LSHM-130-04.0-F-DV-A-S-TR SAMTEC Connector (Other) In Stock
SAMTEC LSHM-130-04.0-F-DV-A-S-TR is a 60-position Razor Beam high-speed hermaphroditic terminal/socket strip with 0.50 mm pitch, designed for board stacking with a 4.0 mm stack height. Body dimensions are 0.785" × 0.215" with peg mounting for precise PCB alignment and matte tin termination. Supplied in tape-and-reel with worldwide shipping for demanding high-speed interconnect applications.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 62
- Lifecycle
- ACTIVE
- Category
- Connector
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 60-position hermaphroditic contact design at 0.50 mm pitch enabling high-speed board stacking at a fixed 4.0 mm stack height
- Razor Beam technology supports high-speed differential signaling with controlled impedance for data rates exceeding 10 Gbps
- Peg mounting option combined with 0.785 inch body length ensures precise PCB-to-PCB alignment during assembly and operation
Applications
LSHM-130-04.0-F-DV-A-S-TR is engineered for high-speed board-to-board stacking in servers, networking switches, high-performance computing modules, and FMC (FPGA Mezzanine Card) applications where 60 signals must traverse a precisely controlled 4.0 mm board gap at multi-gigabit speeds. The hermaphroditic Razor Beam contact design allows mating with identical connectors on both boards, simplifying inventory management in stacking configurations. Its 0.50 mm pitch and controlled-impedance contacts are suitable for PCIe, USB 3.0, SATA, and other high-speed serial protocols.
Specifications
| Pbfree Code | Yes |
| Factory Lead Time | 5 Weeks, 1 Day |
| YTEOL | 8.68 |
| Board Mounting Option | PEG |
| Body Breadth | 0.196inch |
| Body Depth | 0.215inch |
| Body Length | 0.785inch |
| Connector Type | BOARD STACKING CONNECTOR |
| Contact Finish Mating | NOT SPECIFIED |
| Contact Finish Termination | Matte Tin (Sn) - with Nickel (Ni) barrier |
| Contact Gender | HERMAPHRODITIC |
| Contact Material | NOT SPECIFIED |
| Contact Pattern | RECTANGULAR |
| Contact Resistance | 15mΩ |
| Contact Style | BELLOWED TYPE |
| Dielectric Withstanding Voltage | 470VAC V |
| Durability | 100Cycles |
| Filter Feature | NO |
| Insulation Resistance | 1000000000Ω |
| Insulator Color | BLACK |
| Insulator Material | LIQUID CRYSTAL POLYMER |
| JESD-609 Code | e3 |
| Mating Contact Pitch | 0.02inch |
| Mixed Contacts | NO |
| Mounting Option 1 | LOCKING |
| Mounting Style | STRAIGHT |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number Of PCB Rows | 2 |
| Number of Rows Loaded | 2 |
| PCB Contact Pattern | RECTANGULAR |
| PCB Contact Row Spacing | 3.7084mm |
| Plating Thickness | FLASH inch |
| Polarization Key | POLARIZED HOUSING |
| Rated Current (Signal) | 2A |
| Reference Standard | UL |
| Terminal Pitch | 0.508mm |
| Termination Type | SURFACE MOUNT |
| Total Number of Contacts | 60 |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
| Country of Origin | Costa Rica, USA |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What stack height does LSHM-130-04.0-F-DV-A-S-TR provide and how does this affect board-to-board spacing in a server design?
LSHM-130-04.0-F-DV-A-S-TR provides a fixed 4.0 mm board-to-board stack height. In a server blade or FPGA mezzanine application, this 4.0 mm gap determines the minimum clearance between PCBs, allowing low-profile components up to approximately 3.0 mm tall on the inner board surfaces while maintaining reliable 60-pin electrical contact and mechanical rigidity through the hermaphroditic mating interface.
What data rates can LSHM-130-04.0-F-DV-A-S-TR support with its Razor Beam contact technology?
LSHM-130-04.0-F-DV-A-S-TR uses SAMTEC's Razor Beam contact technology, which supports high-speed differential signaling at data rates exceeding 10 Gbps per channel. This makes it capable of carrying PCIe Gen 3 (8 GT/s), USB 3.1 Gen 2 (10 Gbps), and SATA III (6 Gbps) signals across the 4.0 mm board-to-board gap through all 60 positions without significant signal degradation.
How does the hermaphroditic contact design of LSHM-130-04.0-F-DV-A-S-TR simplify high-speed mezzanine card procurement?
The hermaphroditic design means both the host board and the mezzanine card use identical LSHM-130-04.0-F-DV-A-S-TR connectors — there is no separate male/female pair to manage. This reduces the number of distinct part numbers to stock by half, simplifies BOM management, and eliminates the risk of ordering mismatched connector genders for the 60-position, 0.50 mm pitch stack in FPGA and server mezzanine applications.
What is the pitch and pin count of LSHM-130-04.0-F-DV-A-S-TR, and how does the peg mounting option assist SMT placement?
LSHM-130-04.0-F-DV-A-S-TR has 60 positions at 0.50 mm pitch in a body measuring 0.785 inches long. The peg (PEG) board mounting option inserts into a locating hole in the PCB during surface mount placement, preventing lateral shift of the connector across its 60-pin footprint during solder reflow, which is critical for maintaining 0.50 mm pitch pad registration and avoiding solder bridges.
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