAMTEC Connector (Other) In Stock
SAMTEC LSHM-130-06.0-S-DV-A-S-TR is a 60-position hermaphroditic board stacking connector with 6.0 mm stacking height, 0.50 mm pitch, and peg board mounting for reliable PCB-to-PCB alignment. It enables high-density vertical board-stacking in compact embedded systems and communication modules. Available on tape and reel from authorized global distributors.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 62
- Lifecycle
- ACTIVE
- Category
- Connector
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 60-position hermaphroditic socket on 0.50 mm pitch with 6.0 mm stacking height for flexible board-to-board vertical interconnect
- Integrated peg board mounting option ensures precise PCB alignment and mechanical stability during SMT reflow across all 60 contacts
- Tape-and-reel packaging supports high-volume automated pick-and-place assembly with consistent placement accuracy
Applications
The LSHM-130-06.0-S-DV-A-S-TR is deployed in stacked processor module assemblies, wireless radio mezzanine cards, and compact industrial control systems where a 6.0 mm board separation with 60 signal channels is required. Its hermaphroditic contact design simplifies inventory by using the same connector on both mating boards. Engineers also select it for portable medical devices and handheld instruments where a reliable fine-pitch board-stack with defined standoff height is critical.
Specifications
| Factory Lead Time | 2 Weeks, 5 Days |
| YTEOL | 8.68 |
| Board Mounting Option | PEG |
| Body Breadth | 0.196inch |
| Body Depth | 0.293inch |
| Body Length | 0.776inch |
| Body/Shell Style | SOCKET |
| Connector Type | BOARD STACKING CONNECTOR |
| Contact Finish Mating | NOT SPECIFIED |
| Contact Gender | HERMAPHRODITIC |
| Contact Material | NOT SPECIFIED |
| Contact Pattern | RECTANGULAR |
| Contact Resistance | 15mΩ |
| Contact Style | BELLOWED TYPE |
| Dielectric Withstanding Voltage | 470VAC V |
| Durability | 100Cycles |
| Filter Feature | NO |
| Insulation Resistance | 1000000000Ω |
| Insulator Color | BLACK |
| Insulator Material | LIQUID CRYSTAL POLYMER |
| Mating Contact Pitch | 0.019inch |
| Mating Information | MULTIPLE MATING PARTS AVAILABLE |
| Mixed Contacts | NO |
| Mounting Style | STRAIGHT |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number Of PCB Rows | 2 |
| Number of Rows Loaded | 2 |
| Option | GENERAL PURPOSE |
| PCB Contact Pattern | RECTANGULAR |
| PCB Contact Row Spacing | 2.76mm |
| Plating Thickness | 30u inch |
| Polarization Key | POLARIZED HOUSING |
| Rated Current (Signal) | 2A |
| Reference Standard | UL |
| Terminal Pitch | 0.5mm |
| Termination Type | SURFACE MOUNT |
| Total Number of Contacts | 60 |
| UL Flammability Code | 94V-0 |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
| Country of Origin | Costa Rica, USA |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What stacking height and contact count does the LSHM-130-06.0-S-DV-A-S-TR provide?
The LSHM-130-06.0-S-DV-A-S-TR provides a 6.0 mm board stacking height with 60 total positions on a 0.50 mm pitch, creating a defined 6.0 mm gap between mated PCBs while supporting up to 60 individual signal connections in a compact hermaphroditic board-stack configuration.
Why is the hermaphroditic contact design of the LSHM-130-06.0-S-DV-A-S-TR advantageous for modular system designs?
The hermaphroditic contact design of the LSHM-130-06.0-S-DV-A-S-TR means the same part number mates with itself, eliminating the need to stock separate male and female connectors; this reduces BOM complexity and procurement risk in modular stacked systems where 60 signals must be routed between interchangeable daughter boards or expansion modules.
How does the 0.50 mm pitch of LSHM-130-06.0-S-DV-A-S-TR compare to a 1.00 mm pitch alternative when planning a compact wireless module stack?
At 0.50 mm pitch compared to 1.00 mm pitch, the LSHM-130-06.0-S-DV-A-S-TR halves the connector body length for an equivalent 60-position count, saving approximately 15 mm of PCB row length; in a compact wireless module where board area is limited, this reduction is critical for meeting size targets while maintaining 6.0 mm stacking clearance and 60-channel bandwidth.
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