LMV831MGE Texas Instruments Integrated Circuit (SOT23 (5-Pin)) In Stock
TEXAS INSTRUMENTS - LMV831MGE - Operational Amplifier, Single, 1 Amplifier, 3.3 MHz, 2 V/µs, 2.7V to 5.5V, SC-70, 5 Pins
- Manufacturer
- Texas Instruments
- Package
- SOT23 (5-Pin)
- Pin Count
- 5
- Lifecycle
- OBSOLETE
- Datasheet
- LMV831MGE Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of LMV831MGE?
- Integrated Circuit from Texas Instruments identified by manufacturer part number LMV831MGE
- Documented technical context includes 1 A for engineering comparison
- Package or mechanical reference recorded as SOT23 (5-Pin) for footprint checks
- Suitable for BOM sourcing, alternate review, repair stocking, and production procurement workflows
- Datasheet-backed context should be matched against voltage, current, timing, package, and lifecycle requirements before approval
What is LMV831MGE used for?
LMV831MGE is typically sourced for embedded electronics, industrial controls, communications equipment, and production BOM maintenance where buyers need a manufacturer-traceable integrated circuit with verifiable datasheet context. It is suitable for engineering replacement reviews, prototype builds, and production purchasing workflows that must confirm package fit, lifecycle risk, and key ratings such as 1 A.
What are the specifications of LMV831MGE?
| YTEOL | 0 |
| Amplifier Type | OPERATIONAL AMPLIFIER |
| Architecture | VOLTAGE-FEEDBACK |
| Average Bias Current-Max (IIB) | 0.0005 µA |
| Bias Current-Max (IIB) @25C | 0.00001 µA |
| Common-mode Reject Ratio-Min | 75dB |
| Common-mode Reject Ratio-Nom | 91dB |
| Frequency Compensation | YES |
| Input Offset Voltage-Max | 1230 µV |
| JESD-30 Code | R-PDSO-G5 |
| Low-Bias | NO |
| Low-Offset | NO |
| Micropower | NO |
| Number of Functions | 1 |
| Package Body Material | PLASTIC/EPOXY |
| Package Shape | RECTANGULAR |
| Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| Packing Method | TR |
| Power | NO |
| Programmable Power | NO |
| Slew Rate-Nom | 2V/us |
| Supply Current-Max | 0.3mA |
| Supply Voltage Limit-Max | 6V |
| Supply Voltage-Nom (Vsup) | 3.3V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | AUTOMOTIVE |
| Terminal Form | GULL WING |
| Terminal Pitch | 0.65mm |
| Terminal Position | DUAL |
| Unity Gain BW-Nom | 3300 |
| Voltage Gain-Min | 125892.5 |
| Wideband | NO |
| Package | SOT23 (5-Pin) |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8542.33.00.01 |
Where can I find the LMV831MGE datasheet?
LMV831MGE Datasheet DownloadOfficial datasheet from Texas Instruments
What are equivalent replacements for LMV831MGE?
Compatible alternatives and drop-in replacements for LMV831MGE:
Frequently Asked Questions
Which design checks should buyers confirm before selecting LMV831MGE?
Buyers should verify the integrated circuit role, package fit, lifecycle status, and datasheet ratings before approving this part. The fetched technical context includes 1 A, which should be matched against the target circuit and sourcing documentation.
How does the recorded package information affect sourcing LMV831MGE?
The recorded package reference is SOT23 (5-Pin), so purchasers should confirm footprint compatibility, assembly handling, and approved manufacturer documentation. Include 1 A in the engineering review so procurement does not substitute a part with mismatched limits.
When comparing alternates for LMV831MGE, which parameters matter most?
Start with manufacturer, component category, package style, lifecycle status, and the electrical or mechanical ratings shown in the datasheet. Because the available context includes 1 A, any alternate should match that requirement before release.
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Why Buy from FindMyChip
About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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