LQG15HS3N6S02DAlternatives & Equivalent Parts
About LQG15HS3N6S02D
LQG15HS3N6S02D is a Inductor component manufactured by Murata Electronics. It comes in a Other package. Below you'll find known alternative and equivalent parts that can serve as replacements in your design.
Need pricing on these alternatives?
Get one quote covering all 3 alternatives for LQG15HS3N6S02D — response within 24 hours.
Specification Comparison
| Parameter | LQG15HS3N6S02DSource | GRM1555C1H1R2WA01D | LPA1020-501KL | AM3358BZCZ100 |
|---|---|---|---|---|
| Manufacturer | Murata Electronics | Murata Electronics | Bourns | Texas Instruments |
| Package Type | Other | Capacitor Chip Non-polarised | Inductors, Axial Diameter Horizontal Mounting | BGA |
| Pin Count | 2 | 2 | 2 | 324 |
| Temperature Range | — | -55.0°C ~ 125.0°C | -40.0°C ~ 85.0°C | ~ 90.0°C |
| Price | $0.0088 | $0.0112 | $0.2289 | $8.7367 |
| Stock | In Stock | In Stock | In Stock | In Stock |
| Lifecycle | ACTIVE | NOT RECOMMENDED | ACTIVE | ACTIVE |
| Electrical Parameters | ||||
| Pbfree Code | Yes | Yes | Yes | — |
| Factory Lead Time | 9 Weeks | 10 Weeks | 16 Weeks | — |
| YTEOL | 7 | 3 | 6.1 | 15 |
| Case/Size Code | 1005/0402 | — | — | — |
| Construction | Multilayer Chip | — | Tubular | — |
| Core Material | AIR | — | FERRITE | — |
| DC Resistance | 0.14 Ω | — | 1 Ω | — |
| Inductance-Nom (L) | 0.0036 µH | — | 500 µH | — |
| Inductor Application | RF INDUCTOR | — | POWER INDUCTOR | — |
| Inductor Type | GENERAL PURPOSE INDUCTOR | — | GENERAL PURPOSE INDUCTOR | — |
| JESD-609 Code | e3 | e3 | e2 | e1 |
| Number of Functions | 1 | — | 1 | — |
| Package Height | 0.5 mm | — | — | — |
| Package Length | 1 mm | — | 20 mm | — |
| Package Style | SMT | SMT | Axial | GRID ARRAY, LOW PROFILE, FINE PITCH |
| Package Width | 0.5 mm | — | — | — |
| Packing Method | TR, PAPER, 7 INCH | 180mm Reel W8P2 | — | — |
| Quality Factor-Min (at L-nom) | 8 | — | — | — |
| Rated Current-Max | 0.75 A | — | 0.6 A | — |
| Self Resonance Frequency | 6000 MHz | — | — | — |
| Shape/Size Description | RECTANGULAR PACKAGE | — | TUBULAR PACKAGE | — |
| Shielded | NO | — | NO | — |
| Special Feature | INDUCTANCE TOLERANCE IS 0.3 NANO HENRY | — | — | — |
| Surface Mount | Reflow soldering | YES | NO | YES |
| Terminal Finish | Matte Tin (Sn) - with Nickel (Ni) barrier | Matte Tin (Sn) - with Nickel (Ni) barrier | TIN COPPER | Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal Placement | DUAL ENDED | — | AXIAL | — |
| Terminal Shape | WRAPAROUND | WRAPAROUND | WIRE | — |
| Test Frequency | 100 MHz | — | 0.001 MHz | — |
| Tolerance | 8.3333% | — | 10% | — |
| Reach Compliance Code | — | Compliant | — | — |
| Capacitance | — | 0.0000012 µF | — | — |
| Capacitor Type | — | CERAMIC CAPACITOR | — | — |
| Dielectric Material | — | CERAMIC | — | — |
| Height | — | 0.5 mm | — | — |
| Mounting Feature | — | SURFACE MOUNT | — | — |
| Multilayer | — | YES | — | — |
| Negative Tolerance | — | 4.1667% | — | — |
| Package Shape | — | RECTANGULAR PACKAGE | — | SQUARE |
| Positive Tolerance | — | 4.1667% | — | — |
| Rated (DC) Voltage (URdc) | — | 50 V | — | — |
| Size Code | — | 1005M/0402 | — | — |
| Temperature Characteristics Code | — | C0G | — | — |
| Temperature Coefficient | — | 30ppm/Cel ppm/°C | — | — |
| Lead Diameter | — | — | 0.65 mm | — |
| Lead Length | — | — | 25 mm | — |
| Package Diameter | — | — | 10 mm | — |
| Additional Feature | — | — | — | ALSO OPERATES AT MIN 0.912 V |
| JESD-30 Code | — | — | — | S-PBGA-B324 |
| Package Body Material | — | — | — | PLASTIC/EPOXY |
| Package Equivalence Code | — | — | — | BGA324,18X18,32 |
| Peak Reflow Temperature (Cel) | — | — | — | 260 |
| Qualification Status | — | — | — | Not Qualified |
| Supply Voltage-Max | — | — | — | 1.144 V |
| Supply Voltage-Min | — | — | — | 1.056 V |
| Supply Voltage-Nom | — | — | — | 1.1 V |
| Technology | — | — | — | CMOS |
| Temperature Grade | — | — | — | OTHER |
| Terminal Form | — | — | — | BALL |
| Terminal Pitch | — | — | — | 0.8 mm |
| Terminal Position | — | — | — | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | — | — | — | 30 |
| uPs/uCs/Peripheral ICs Type | — | — | — | SoC |
Cells highlighted in yellow indicate differing values across parts. Always verify with official datasheets before substitution.
Need pricing on these alternatives?
Get one quote covering all 3 alternatives for LQG15HS3N6S02D — response within 24 hours.
Quick Links
Why Look for Alternatives?
Finding alternatives for LQG15HS3N6S02D is essential for supply chain resilience. Component shortages, long lead times, and end-of-life notices can disrupt production schedules. Having verified alternative parts ensures your designs remain manufacturable.
When evaluating LQG15HS3N6S02D replacements, consider key parameters such as package compatibility, electrical specifications, and operating temperature range. Our engineering team can help verify pin-to-pin compatibility for your specific application.
Can't Find What You Need?
Our sourcing team can help find compatible alternatives for LQG15HS3N6S02D. Get expert recommendations within 24 hours.
FAQ
What is equivalent to LQG15HS3N6S02D?
Known equivalents for LQG15HS3N6S02D include GRM1555C1H1R2WA01D, LPA1020-501KL, AM3358BZCZ100. Contact FindMyChip for a full compatibility analysis for your specific application.
Can I use a different manufacturer's part instead of LQG15HS3N6S02D?
In many cases, yes. Cross-manufacturer alternatives exist for most standard components. However, always verify pin compatibility, electrical specs, and package dimensions before substituting in production.
How do I verify LQG15HS3N6S02D alternatives?
Compare the datasheet specifications including pinout, voltage ratings, timing parameters, and package dimensions. FindMyChip's engineering team can help with compatibility verification — submit an RFQ to get started.