LPV321DCKRG4 Texas Instruments Integrated Circuit (SOT23 (5-Pin)) In Stock
Texas Instruments LPV321DCKRG4 is a SEARAY high-speed board-to-board array connector. It provides 5 positions on a .050 in pitch open-pin-field terminal. From inquiry pricing, request current stock for worldwide shipping.
- Manufacturer
- Texas Instruments
- Package
- SOT23 (5-Pin)
- Pin Count
- 5
- Lifecycle
- OBSOLETE
- Datasheet
- LPV321DCKRG4 Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of LPV321DCKRG4?
- 5-position SEARAY open-pin-field array terminal for dense board-to-board interconnects
- .050 in pitch contact layout supports compact high-speed mezzanine and stacking designs
- production ordering configuration supports production purchasing and automated assembly planning
- Texas Instruments connector family with datasheet-backed SEAM mechanical configuration
What is LPV321DCKRG4 used for?
This connector is used in compact mezzanine, communications, test, and embedded control boards that need dense board-to-board signal routing. It fits production builds where 5 positions, a .050 in pitch, and production ordering configuration help simplify high-density PCB assembly.
What are the specifications of LPV321DCKRG4?
| Pbfree Code | No |
| YTEOL | 0 |
| Amplifier Type | OPERATIONAL AMPLIFIER |
| Architecture | VOLTAGE-FEEDBACK |
| Average Bias Current-Max (IIB) | 0.06 µA |
| Bias Current-Max (IIB) @25C | 0.05 µA |
| Common-mode Reject Ratio-Min | 50dB |
| Common-mode Reject Ratio-Nom | 71dB |
| Frequency Compensation | YES |
| Input Offset Voltage-Max | 10000 µV |
| JESD-30 Code | R-PDSO-G5 |
| JESD-609 Code | e4 |
| Low-Bias | NO |
| Low-Offset | NO |
| Micropower | YES |
| Number of Functions | 1 |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | TSSOP5/6,.08 |
| Package Shape | RECTANGULAR |
| Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| Packing Method | TAPE AND REEL |
| Peak Reflow Temperature (Cel) | 260 |
| Power | NO |
| Programmable Power | NO |
| Qualification Status | Not Qualified |
| Slew Rate-Nom | 0.1V/us |
| Supply Current-Max | 0.015mA |
| Supply Voltage Limit-Max | 5.5V |
| Supply Voltage-Nom (Vsup) | 5V |
| Surface Mount | YES |
| Technology | BIPOLAR |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | NICKEL PALLADIUM GOLD |
| Terminal Form | GULL WING |
| Terminal Pitch | 0.65mm |
| Terminal Position | DUAL |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Unity Gain BW-Nom | 237 |
| Voltage Gain-Min | 10000 |
| Wideband | NO |
| Package | SOT23 (5-Pin) |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 1 |
| ECCN | EAR99 |
| HTS Code | 8542.33.00.01 |
Where can I find the LPV321DCKRG4 datasheet?
LPV321DCKRG4 Datasheet DownloadOfficial datasheet from Texas Instruments
What are equivalent replacements for LPV321DCKRG4?
Compatible alternatives and drop-in replacements for LPV321DCKRG4:
Frequently Asked Questions
How does LPV321DCKRG4 fit dense board-to-board signal routing?
LPV321DCKRG4 provides 5 positions in a SEARAY open-pin-field connector, giving designers a compact .050 in pitch interface for mezzanine, communications, and embedded boards.
Which assembly planning detail matters for this SAMTEC SEAM ordering code?
The production ordering configuration helps buyers plan SMT production, while the 5-position connector format supports feeder setup, placement review, and board-level interconnect count.
What should buyers verify before substituting another SAMTEC SEARAY connector?
Check the required 5 positions, .050 in pitch, mating height, plating option, and reel format before approving an alternate, because nearby SEAM variants can differ mechanically.
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Why Buy from FindMyChip
About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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