LSHM-130-06.0-F-DV-A-N-TR SAMTEC Connector (Other) In Stock
SAMTEC LSHM-130-06.0-F-DV-A-N-TR is a 60-position, 0.50 mm pitch Razor Beam high-speed hermaphroditic board-stacking connector. Supports high-frequency differential signals with a 6.0 mm stacking height. Available from authorized distributors with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 60
- Lifecycle
- ACTIVE
- Category
- Connector
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 60 positions at 0.50 mm pitch in a hermaphroditic board-stacking configuration for ultra-high-density high-speed interconnects
- 6.0 mm stacking height accommodates board-to-board spacing for mezzanine and stacked PCB system architectures
- Razor Beam high-speed contact geometry optimized for multi-gigabit differential signal transmission with low crosstalk
Applications
LSHM-130-06.0-F-DV-A-N-TR is used in high-speed board stacking applications such as FPGAs, network switch blades, and high-performance computing modules where differential signal integrity at multi-gigabit rates is required. Its 60-position, 0.50 mm pitch hermaphroditic design simplifies mating orientation and reduces connector inventory by using a single part on both mating boards. The 6.0 mm board-to-board stack height provides clearance for surface-mounted components beneath the connector on either board.
Specifications
| Pbfree Code | Yes |
| Factory Lead Time | 2 Weeks, 3 Days |
| YTEOL | 8.68 |
| Board Mounting Option | PEG |
| Body Breadth | 0.196inch |
| Body Depth | 0.293inch |
| Body Length | 0.776inch |
| Connector Type | BOARD STACKING CONNECTOR |
| Contact Finish Mating | NOT SPECIFIED |
| Contact Finish Termination | Matte Tin (Sn) - with Nickel (Ni) barrier |
| Contact Gender | HERMAPHRODITIC |
| Contact Material | NOT SPECIFIED |
| Contact Pattern | RECTANGULAR |
| Contact Resistance | 15mΩ |
| Contact Style | BELLOWED TYPE |
| Dielectric Withstanding Voltage | 470VAC V |
| Durability | 100Cycles |
| Filter Feature | NO |
| Insulation Resistance | 1000000000Ω |
| Insulator Color | BLACK |
| Insulator Material | LIQUID CRYSTAL POLYMER |
| JESD-609 Code | e3 |
| Mating Contact Pitch | 0.02inch |
| Mixed Contacts | NO |
| Mounting Option 1 | LOCKING |
| Mounting Style | STRAIGHT |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number Of PCB Rows | 2 |
| Number of Rows Loaded | 2 |
| PCB Contact Pattern | RECTANGULAR |
| PCB Contact Row Spacing | 3.7084mm |
| Plating Thickness | FLASH inch |
| Polarization Key | POLARIZED HOUSING |
| Rated Current (Signal) | 2A |
| Reference Standard | UL |
| Terminal Pitch | 0.508mm |
| Termination Type | SURFACE MOUNT |
| Total Number of Contacts | 60 |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
| Country of Origin | Costa Rica, Malaysia |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What stacking height and pitch does LSHM-130-06.0-F-DV-A-N-TR provide for board-to-board designs?
LSHM-130-06.0-F-DV-A-N-TR features a 6.0 mm board-to-board stacking height and a 0.50 mm contact pitch. This 6.0 mm stack height provides clearance for standard SMT components on the inner board faces while maintaining a compact overall assembly height in multi-board stack architectures.
How does the hermaphroditic design of LSHM-130-06.0-F-DV-A-N-TR simplify system assembly?
Because LSHM-130-06.0-F-DV-A-N-TR uses an identical hermaphroditic contact on both mating boards, only one part number is needed per board pair instead of a separate plug and receptacle. This reduces procurement SKUs, eliminates mismatched connector risk, and simplifies inventory management for manufacturers building multiple stacked board assemblies.
Is LSHM-130-06.0-F-DV-A-N-TR suitable for high-speed differential signal transmission?
Yes. LSHM-130-06.0-F-DV-A-N-TR is part of SAMTEC's Razor Beam high-speed connector family, which is optimized for differential pair routing at multi-gigabit data rates. The 0.50 mm pitch geometry minimizes signal crosstalk between adjacent pairs and supports high-speed protocols used in networking, FPGA, and data center computing boards.
What is the body envelope of LSHM-130-06.0-F-DV-A-N-TR and how does it influence PCB layout?
LSHM-130-06.0-F-DV-A-N-TR has a body length of approximately 0.776 inch (19.7 mm), a breadth of 0.196 inch (4.98 mm), and a depth of 0.293 inch (7.44 mm). These compact body dimensions allow the 60-position connector to fit within tight PCB keep-out zones typical of server blades and high-density mezzanine cards.
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