LPC2364FBD100,551 NXP Integrated Circuit (Quad Flat Packages) In Stock
NXP LPC2364FBD100,551 is a 32-bit ARM7 microcontroller with 128 KB Flash, integrated USB and Ethernet controllers, running at up to 25 MHz. It features a 16-bit external data bus, ADC, DAC channels, and DMA, targeting industrial networking and embedded control applications.
- Manufacturer
- NXP
- Package
- Quad Flat Packages
- Pin Count
- 100
- Lifecycle
- ACTIVE
- Datasheet
- LPC2364FBD100,551 Datasheet PDF
- Category
- Integrated Circuit
- Price
- From $8.9300(MOQ 20)
- Temp Range
- -40.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of LPC2364FBD100,551?
- 32-bit ARM7 CPU core running at up to 25 MHz clock frequency
- 128 KB on-chip Flash memory with integrated USB and Ethernet controllers
- 16-bit external data bus width for interfacing with external memory and peripherals
- Integrated ADC and DAC channels enabling mixed-signal embedded control designs
- DMA controller for efficient data transfer without CPU overhead in networking applications
- LQFP-100 (SOT407-1) package with 100 pins for rich I/O connectivity
What is LPC2364FBD100,551 used for?
The LPC2364FBD100,551 is well-suited for industrial networking gateways, embedded web servers, and automation controllers that require both USB and Ethernet connectivity on a single 32-bit ARM7 MCU. Its combination of 128 KB Flash, DMA channels, and analog peripherals also supports applications in data acquisition systems, medical devices, and motor control units operating at 25 MHz.
What are the specifications of LPC2364FBD100,551?
| Manufacturer Package Code | SOT407-1 |
| YTEOL | 8 |
| Has ADC | YES |
| Bit Size | 32 |
| Boundary Scan | NO |
| CPU Family | ARM7 |
| Clock Frequency-Max | 25MHz |
| DAC Channels | YES |
| DMA Channels | YES |
| External Data Bus Width | 16 |
| JESD-30 Code | S-PQFP-G100 |
| JESD-609 Code | e3 |
| Number of I/O Lines | 70 |
| On Chip Program ROM Width | 8 |
| PWM Channels | YES |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | QFP100,.63SQ,20 |
| Package Shape | SQUARE |
| Package Style | FLATPACK, LOW PROFILE, FINE PITCH |
| Peak Reflow Temperature (Cel) | 260 |
| Qualification Status | Not Qualified |
| RAM (bytes) | 34816 |
| ROM (words) | 131072 |
| ROM Programmability | FLASH |
| Speed | 72MHz |
| Supply Current-Max | 100mA |
| Supply Voltage-Max | 3.6V |
| Supply Voltage-Min | 3.3V |
| Supply Voltage-Nom | 3.3V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | Tin (Sn) |
| Terminal Form | GULL WING |
| Terminal Pitch | 0.5mm |
| Terminal Position | QUAD |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |
| Package | Quad Flat Packages |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 3 |
| ECCN | 3A991.A.2 |
| HTS Code | 8542.31.00.25 |
| Country of Origin | Taiwan |
Where can I find the LPC2364FBD100,551 datasheet?
LPC2364FBD100,551 Datasheet DownloadOfficial datasheet from NXP
What are equivalent replacements for LPC2364FBD100,551?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What communication interfaces does LPC2364FBD100,551 integrate and why does it simplify embedded networking designs?
The LPC2364FBD100,551 integrates USB and Ethernet controllers on a single 32-bit ARM7 chip running at up to 25 MHz. Having both interfaces on one MCU reduces external component count, lowers BOM cost, and simplifies firmware development for industrial gateways and embedded web servers needing simultaneous USB and network connectivity.
How does the 16-bit external data bus on LPC2364FBD100,551 support external memory expansion?
The 16-bit external data bus width allows the LPC2364FBD100,551 to interface directly with external SRAM, SDRAM, or NOR Flash memory chips, expanding storage capacity beyond the 128 KB on-chip Flash. This is useful for data-logging applications or firmware images that exceed the internal memory size in embedded networking equipment.
When should a designer choose LPC2364FBD100,551 over a simpler ARM7 MCU without Ethernet for a control application?
Choose the LPC2364FBD100,551 when the design requires both local USB device connectivity and remote Ethernet communication on one chip, such as in factory automation panels or remote I/O modules. The integrated 25 MHz ARM7 core with DMA, ADC, DAC, and 100-pin LQFP package eliminates the need for separate network interface chips, reducing PCB size and cost.
What package does LPC2364FBD100,551 use and how many I/O pins does it provide for system integration?
The LPC2364FBD100,551 is housed in an LQFP-100 package (NXP code SOT407-1) providing 100 pins for I/O, power, and interface signals. This package allows engineers to connect USB, Ethernet, external memory, ADC inputs, DAC outputs, and GPIO simultaneously in a standard 100-pin footprint compatible with typical SMT PCB processes.
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About NXP
NXP is a leading electronic component manufacturer. FindMyChip sources NXP ICs directly from authorized China distributors, offering competitive pricing and reliable stock.
| Qty. | Unit Price | Ext. Price |
|---|---|---|
| 20+ | $9.0900 | $181.80 |
| 30+ | $9.0600 | $271.80 |
| 75+ | $8.9300 | $669.75 |
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