LSHM-130-02.5-F-DV-A-N-TR SAMTEC Connector (Other) In Stock

SAMTEC LSHM-130-02.5-F-DV-A-N-TR is a 60-position, 0.50 mm pitch Razor Beam high-speed hermaphroditic board stacking connector in a compact 0.776 x 0.156 x 0.196 inch body. Features matte tin-over-nickel termination, peg mounting, and tape-and-reel packaging for automated SMT assembly. Available from authorized distributors with worldwide shipping.

ACTIVEConnectorVerified Jun 2026
Package / Visual Reference
LSHM-130-02.5-F-DV-A-N-TROther
Quick Facts
Manufacturer
SAMTEC
Package
Other
Pin Count
60
Lifecycle
ACTIVE
Category
Connector
Temp Range
-55.0°C to 125.0°C
RoHS
Compliant
Lead Time
3–7 business days
Shipping
DHL Express · Worldwide

Key Features

  • 60-position hermaphroditic contact design eliminates male/female pairing confusion, with both mating halves being identical at 0.50 mm pitch for simplified inventory management
  • Razor Beam high-speed signal architecture supports differential pair routing and high-frequency data transmission in compact 0.776 x 0.156 inch board stacking configurations
  • Peg mounting (PEG) board option provides mechanical alignment and retention during reflow soldering, with tape-and-reel (TR) packaging for automated pick-and-place assembly

Applications

The LSHM-130-02.5-F-DV-A-N-TR is designed for high-speed board-to-board stacking applications in compact embedded computing, communications hardware, and data acquisition systems requiring 60-position connectivity at 0.50 mm pitch. Its hermaphroditic Razor Beam contact design supports high-frequency signal transmission between stacked PCBs in FPGA mezzanine cards, SoM carrier boards, and miniaturized instrumentation modules. The tape-and-reel format and SMT termination make it compatible with automated high-volume PCB assembly processes in consumer and industrial electronics.

Specifications

Pbfree CodeYes
YTEOL8.68
Board Mounting OptionPEG
Body Breadth0.196inch
Body Depth0.156inch
Body Length0.776inch
Connector TypeBOARD STACKING CONNECTOR
Contact Finish MatingNOT SPECIFIED
Contact Finish TerminationMatte Tin (Sn) - with Nickel (Ni) barrier
Contact GenderHERMAPHRODITIC
Contact MaterialNOT SPECIFIED
Contact PatternRECTANGULAR
Contact Resistance15
Contact StyleBELLOWED TYPE
Dielectric Withstanding Voltage470VAC V
Durability100Cycles
Filter FeatureNO
Insulation Resistance1000000000Ω
Insulator ColorBLACK
Insulator MaterialLIQUID CRYSTAL POLYMER
JESD-609 Codee3
Mating Contact Pitch0.02inch
Mixed ContactsNO
Mounting Option 1LOCKING
Mounting StyleSTRAIGHT
Mounting TypeBOARD
Number Of ConnectorsONE
Number Of PCB Rows2
Number of Rows Loaded2
PCB Contact PatternRECTANGULAR
PCB Contact Row Spacing3.7084mm
Plating ThicknessFLASH inch
Polarization KeyPOLARIZED HOUSING
Rated Current (Signal)2A
Reference StandardUL
Terminal Pitch0.508mm
Termination TypeSURFACE MOUNT
Total Number of Contacts60
PackageOther

Compliance & Regulatory

RoHS StatusCompliant
Lead-FreeYes (Pb-Free)
ECCNEAR99
HTS Code8536.69.40.40
Country of OriginCosta Rica, Malaysia

Datasheet

LSHM-130-02.5-F-DV-A-N-TR Datasheet Download

Official datasheet from SAMTEC

Alternate & Equivalent Parts

No known alternates. Submit an RFQ and our team can suggest alternatives.

Frequently Asked Questions

What advantage does the hermaphroditic contact design of the LSHM-130-02.5-F-DV-A-N-TR provide over conventional male/female connectors?

The LSHM-130-02.5-F-DV-A-N-TR uses hermaphroditic contacts, meaning both mating halves are identical components across all 60 positions. This eliminates the need to stock and manage separate male and female parts, reduces procurement complexity, and prevents mis-pairing errors during PCB assembly. In high-mix production environments, using a single part number for both sides of the 0.50 mm pitch stacking interface significantly simplifies supply chain management.

How does the 0.50 mm pitch of the LSHM-130-02.5-F-DV-A-N-TR enable high-density board stacking?

The 0.50 mm pitch allows 60 positions to fit within a 0.776 inch (19.7 mm) body length, achieving approximately twice the connection density of standard 1.00 mm pitch board stacking connectors. This ultra-fine pitch is part of SAMTEC's Razor Beam high-speed design, supporting differential pair signal routing for SerDes, USB 3.0, and similar high-frequency interfaces in stacked mezzanine card configurations used in embedded computing and telecommunications equipment.

What is the role of the peg (PEG) mounting feature in the LSHM-130-02.5-F-DV-A-N-TR during assembly?

The PEG (peg) board mounting option provides physical alignment pins that insert into matching PCB holes, precisely locating the connector body relative to the pads before and during reflow soldering. This is critical for a fine-pitch 0.50 mm connector with 60 positions, where even small misalignment can cause solder bridges or open joints. The pegs also provide additional mechanical retention to prevent the connector from shifting during automated SMT reflow processes at elevated temperatures.

In which stacked PCB architectures is the LSHM-130-02.5-F-DV-A-N-TR preferred over lower-density alternatives?

The LSHM-130-02.5-F-DV-A-N-TR is preferred in FPGA mezzanine card (FMC), System-on-Module (SoM) carrier board, and high-speed data acquisition architectures where 60 signals must traverse a stacking interface within a body shorter than 20 mm. Compared to 1.27 mm pitch alternatives, this 0.50 mm pitch connector reduces the connector footprint by more than 60%, enabling compact multi-board assemblies in medical devices, test instrumentation, and software-defined radio platforms.

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Lead Time3-7 business days
MOQFrom 1 piece
ShippingDHL / FedEx / UPS
OriginChina (Authorized)

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Rajesh Patel
Procurement Manager, VoltEdge Energy, India