LSHM-120-L1-L-DH-A-S-K-TR SAMTEC Connector (Other) In Stock
SAMTEC LSHM-120-L1-L-DH-A-S-K-TR is a 40-position Razor Beam high-speed hermaphroditic board stacking connector with 0.50 mm pitch and gold-plated contacts. Features plug-receptacle body style with PEG board mounting and matte tin termination for reliable high-frequency signal transmission. Ideal for compact mezzanine board stacking applications in communications and test equipment.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 42
- Lifecycle
- ACTIVE
- Category
- Connector
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 40-position hermaphroditic 0.50 mm pitch Razor Beam design enabling high-speed signal transmission in ultra-compact board stacking configurations
- Gold-plated mating contacts with matte tin termination providing low insertion loss and reliable electrical contact for high-frequency signals
- PEG board mounting with plug-receptacle body style allowing secure mechanical retention in mezzanine and daughter card stacking assemblies
Applications
The LSHM-120-L1-L-DH-A-S-K-TR is designed for high-speed board-to-board stacking applications in telecommunications, test and measurement equipment, and compact computing modules. Its 40-position hermaphroditic design with 0.50 mm pitch enables high-density signal routing between stacked PCBs with minimal connector footprint. The gold-plated contacts and Razor Beam technology make it well suited for high-frequency differential signal transmission in FPGAs, networking cards, and signal processing boards.
Specifications
| Factory Lead Time | 3Weeks |
| YTEOL | 8.68 |
| Board Mounting Option | PEG |
| Body Breadth | 0.202inch |
| Body Depth | 0.351inch |
| Body Length | 0.589inch |
| Body/Shell Style | PLUG-RECEPTACLE |
| Connector Type | BOARD STACKING CONNECTOR |
| Contact Finish Mating | GOLD |
| Contact Finish Termination | Matte Tin (Sn) |
| Contact Gender | HERMAPHRODITIC |
| Contact Material | PHOSPHOR BRONZE |
| Contact Pattern | RECTANGULAR |
| Filter Feature | NO |
| Insulator Color | BLACK |
| Insulator Material | LIQUID CRYSTAL POLYMER |
| JESD-609 Code | e3 |
| Mating Contact Pitch | 0.02inch |
| Mixed Contacts | NO |
| Mounting Option 1 | LOCKING |
| Mounting Style | RIGHT ANGLE |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number Of PCB Rows | 2 |
| Number of Rows Loaded | 2 |
| PCB Contact Pattern | RECTANGULAR |
| PCB Contact Row Spacing | 2.7432mm |
| Plating Thickness | 10u inch |
| Polarization Key | POLARIZED HOUSING |
| Rated Current (Signal) | 1.9A |
| Reference Standard | UL |
| Terminal Pitch | 0.508mm |
| Termination Type | SURFACE MOUNT |
| Total Number of Contacts | 40 |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
| Country of Origin | Costa Rica, USA |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What pitch and pin count does the SAMTEC LSHM-120-L1-L-DH-A-S-K-TR support for board stacking?
The LSHM-120-L1-L-DH-A-S-K-TR offers 40 positions at a 0.50 mm pitch in a hermaphroditic plug-receptacle configuration. Its body measures 0.589 inches in length with gold-plated mating contacts, supporting high-density board stacking in compact electronic assemblies.
Why choose a hermaphroditic connector design like LSHM-120-L1-L-DH-A-S-K-TR for mezzanine board applications?
A hermaphroditic connector allows both the host and daughter PCBs to use the same 40-position component, reducing part number management and inventory complexity. The LSHM-120-L1-L-DH-A-S-K-TR with 0.50 mm pitch also simplifies design by eliminating the need to specify separate plug and socket parts for mezzanine configurations.
How does the PEG board mounting feature of LSHM-120-L1-L-DH-A-S-K-TR improve assembly reliability?
PEG board mounting adds mechanical pegs that anchor the connector body to the PCB before soldering, preventing movement during reflow and improving solder joint quality for the 40-position 0.50 mm pitch footprint. This is especially important in high-vibration environments such as industrial test equipment or automotive electronics boards where connector shift can cause cold joints.
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