LSEM-120-03.0-L-DV-A-N-K-TR SAMTEC Connector (Other) In Stock
SAMTEC LSEM-120-03.0-L-DV-A-N-K-TR is a 20-position Razor Beam low-profile SMT socket connector with 3.0 mm stack height and dual-verify (DV) retention pegs for secure board mounting. Designed for high-speed board-to-board mating in space-constrained applications with tape-and-reel packaging. Available with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 40
- Lifecycle
- ACTIVE
- Category
- Connector
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- Razor Beam contact technology supporting high-speed signal integrity in board-to-board mating at 3.0 mm stack height
- Dual-verify (DV) retention pegs providing mechanical locking and board alignment during SMT reflow and mating cycles
- Tape-and-reel (TR) packaging enabling automated pick-and-place assembly for high-volume PCB production
Applications
The LSEM-120-03.0-L-DV-A-N-K-TR is used in board-to-board interconnect systems requiring a 3.0 mm mating stack height with high-speed signal capability, such as embedded computing modules, network line cards, and RF front-end assemblies. Its Razor Beam contact design ensures reliable high-frequency signal transmission between daughtercards and motherboards in compact enclosures. The DV retention pegs and SMT footprint make it suitable for automated assembly lines building high-density multi-board systems.
Specifications
| Pbfree Code | Yes |
| Factory Lead Time | 1Week |
| YTEOL | 8.4 |
| Additional Feature | RAZOR BEAM |
| Board Mounting Option | PEG |
| Body Breadth | 0.196inch |
| Body Depth | 0.175inch |
| Body Length | 0.803inch |
| Body/Shell Style | SOCKET |
| Connector Type | BOARD CONNECTOR |
| Contact Finish Mating | NOT SPECIFIED |
| Contact Finish Termination | Matte Tin (Sn) - with Nickel (Ni) barrier |
| Contact Gender | HERMAPHRODITIC |
| Contact Material | NOT SPECIFIED |
| Contact Pattern | RECTANGULAR |
| Contact Style | BELLOWED TYPE |
| DIN Conformance | NO |
| Filter Feature | NO |
| IEC Conformance | NO |
| Insulator Color | BLACK |
| Insulator Material | LIQUID CRYSTAL POLYMER |
| JESD-609 Code | e3 |
| MIL Conformance | NO |
| Mating Contact Pitch | 0.032inch |
| Mating Information | MULTIPLE MATING PARTS AVAILABLE |
| Mixed Contacts | NO |
| Mounting Option 1 | LOCKING |
| Mounting Style | STRAIGHT |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number Of PCB Rows | 2 |
| Number of Rows Loaded | 2 |
| Option | GENERAL PURPOSE |
| PCB Contact Pattern | RECTANGULAR |
| PCB Contact Row Spacing | 3.7084mm |
| Plating Thickness | 10u inch |
| Polarization Key | POLARIZED HOUSING |
| Rated Current (Signal) | 1.8A |
| Reference Standard | UL |
| Terminal Pitch | 0.8mm |
| Termination Type | SURFACE MOUNT |
| Total Number of Contacts | 40 |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
| Country of Origin | Costa Rica, USA |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What stack height and contact technology does LSEM-120-03.0-L-DV-A-N-K-TR provide for board-to-board designs?
The LSEM-120-03.0-L-DV-A-N-K-TR provides a 3.0 mm mating stack height using Samtec's Razor Beam contact technology. The Razor Beam design features a tuning-fork contact geometry that delivers low insertion force and consistent normal force across all 20 positions, maintaining reliable contact resistance below 20 mΩ. This 3.0 mm height suits thin embedded modules and compact multi-board assemblies where tighter stack heights of 1 mm or 2 mm would constrain component placement between boards.
How do the dual-verify (DV) retention pegs on LSEM-120-03.0-L-DV-A-N-K-TR help during SMT reflow and board assembly?
The dual-verify retention pegs press into corresponding holes in the PCB to mechanically anchor the connector body before and during reflow soldering. This prevents the connector from shifting or tilting when the solder paste melts at reflow temperatures around 250°C, ensuring accurate pad alignment across all 20 positions. After reflow, the pegs provide additional mechanical retention against pull-out forces during repeated board mating cycles, reducing the risk of pad delamination in field-serviceable assemblies.
For which high-speed signal applications is LSEM-120-03.0-L-DV-A-N-K-TR a better choice than a standard 0.100" pitch board connector?
The LSEM Razor Beam series is optimized for high-speed differential signals up to several gigabits per second with controlled impedance, unlike standard 0.100" pitch connectors designed for low-frequency logic signals below 100 MHz. Designers select the LSEM-120-03.0-L-DV-A-N-K-TR for PCIe, LVDS, SGMII, and similar high-speed interfaces on compute modules and FPGA boards where a 3.0 mm stack height and 20-position SMT socket must pass signals with minimal return loss and crosstalk at multi-GHz frequencies.
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