LSHM-130-06.0-S-DV-A-S-K-TR SAMTEC Connector (Other) In Stock

SAMTEC LSHM-130-06.0-S-DV-A-S-K-TR is a 30-position shielded hermaphroditic board stacking connector with a 6.0 mm stack height and PEG board mounting option. Designed for high-density shielded mezzanine and stacked PCB interconnects with superior EMI performance. Available with tape-and-reel packaging and worldwide shipping.

ACTIVEConnectorVerified Jun 2026
Package / Visual Reference
LSHM-130-06.0-S-DV-A-S-K-TROther
Quick Facts
Manufacturer
SAMTEC
Package
Other
Pin Count
62
Lifecycle
ACTIVE
Category
Connector
Temp Range
-55.0°C to 125.0°C
RoHS
Compliant
Lead Time
3–7 business days
Shipping
DHL Express · Worldwide

Key Features

  • Shielded construction providing integrated EMI/RFI suppression for noise-sensitive high-frequency board stacking applications up to several GHz
  • Hermaphroditic contact design allowing the same connector to serve as both plug and receptacle, simplifying BOM and inventory management
  • 6.0 mm fixed stack height enabling precise controlled inter-board spacing in compact mezzanine and module-on-module assembly designs
  • PEG board mounting option providing mechanical retention during assembly and operation to resist pull-out forces in vibration-prone environments
  • Tape-and-reel (-TR) packaging supporting automated SMT pick-and-place for high-volume production with 2-week lead time availability

Applications

The LSHM-130-06.0-S-DV-A-S-K-TR is used in high-frequency mezzanine card interconnects, RF module stacking, and portable electronics where shielded board-to-board connections at a controlled 6.0 mm stack height are critical to EMI compliance. Its hermaphroditic contact design is particularly valuable in symmetric module-on-module architectures found in 5G small cell radios and software-defined radio platforms. Shielding performance makes it suitable for medical imaging modules and aerospace avionics stacks that must pass stringent conducted emissions tests.

Specifications

Factory Lead Time2 Weeks, 5 Days
YTEOL8.68
Additional FeatureSHIELDED
Board Mounting OptionPEG
Body Breadth0.196inch
Body Depth0.293inch
Body Length0.776inch
Connector TypeBOARD STACKING CONNECTOR
Contact Finish MatingNOT SPECIFIED
Contact GenderHERMAPHRODITIC
Contact MaterialNOT SPECIFIED
Contact PatternRECTANGULAR
Contact Resistance15
Contact StyleBELLOWED TYPE
Dielectric Withstanding Voltage470VAC V
Durability100Cycles
Filter FeatureNO
Insulation Resistance1000000000Ω
Insulator ColorBLACK
Insulator MaterialLIQUID CRYSTAL POLYMER
Mating Contact Pitch0.02inch
Mating InformationMULTIPLE MATING PARTS AVAILABLE
Mixed ContactsNO
Mounting Option 1LOCKING
Mounting StyleSTRAIGHT
Mounting TypeBOARD
Number Of ConnectorsONE
Number Of PCB Rows2
Number of Rows Loaded2
OptionGENERAL PURPOSE
PCB Contact PatternRECTANGULAR
PCB Contact Row Spacing3.7mm
Plating Thickness30u inch
Polarization KeyPOLARIZED HOUSING
Rated Current (Signal)2A
Reference StandardUL
Terminal Pitch0.5mm
Termination TypeSURFACE MOUNT
Total Number of Contacts60
UL Flammability Code94V-0
Withdrawl Force-Min2.22N
PackageOther

Compliance & Regulatory

RoHS StatusCompliant
Lead-FreeYes (Pb-Free)
ECCNEAR99
HTS Code8536.69.40.40
Country of OriginCosta Rica, Malaysia

Datasheet

LSHM-130-06.0-S-DV-A-S-K-TR Datasheet Download

Official datasheet from SAMTEC

Alternate & Equivalent Parts

No known alternates. Submit an RFQ and our team can suggest alternatives.

Frequently Asked Questions

How does the shielded construction of the LSHM-130-06.0-S-DV-A-S-K-TR benefit high-frequency board stacking designs above 1 GHz?

The integrated shield in the LSHM-130-06.0-S-DV-A-S-K-TR surrounds the signal contacts and provides a continuous ground enclosure across the 6.0 mm stack height, attenuating crosstalk between adjacent signal pairs and reducing radiated EMI in board stacking assemblies operating above 1 GHz. This is essential for 5G radio modules, high-speed SerDes links at 10 Gbps or higher, and imaging systems where radiated emissions must meet FCC Part 15 or ETSI EN 55032 limits.

What is the stack height of the LSHM-130-06.0-S-DV-A-S-K-TR and how does this 6.0 mm dimension constrain the maximum component height on the lower PCB?

The fixed stack height of 6.0 mm sets the clearance between the two mated PCBs. Accounting for the 1.6 mm thickness of a standard FR4 board, the usable component height on the lower PCB surface is approximately 4.4 mm below the upper board. This restricts tall components like aluminum electrolytic capacitors or wirewound inductors to under 4.0 mm body height in the region under the stacked board to avoid mechanical interference.

What does the hermaphroditic contact gender of the LSHM-130-06.0-S-DV-A-S-K-TR mean for board design and procurement?

Hermaphroditic contacts mean the same LSHM-130-06.0-S-DV-A-S-K-TR part number can be mounted on both the bottom and top PCB of a stacked assembly, eliminating the need to stock separate plug and receptacle variants. This simplifies BOM management to a single part number, reduces inventory carrying costs, and enables symmetric PCB layouts where either board can face up or down in a reversible module-on-module configuration.

What body dimensions does the LSHM-130-06.0-S-DV-A-S-K-TR have, and how many connectors fit on a 50 mm PCB edge?

The LSHM-130-06.0-S-DV-A-S-K-TR body measures 0.776 inches (19.7 mm) in length, 0.293 inches (7.4 mm) in depth, and 0.196 inches (5.0 mm) in breadth. Along a 50 mm PCB edge with standard 1 mm clearance between connectors, approximately 2 of these connectors can be placed end-to-end, providing 60 total shielded stacking positions along that edge with an occupied length of about 41.4 mm.

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Lead Time3-7 business days
MOQFrom 1 piece
ShippingDHL / FedEx / UPS
OriginChina (Authorized)

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