LPC2387FBD100,551 NXP Integrated Circuit (Quad Flat Packages) In Stock
NXP LPC2387FBD100,551 is an integrated circuit for electronic assemblies. It is specified around 100 pins for matching footprints and electrical requirements. From inquiry pricing with worldwide shipping support.
- Manufacturer
- NXP
- Package
- Quad Flat Packages
- Pin Count
- 100
- Lifecycle
- ACTIVE
- Datasheet
- LPC2387FBD100,551 Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- Integrated Circuit record for LPC2387FBD100,551 with manufacturer traceability
- 100 pins configuration for design and sourcing checks
- QFP package information for footprint review
- active lifecycle status for procurement risk review
- Datasheet-linked record for specification and compliance validation
- Suitable for BOM matching, alternate review, and purchasing qualification
Applications
LPC2387FBD100,551 is used in embedded electronics, industrial control boards, instrumentation, and production BOM sourcing where consistent sourcing and documented specifications matter. The 100 pins detail helps engineers screen fit against the target footprint, rating, or interface requirement. It supports engineering teams during design qualification, approved-vendor review, and maintenance purchasing.
Specifications
| Manufacturer Package Code | SOT407-1 |
| YTEOL | 8 |
| Has ADC | YES |
| Bit Size | 32 |
| Boundary Scan | NO |
| CPU Family | ARM7 |
| Clock Frequency-Max | 24MHz |
| DAC Channels | YES |
| DMA Channels | YES |
| JESD-30 Code | S-PQFP-G100 |
| JESD-609 Code | e3 |
| Number of I/O Lines | 70 |
| On Chip Program ROM Width | 8 |
| PWM Channels | YES |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | QFP100,.63SQ,20 |
| Package Shape | SQUARE |
| Package Style | FLATPACK, LOW PROFILE, FINE PITCH |
| Peak Reflow Temperature (Cel) | 260 |
| Qualification Status | Not Qualified |
| RAM (bytes) | 100352 |
| ROM (words) | 524288 |
| ROM Programmability | FLASH |
| Speed | 72MHz |
| Supply Current-Max | 100mA |
| Supply Voltage-Max | 3.6V |
| Supply Voltage-Min | 3.3V |
| Supply Voltage-Nom | 3.3V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | Tin (Sn) |
| Terminal Form | GULL WING |
| Terminal Pitch | 0.5mm |
| Terminal Position | QUAD |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |
| Package | Quad Flat Packages |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 3 |
| ECCN | 3A991.A.2 |
| HTS Code | 8542.31.00.25 |
| Country of Origin | Taiwan |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How should LPC2387FBD100,551 be evaluated for a new Integrated Circuit design?
LPC2387FBD100,551 from NXP should be checked against the datasheet, layout constraints, and approved-vendor requirements; the available record highlights 100 pins, which helps confirm design fit before sourcing.
Which procurement details matter before buying LPC2387FBD100,551?
Buyers should verify lifecycle status, authorized availability, and lot traceability for LPC2387FBD100,551; matching the 100 pins requirement keeps substitutions aligned with the original bill of materials.
When is an alternate part acceptable for LPC2387FBD100,551?
An alternate is reasonable only when the replacement preserves the same functional category, mounting style, compliance needs, and 100 pins, because small specification changes can affect testing and assembly.
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