LPC2364FBD100,551 NXP Integrated Circuit (Quad Flat Packages) In Stock

NXP LPC2364FBD100,551 is a 32-bit ARM7 microcontroller with 128 KB Flash, integrated USB and Ethernet controllers, running at up to 25 MHz. It features a 16-bit external data bus, ADC, DAC channels, and DMA, targeting industrial networking and embedded control applications.

ACTIVEIntegrated CircuitVerified Jul 2026
Package / Visual Reference
LPC2364FBD100,551Quad Flat Packages
Quick Facts
Manufacturer
NXP
Package
Quad Flat Packages
Pin Count
100
Lifecycle
ACTIVE
Category
Integrated Circuit
Price
From $8.9300(MOQ 20)
Temp Range
-40.0°C to 85.0°C
RoHS
Compliant
Lead Time
3–7 business days
Shipping
DHL Express · Worldwide

What are the key features of LPC2364FBD100,551?

  • 32-bit ARM7 CPU core running at up to 25 MHz clock frequency
  • 128 KB on-chip Flash memory with integrated USB and Ethernet controllers
  • 16-bit external data bus width for interfacing with external memory and peripherals
  • Integrated ADC and DAC channels enabling mixed-signal embedded control designs
  • DMA controller for efficient data transfer without CPU overhead in networking applications
  • LQFP-100 (SOT407-1) package with 100 pins for rich I/O connectivity

What is LPC2364FBD100,551 used for?

The LPC2364FBD100,551 is well-suited for industrial networking gateways, embedded web servers, and automation controllers that require both USB and Ethernet connectivity on a single 32-bit ARM7 MCU. Its combination of 128 KB Flash, DMA channels, and analog peripherals also supports applications in data acquisition systems, medical devices, and motor control units operating at 25 MHz.

What are the specifications of LPC2364FBD100,551?

Manufacturer Package CodeSOT407-1
YTEOL8
Has ADCYES
Bit Size32
Boundary ScanNO
CPU FamilyARM7
Clock Frequency-Max25MHz
DAC ChannelsYES
DMA ChannelsYES
External Data Bus Width16
JESD-30 CodeS-PQFP-G100
JESD-609 Codee3
Number of I/O Lines70
On Chip Program ROM Width8
PWM ChannelsYES
Package Body MaterialPLASTIC/EPOXY
Package Equivalence CodeQFP100,.63SQ,20
Package ShapeSQUARE
Package StyleFLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)260
Qualification StatusNot Qualified
RAM (bytes)34816
ROM (words)131072
ROM ProgrammabilityFLASH
Speed72MHz
Supply Current-Max100mA
Supply Voltage-Max3.6V
Supply Voltage-Min3.3V
Supply Voltage-Nom3.3V
Surface MountYES
TechnologyCMOS
Temperature GradeINDUSTRIAL
Terminal FinishTin (Sn)
Terminal FormGULL WING
Terminal Pitch0.5mm
Terminal PositionQUAD
Time@Peak Reflow Temperature-Max (s)30
uPs/uCs/Peripheral ICs TypeMICROCONTROLLER, RISC
PackageQuad Flat Packages

Compliance & Regulatory

RoHS StatusCompliant
Lead-FreeYes (Pb-Free)
Moisture Sensitivity LevelMSL 3
ECCN3A991.A.2
HTS Code8542.31.00.25
Country of OriginTaiwan

Where can I find the LPC2364FBD100,551 datasheet?

LPC2364FBD100,551 Datasheet Download

Official datasheet from NXP

What are equivalent replacements for LPC2364FBD100,551?

No known alternates. Submit an RFQ and our team can suggest alternatives.

Frequently Asked Questions

What communication interfaces does LPC2364FBD100,551 integrate and why does it simplify embedded networking designs?

The LPC2364FBD100,551 integrates USB and Ethernet controllers on a single 32-bit ARM7 chip running at up to 25 MHz. Having both interfaces on one MCU reduces external component count, lowers BOM cost, and simplifies firmware development for industrial gateways and embedded web servers needing simultaneous USB and network connectivity.

How does the 16-bit external data bus on LPC2364FBD100,551 support external memory expansion?

The 16-bit external data bus width allows the LPC2364FBD100,551 to interface directly with external SRAM, SDRAM, or NOR Flash memory chips, expanding storage capacity beyond the 128 KB on-chip Flash. This is useful for data-logging applications or firmware images that exceed the internal memory size in embedded networking equipment.

When should a designer choose LPC2364FBD100,551 over a simpler ARM7 MCU without Ethernet for a control application?

Choose the LPC2364FBD100,551 when the design requires both local USB device connectivity and remote Ethernet communication on one chip, such as in factory automation panels or remote I/O modules. The integrated 25 MHz ARM7 core with DMA, ADC, DAC, and 100-pin LQFP package eliminates the need for separate network interface chips, reducing PCB size and cost.

What package does LPC2364FBD100,551 use and how many I/O pins does it provide for system integration?

The LPC2364FBD100,551 is housed in an LQFP-100 package (NXP code SOT407-1) providing 100 pins for I/O, power, and interface signals. This package allows engineers to connect USB, Ethernet, external memory, ADC inputs, DAC outputs, and GPIO simultaneously in a standard 100-pin footprint compatible with typical SMT PCB processes.

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AvailabilityIn Stock
Reference Price (USD)
From $8.9300
Buy from 1pc · Factory-direct pricing
Qty.Unit PriceExt. Price
20+$9.0900$181.80
30+$9.0600$271.80
75+$8.9300$669.75
pcs
Unit price: $9.0900 · Total: $181.80

In Stock · 24h Response · Worldwide Shipping

Lead Time3-7 business days
MOQFrom 1 piece
ShippingDHL / FedEx / UPS
OriginChina (Authorized)

Response within 24 hours · Worldwide shipping

The anti-counterfeit verification gave us confidence we'd never had with other China suppliers.

RP
Rajesh Patel
Procurement Manager, VoltEdge Energy, India