LMV552MM Texas Instruments Integrated Circuit (Small Outline Packages) In Stock

Name: LMV552MM
Brand: Texas Instruments
SKU: LMV552MM
Availability: InStock

Specified 3-V and 5-V Performance • High Unity Gain Bandwidth 3 MHz • Supply Current (Per Amplifier) 37 µA • CMRR 93 dB • PSRR 90 dB • Slew Rate 1 V/µs • Output Swing With 100-kΩ Load 70 mV From Rail • Total Harmonic Distortion: 0.003% at 1 kHz, 2 kΩ • Temperature Range: −40°C to 125°C

OBSOLETEIntegrated CircuitVerified Jul 2026

Package / Visual Reference

LMV552MMSmall Outline Packages

Quick Facts

Manufacturer: Texas Instruments
Package: Small Outline Packages
Pin Count: 8
Lifecycle: OBSOLETE
Datasheet: LMV552MM Datasheet PDF
Category: Integrated Circuit
Temp Range: -40.0°C to 125.0°C
RoHS: Compliant
Lead Time: 3–7 business days
Shipping: DHL Express · Worldwide

What are the key features of LMV552MM?

Integrated Circuit from Texas Instruments identified by manufacturer part number LMV552MM
Documented technical context includes 3-V for engineering comparison
Package or mechanical reference recorded as Small Outline Packages for footprint checks
Suitable for BOM sourcing, alternate review, repair stocking, and production procurement workflows
Datasheet-backed context should be matched against voltage, current, timing, package, and lifecycle requirements before approval

What is LMV552MM used for?

LMV552MM is typically sourced for embedded electronics, industrial controls, communications equipment, and production BOM maintenance where buyers need a manufacturer-traceable integrated circuit with verifiable datasheet context. It is suitable for engineering replacement reviews, prototype builds, and production purchasing workflows that must confirm package fit, lifecycle risk, and key ratings such as 3-V.

What are the specifications of LMV552MM?

YTEOL	0
Amplifier Type	OPERATIONAL AMPLIFIER
Architecture	VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB)	0.038 µA
Bias Current-Max (IIB) @25C	0.038 µA
Common-mode Reject Ratio-Min	72dB
Common-mode Reject Ratio-Nom	92dB
Frequency Compensation	YES
Input Offset Voltage-Max	4500 µV
JESD-30 Code	S-PDSO-G8
JESD-609 Code	e0
Low-Bias	NO
Low-Offset	NO
Micropower	NO
Number of Functions	2
Package Body Material	PLASTIC/EPOXY
Package Shape	SQUARE
Package Style	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method	TR
Peak Reflow Temperature (Cel)	260
Power	NO
Programmable Power	NO
Slew Rate-Nom	1V/us
Supply Current-Max	104mA
Supply Voltage Limit-Max	6V
Supply Voltage-Nom (Vsup)	3V
Surface Mount	YES
Technology	BICMOS
Temperature Grade	AUTOMOTIVE
Terminal Finish	TIN LEAD
Terminal Form	GULL WING
Terminal Pitch	0.65mm
Terminal Position	DUAL
Time@Peak Reflow Temperature-Max (s)	40
Unity Gain BW-Nom	3000
Voltage Gain-Min	7943.2
Wideband	NO
Package	Small Outline Packages

Compliance & Regulatory

RoHS Status	Compliant
Lead-Free	Yes (Pb-Free)
Moisture Sensitivity Level	MSL 1
ECCN	EAR99
HTS Code	8542.33.00.01

Where can I find the LMV552MM datasheet?

LMV552MM Datasheet Download

Official datasheet from Texas Instruments

What are equivalent replacements for LMV552MM?

No known alternates. Submit an RFQ and our team can suggest alternatives.

Frequently Asked Questions

Does LMV552MM fit designs that require 3-V?

It can be considered when the target circuit needs a integrated circuit and the engineering review confirms 3-V against the official datasheet. Buyers should also verify package fit, lifecycle status, and manufacturer traceability before release.

How should buyers verify 3-V before approving LMV552MM?

Compare 3-V with the schematic requirement, qualified alternates, and procurement documentation before purchasing. The value should be checked together with package information, application temperature needs, and supplier lot traceability.

Which package and sourcing checks matter for LMV552MM from Texas Instruments?

The recorded package reference is Small Outline Packages, so purchasing and engineering teams should confirm footprint compatibility, assembly handling, and approved-source documentation. Keep 3-V in the review notes so substitutes are screened against the same requirement.

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About Texas Instruments

Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.

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Lead Time3-7 business days

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LMV552MM Texas Instruments Integrated Circuit (Small Outline Packages) In Stock

What are the key features of LMV552MM?

What is LMV552MM used for?

What are the specifications of LMV552MM?

Compliance & Regulatory

Where can I find the LMV552MM datasheet?

What are equivalent replacements for LMV552MM?

Frequently Asked Questions

Does LMV552MM fit designs that require 3-V?

How should buyers verify 3-V before approving LMV552MM?

Which package and sourcing checks matter for LMV552MM from Texas Instruments?

Related Guides

CSD87313DMS Synchronous Buck Power Stage Design Guide

STEF05SGR eFuse Selection Guide for 5 V Overcurrent Protection

C0402C103K3RACTU Selection Guide: Choosing a 10 nF 0402 MLCC

STM32H753VIT6 MCU Selection Guide: Memory, Package, Connectivity, and Security

Why Buy from FindMyChip

About Texas Instruments

More from Texas Instruments

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