LP5900SDX-2.2 Texas Instruments Integrated Circuit (Small Outline No-lead) In Stock
LP5900SDX-2.2 is a Texas Instruments LDO Voltage Regulators. Key details include 6 pins, Small Outline No-lead packaging, and Integrated Circuit classification for production BOM review. Request current pricing for stocked supply and worldwide shipping.
- Manufacturer
- Texas Instruments
- Package
- Small Outline No-lead
- Pin Count
- 6
- Lifecycle
- OBSOLETE
- Datasheet
- LP5900SDX-2.2 Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of LP5900SDX-2.2?
- 6 pins configuration supports footprint, rating, and replacement review
- Integrated Circuit role documented by Texas Instruments for production BOM sourcing
- Small Outline No-lead package reference supports assembly planning and incoming inspection
- Orderable LP5900SDX-2.2 identifier preserves manufacturer-specific variant traceability
What is LP5900SDX-2.2 used for?
LP5900SDX-2.2 is used in battery-powered equipment, sensor modules, portable instruments, and embedded power rails that need stable regulation around 6 pins. Designers select this integrated circuit when the 6 pins detail, package fit, and manufacturer ordering code need to remain consistent from prototype through production.
What are the specifications of LP5900SDX-2.2?
| Pbfree Code | No |
| YTEOL | 0 |
| Adjustability | FIXED |
| Dropout Voltage1-Max | 0.15V |
| Dropout Voltage1-Nom | 0.08V |
| Input Voltage Absolute-Max | 6V |
| Input Voltage-Max | 5.5V |
| Input Voltage-Min | 2.5V |
| JESD-30 Code | R-PDSO-N6 |
| JESD-609 Code | e0 |
| Line Regulation-Max | 0.0033% |
| Load Regulation-Max | 0.003278% |
| Number of Functions | 1 |
| Number of Outputs | 1 |
| Operating Temperature TJ-Max | 125°C |
| Operating Temperature TJ-Min | -40 °C |
| Output Current1-Max | 0.1A |
| Output Voltage1-Max | 2.244V |
| Output Voltage1-Min | 2.156V |
| Output Voltage1-Nom | 2.2V |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | SOLCC6,.08,25 |
| Package Shape | RECTANGULAR |
| Package Style | SMALL OUTLINE, VERY THIN PROFILE |
| Packing Method | TR |
| Peak Reflow Temperature (Cel) | 260 |
| Qualification Status | Not Qualified |
| Regulator Type | FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR |
| Surface Mount | YES |
| Technology | CMOS |
| Terminal Finish | TIN LEAD |
| Terminal Form | NO LEAD |
| Terminal Pitch | 0.65mm |
| Terminal Position | DUAL |
| Voltage Tolerance-Max | 2% |
| Package | Small Outline No-lead |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 1 |
| ECCN | EAR99 |
| HTS Code | 8542.39.00.60 |
Where can I find the LP5900SDX-2.2 datasheet?
LP5900SDX-2.2 Datasheet DownloadOfficial datasheet from Texas Instruments
What are equivalent replacements for LP5900SDX-2.2?
Compatible alternatives and drop-in replacements for LP5900SDX-2.2:
Frequently Asked Questions
Which designs are a fit for LP5900SDX-2.2 when 6 pins is required?
LP5900SDX-2.2 is a fit when the design needs 6 pins and the electrical or mechanical details documented by Texas Instruments; verify package, footprint, and operating limits against the datasheet.
How should engineers compare LP5900SDX-2.2 with alternatives that also specify 6 pins?
Compare LP5900SDX-2.2 with alternates by matching 6 pins, package style, lifecycle status, and critical ratings so a substitute does not change PCB fit or circuit behavior.
What procurement details matter for LP5900SDX-2.2 when the BOM calls for 6 pins?
Procurement should confirm the full manufacturer suffix, authorized supply, date-code requirements, and lot traceability because 6 pins variants can differ across otherwise similar orderable numbers.
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Why Buy from FindMyChip
About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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