LSHM-130-06.0-F-DV-A-N-K-TR SAMTEC Connector (Other) In Stock
SAMTEC LSHM-130-06.0-F-DV-A-N-K-TR is a 60-position, dual-row, hermaphroditic board-stacking connector with a 6.0 mm stack height and 0.50 mm pitch. Designed for high-density mezzanine interconnect, it features peg board-mounting, dual-voltage support, and tape-and-reel packaging for automated SMT assembly.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 60
- Lifecycle
- ACTIVE
- Category
- Connector
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 60-position dual-row hermaphroditic board-stacking design at 0.50 mm pitch enables very high-density mezzanine connections in compact module form factors
- 6.0 mm stack height provides precise board-to-board spacing for controlled-impedance high-speed differential signal routing between stacked PCBs
- Dual-voltage (DV) contact configuration accommodates both high-speed signal and power rails within a single compact connector footprint
- Peg (PEG) board-mounting option adds mechanical retention during reflow soldering and improves board-to-board alignment accuracy
- 1-week factory lead time and tape-and-reel packaging enable rapid procurement and automated SMT assembly for time-sensitive production programs
Applications
The LSHM-130-06.0-F-DV-A-N-K-TR is used in high-speed mezzanine board stacking for embedded computing modules, FPGA daughter cards, and compact RF transceiver assemblies where a 6.0 mm stack height and 60-pin dual-row layout are required. Its hermaphroditic contact design allows the same part to be used on both the host and mezzanine boards, simplifying BOM management for stacked PCB systems. The connector is also deployed in aerospace and defense electronics where reliable high-density board-to-board connections in a small footprint are critical.
Specifications
| Factory Lead Time | 1Week |
| YTEOL | 8.68 |
| Board Mounting Option | PEG |
| Body Breadth | 0.196inch |
| Body Depth | 0.293inch |
| Body Length | 0.776inch |
| Connector Type | BOARD STACKING CONNECTOR |
| Contact Finish Mating | NOT SPECIFIED |
| Contact Gender | HERMAPHRODITIC |
| Contact Material | NOT SPECIFIED |
| Contact Pattern | RECTANGULAR |
| Contact Resistance | 15mΩ |
| Contact Style | BELLOWED TYPE |
| DIN Conformance | NO |
| Dielectric Withstanding Voltage | 470VAC V |
| Durability | 100Cycles |
| Filter Feature | NO |
| IEC Conformance | NO |
| Insulation Resistance | 1000000000Ω |
| Insulator Color | BLACK |
| Insulator Material | LIQUID CRYSTAL POLYMER |
| MIL Conformance | NO |
| Mating Contact Pitch | 0.02inch |
| Mating Information | MULTIPLE MATING PARTS AVAILABLE |
| Mixed Contacts | NO |
| Mounting Option 1 | LOCKING |
| Mounting Style | STRAIGHT |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number Of PCB Rows | 2 |
| Number of Rows Loaded | 2 |
| Option | GENERAL PURPOSE |
| PCB Contact Pattern | RECTANGULAR |
| PCB Contact Row Spacing | 3.7mm |
| Plating Thickness | 3u inch |
| Polarization Key | POLARIZED HOUSING |
| Rated Current (Signal) | 2A |
| Reference Standard | UL |
| Terminal Pitch | 0.5mm |
| Termination Type | SURFACE MOUNT |
| Total Number of Contacts | 60 |
| UL Flammability Code | 94V-0 |
| Withdrawl Force-Min | 2.22N |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
| Country of Origin | Costa Rica, USA |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What stack height and contact count does the LSHM-130-06.0-F-DV-A-N-K-TR provide for board-to-board applications?
The LSHM-130-06.0-F-DV-A-N-K-TR provides a 6.0 mm board-to-board stack height with 60 total contact positions in a dual-row, 0.50 mm pitch hermaphroditic configuration. This combination suits high-density mezzanine stacking where precise board separation of 6.0 mm is needed for clearance of tall components on either PCB.
What advantage does the hermaphroditic contact design of the LSHM-130-06.0-F-DV-A-N-K-TR offer compared to gender-specific connectors?
A hermaphroditic contact design means the LSHM-130-06.0-F-DV-A-N-K-TR is mechanically identical on both mating boards, eliminating the need to stock separate male and female parts. This reduces SKU count by 50%, simplifies supply chain management, and prevents incorrect assembly polarity mistakes common when sourcing two different mating connector halves.
For an FPGA mezzanine module requiring a 6 mm board-to-board gap and over 50 high-speed LVDS pairs, is the LSHM-130-06.0-F-DV-A-N-K-TR suitable?
Yes. The LSHM-130-06.0-F-DV-A-N-K-TR provides 60 contact positions at a 0.50 mm pitch across 2 rows, sufficient for 25 differential LVDS pairs plus ground contacts. The 6.0 mm stack height maintains consistent board separation for controlled impedance traces, and the dual-voltage support allows power pins to share the same connector as high-speed signal pins in FPGA mezzanine designs.
How does the 1-week factory lead time of the LSHM-130-06.0-F-DV-A-N-K-TR affect procurement planning for prototype and production schedules?
With a 1-week factory lead time, the LSHM-130-06.0-F-DV-A-N-K-TR is available nearly on-demand, making it an excellent choice for rapid prototype builds and engineering validation test (EVT) schedules where waiting 8 to 15 weeks for specialty connectors would delay product milestones. Buyers can confidently order small prototype quantities and transition to volume tape-and-reel orders within the same short lead time window.
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