LSHM-120-02.5-L-DV-A-S-K-TR SAMTEC Connector (Other) In Stock
SAMTEC LSHM-120-02.5-L-DV-A-S-K-TR is a shielded board stacking connector with 20 positions, 0.50 mm pitch, 2.5 mm stack height, and matte tin termination, offering EMI shielding for high-density surface mount board-to-board applications.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 42
- Lifecycle
- ACTIVE
- Category
- Connector
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- Shielded board stacking connector providing EMI suppression for high-speed signal integrity in dense PCB assemblies
- 2.5 mm board stacking height with 0.50 mm pitch enabling ultra-compact dual-PCB system designs
- Matte tin with nickel barrier termination finish ensuring reliable solderability and corrosion resistance in SMT assembly
Applications
The LSHM-120-02.5-L-DV-A-S-K-TR shielded board stacking connector is designed for high-speed signal transmission in wireless modules, IoT devices, and compact embedded computing systems where EMI shielding is critical. Its 2.5 mm stack height and 0.50 mm pitch enable board-to-board interconnection in space-constrained consumer electronics and industrial sensor modules. Tape and reel packaging with peg board mounting facilitates accurate automated SMT placement for high-volume production of shielded multi-board assemblies.
Specifications
| Factory Lead Time | 4Weeks |
| YTEOL | 8.68 |
| Additional Feature | SHIELDED |
| Board Mounting Option | PEG |
| Body Breadth | 0.196inch |
| Body Depth | 0.156inch |
| Body Length | 0.579inch |
| Connector Type | BOARD STACKING CONNECTOR |
| Contact Finish Mating | NOT SPECIFIED |
| Contact Finish Termination | Matte Tin (Sn) - with Nickel (Ni) barrier |
| Contact Gender | HERMAPHRODITIC |
| Contact Material | NOT SPECIFIED |
| Contact Pattern | RECTANGULAR |
| Contact Resistance | 15mΩ |
| Contact Style | BELLOWED TYPE |
| DIN Conformance | NO |
| Dielectric Withstanding Voltage | 470VAC V |
| Durability | 100Cycles |
| Filter Feature | NO |
| IEC Conformance | NO |
| Insulation Resistance | 1000000000Ω |
| Insulator Color | BLACK |
| Insulator Material | LIQUID CRYSTAL POLYMER |
| JESD-609 Code | e3 |
| MIL Conformance | NO |
| Mating Contact Pitch | 0.02inch |
| Mating Information | MULTIPLE MATING PARTS AVAILABLE |
| Mixed Contacts | NO |
| Mounting Option 1 | LOCKING |
| Mounting Style | STRAIGHT |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number Of PCB Rows | 2 |
| Number of Rows Loaded | 2 |
| Option | GENERAL PURPOSE |
| PCB Contact Pattern | RECTANGULAR |
| PCB Contact Row Spacing | 3.7mm |
| Plating Thickness | 10u inch |
| Polarization Key | POLARIZED HOUSING |
| Rated Current (Signal) | 2A |
| Reference Standard | UL |
| Terminal Pitch | 0.5mm |
| Termination Type | SURFACE MOUNT |
| Total Number of Contacts | 40 |
| UL Flammability Code | 94V-0 |
| Withdrawl Force-Min | 2.22N |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
| Country of Origin | Costa Rica, Malaysia |
Alternate & Equivalent Parts
Compatible alternatives and drop-in replacements for LSHM-120-02.5-L-DV-A-S-K-TR:
Frequently Asked Questions
What shielding benefit does the LSHM-120-02.5-L-DV-A-S-K-TR provide for high-speed board stacking applications?
The LSHM-120-02.5-L-DV-A-S-K-TR includes a conductive shield enclosure that reduces electromagnetic interference (EMI) coupling between the connector and adjacent circuitry. This shielding is particularly valuable in RF-sensitive designs, wireless communication modules, and high-speed digital systems where unshielded board stacking connectors at 0.50 mm pitch could otherwise introduce noise or crosstalk across the 20 signal contacts.
What is the board stacking height of the LSHM-120-02.5-L-DV-A-S-K-TR and why does it matter?
The LSHM-120-02.5-L-DV-A-S-K-TR provides a 2.5 mm board stacking height, which determines the separation between the two mated PCBs. This compact 2.5 mm gap allows components on either board to face inward, maximizing the use of available PCB real estate in thin devices. Designers must ensure that any components placed between the boards fit within this 2.5 mm clearance.
How does the peg mounting option help during reflow soldering of the LSHM-120-02.5-L-DV-A-S-K-TR?
The PEG (peg) board mounting feature on the LSHM-120-02.5-L-DV-A-S-K-TR inserts into pre-drilled PCB holes, mechanically fixing the connector in position before and during reflow soldering. For a fine-pitch 0.50 mm connector with matte tin termination across 20 contacts in a 0.579 inch body, this prevents shifting under solder paste surface tension, ensuring all terminations align correctly and reducing solder defects in automated SMT assembly.
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