LSHM-120-L3.0-F-DV-A-S-K-TR SAMTEC Connector (Other) In Stock

SAMTEC LSHM-120-L3.0-F-DV-A-S-K-TR is a shielded 40-position 0.50 mm pitch Razor Beam hermaphroditic board-stacking connector at 3.0 mm stack height. EMI shielding improves signal integrity for high-speed mezzanine applications. From $6.00 in stock, worldwide shipping available.

ACTIVEConnectorVerified Jul 2026
Package / Visual Reference
LSHM-120-L3.0-F-DV-A-S-K-TROther
Quick Facts
Manufacturer
SAMTEC
Package
Other
Pin Count
42
Lifecycle
ACTIVE
Category
Connector
Temp Range
-55.0°C to 125.0°C
RoHS
Compliant
Lead Time
3–7 business days
Shipping
DHL Express · Worldwide

What are the key features of LSHM-120-L3.0-F-DV-A-S-K-TR?

  • 40-position 0.50 mm pitch hermaphroditic board-stacking connector with integrated EMI shielding for noise immunity
  • 3.0 mm board-to-board stack height (Razor Beam series) enables low-profile shielded mezzanine interconnections
  • Shielded (S) construction reduces crosstalk and electromagnetic interference in multi-GHz differential signal routing
  • Tape-and-reel (TR) packaging supports automated SMT pick-and-place assembly for volume PCB production

What is LSHM-120-L3.0-F-DV-A-S-K-TR used for?

LSHM-120-L3.0-F-DV-A-S-K-TR is designed for EMI-sensitive board-to-board mezzanine interconnections in RF front-end modules, 5G wireless platforms, and high-frequency computing systems. The integrated shield reduces crosstalk between differential pairs operating at multi-GHz rates across 40 contacts at 0.50 mm pitch, providing better signal fidelity than the unshielded variant. This connector is preferred in applications where adjacent board-level interference or dense RF environments could degrade high-speed serial link performance.

What are the specifications of LSHM-120-L3.0-F-DV-A-S-K-TR?

YTEOL8.68
Additional FeatureSHIELDED
Board Mounting OptionPEG
Body Breadth0.196inch
Body Depth0.175inch
Body Length0.579inch
Connector TypeBOARD STACKING CONNECTOR
Contact Finish MatingNOT SPECIFIED
Contact GenderHERMAPHRODITIC
Contact MaterialNOT SPECIFIED
Contact PatternRECTANGULAR
Contact Resistance15
Contact StyleBELLOWED TYPE
Dielectric Withstanding Voltage470VAC V
Durability100Cycles
Filter FeatureNO
Insulation Resistance1000000000Ω
Insulator ColorBLACK
Insulator MaterialLIQUID CRYSTAL POLYMER
Mating Contact Pitch0.02inch
Mating InformationMULTIPLE MATING PARTS AVAILABLE
Mixed ContactsNO
Mounting Option 1LOCKING
Mounting StyleSTRAIGHT
Mounting TypeBOARD
Number Of ConnectorsONE
Number Of PCB Rows2
Number of Rows Loaded2
OptionGENERAL PURPOSE
PCB Contact PatternRECTANGULAR
PCB Contact Row Spacing3.7mm
Plating Thickness3u inch
Polarization KeyPOLARIZED HOUSING
Rated Current (Signal)2A
Reference StandardUL
Terminal Pitch0.5mm
Termination TypeSURFACE MOUNT
Total Number of Contacts40
UL Flammability Code94V-0
Withdrawl Force-Min2.22N
PackageOther

Compliance & Regulatory

RoHS StatusCompliant
Lead-FreeYes (Pb-Free)
ECCNEAR99
HTS Code8536.69.40.40

Where can I find the LSHM-120-L3.0-F-DV-A-S-K-TR datasheet?

LSHM-120-L3.0-F-DV-A-S-K-TR Datasheet Download

Official datasheet from SAMTEC

What are equivalent replacements for LSHM-120-L3.0-F-DV-A-S-K-TR?

No known alternates. Submit an RFQ and our team can suggest alternatives.

Frequently Asked Questions

What advantage does the shielding in LSHM-120-L3.0-F-DV-A-S-K-TR provide over unshielded variants?

The S designation in LSHM-120-L3.0-F-DV-A-S-K-TR indicates integrated EMI shielding that reduces crosstalk and electromagnetic coupling at signal frequencies above 1 GHz, where unshielded 40-pin mezzanine connectors at 0.50 mm pitch can introduce inter-connector interference. The shield improves insertion loss and maintains differential pair integrity in high-density RF module stacking and communications board designs.

Which RF or high-speed module designs specifically require LSHM-120-L3.0-F-DV-A-S-K-TR's shielded construction?

LSHM-120-L3.0-F-DV-A-S-K-TR is specified for RF transceiver modules, 5G mmWave daughter-cards, and radar sensor boards operating above 10 GHz, where electromagnetic crosstalk between the 40 pins at 0.50 mm pitch could corrupt differential signal pairs. The 3.0 mm stack height combined with EMI shielding also suits FPGA-to-RF interface stacking in phased-array antenna systems requiring tight electromagnetic isolation.

How should engineers choose between LSHM-120-L3.0-F-DV-A-N-K-TR and LSHM-120-L3.0-F-DV-A-S-K-TR for a board-stacking design?

Engineers should select LSHM-120-L3.0-F-DV-A-S-K-TR when signal frequencies exceed 1 GHz or when the 40-pin mezzanine board operates in environments with nearby RF interference that could couple into the 0.50 mm pitch connector. The shielded version adds a small cost premium over the unshielded N variant but prevents EMI-induced bit error rate degradation in high-speed serial links such as PCIe, USB 3.0, or proprietary multi-gigabit differential protocols.

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About SAMTEC

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AvailabilityIn Stock
Reference Price (USD)
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Lead Time3-7 business days
MOQFrom 1 piece
ShippingDHL / FedEx / UPS
OriginChina (Authorized)

Response within 24 hours · Worldwide shipping

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Rajesh Patel
Procurement Manager, VoltEdge Energy, India