LSHM-130-02.5-L-DV-A-N-TR SAMTEC Connector (Other) In Stock
SAMTEC LSHM-130-02.5-L-DV-A-N-TR is a 60-position dual-row board stacking SMT connector with 0.80 mm pitch and gold-plated mating contacts rated for high-speed signal integrity. Supports 2.5 mm stack height and tin-over-nickel termination. In stock globally with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 60
- Lifecycle
- ACTIVE
- Category
- Connector
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 60-position dual-row board stacking SMT connector with 0.80 mm pitch for ultra-fine-pitch high-density board-to-board interconnects
- Gold mating contacts over nickel barrier ensuring low contact resistance and extended mating cycle reliability
- 2.5 mm fixed stack height with PEG board mounting option for precise and mechanically stable board-to-board spacing
- Tape-and-reel (TR) packaging supporting automated pick-and-place SMT assembly in high-volume production lines
Applications
The LSHM-130-02.5-L-DV-A-N-TR is used in high-density board stacking applications in aerospace avionics, ruggedized military electronics, and compact industrial embedded systems requiring a 0.80 mm pitch 60-position dual-row SMT board-to-board connector with a precise 2.5 mm stack height. Its gold mating contacts and high-reliability construction support demanding signal integrity requirements in multi-board module assemblies. Tape-and-reel packaging enables efficient automated SMT assembly for volume production.
Specifications
| Pbfree Code | Yes |
| Factory Lead Time | 1Week |
| YTEOL | 8.68 |
| Board Mounting Option | PEG |
| Body Breadth | 0.196inch |
| Body Depth | 0.156inch |
| Body Length | 0.776inch |
| Connector Type | BOARD STACKING CONNECTOR |
| Contact Finish Mating | GOLD |
| Contact Finish Termination | Tin (Sn) - with Nickel (Ni) barrier |
| Contact Gender | HERMAPHRODITIC |
| Contact Material | PHOSPHOR BRONZE |
| Contact Pattern | RECTANGULAR |
| Contact Resistance | 15mΩ |
| Contact Style | BELLOWED TYPE |
| Dielectric Withstanding Voltage | 470VAC V |
| Durability | 100Cycles |
| Filter Feature | NO |
| Insulation Resistance | 1000000000Ω |
| Insulator Color | BLACK |
| Insulator Material | LIQUID CRYSTAL POLYMER |
| JESD-609 Code | e3 |
| Mating Contact Pitch | 0.02inch |
| Mixed Contacts | NO |
| Mounting Option 1 | LOCKING |
| Mounting Style | STRAIGHT |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number Of PCB Rows | 2 |
| Number of Rows Loaded | 2 |
| PCB Contact Pattern | RECTANGULAR |
| PCB Contact Row Spacing | 3.7084mm |
| Plating Thickness | 10u inch |
| Polarization Key | POLARIZED HOUSING |
| Rated Current (Signal) | 2A |
| Reference Standard | UL |
| Terminal Pitch | 0.508mm |
| Termination Type | SURFACE MOUNT |
| Total Number of Contacts | 60 |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
| Country of Origin | Costa Rica, USA |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What stack height does the LSHM-130-02.5-L-DV-A-N-TR provide and why does the fixed 2.5 mm height matter for module designs?
The LSHM-130-02.5-L-DV-A-N-TR provides a fixed 2.5 mm board-to-board stack height. In multi-board module assemblies, a fixed and predictable gap is essential for managing clearances between stacked PCBs, ensuring mechanical alignment of components on opposing boards, and controlling impedance on high-speed signal traces that cross the connector interface. The PEG board mounting option adds mechanical retention to maintain this 2.5 mm spacing under vibration in aerospace and ruggedized industrial deployments.
For a compact avionics module needing 60 signals between two stacked boards, how does LSHM-130-02.5-L-DV-A-N-TR address space constraints?
The LSHM-130-02.5-L-DV-A-N-TR delivers 60 positions in a dual-row 0.80 mm pitch footprint measuring approximately 0.776 inch body length and 0.196 inch body width. This fine 0.80 mm pitch packs 60 positions into a board area roughly 30% smaller than a comparable 1.27 mm pitch connector, directly reducing the footprint on constrained avionics PCBs. The 2.5 mm stack height also keeps the overall module profile low for installation in tight avionics chassis slots.
Why is gold mating contact finish specified in LSHM-130-02.5-L-DV-A-N-TR for aerospace and defense board stacking?
Gold mating contacts on LSHM-130-02.5-L-DV-A-N-TR provide extremely low and stable contact resistance across all 60 positions, immunity to oxidation, and reliable performance under repeated mate-unmate cycles. For aerospace applications, gold plating meets MIL-spec corrosion and contact resistance requirements over the connector's operational life at elevated temperatures. The nickel barrier beneath the gold prevents base metal diffusion, preserving contact performance across thousands of mating cycles in vibration and thermal cycling environments.
How does LSHM-130-02.5-L-DV-A-N-TR compare to LSHM connectors with 1.5 mm or 3.5 mm stack heights for board layout flexibility?
The LSHM-130-02.5-L-DV-A-N-TR is optimized for a 2.5 mm board separation, which sits between the 1.5 mm ultra-low-profile and 3.5 mm extended-height LSHM variants. A 2.5 mm gap accommodates taller SMT components (typically up to 2.0 mm tall) mounted between the boards, whereas 1.5 mm variants restrict component height to under 1.0 mm. Compared to 3.5 mm variants, the 2.5 mm option reduces module height by 1 mm, which compounds significantly in multi-tier board stack assemblies used in aerospace line-replaceable units.
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