LMV358IDE4 Texas Instruments Integrated Circuit (Small Outline Packages) In Stock
LMV358IDE4 is an operational amplifier by Texas Instruments. Key specs include Average Bias Current-Max (IIB): 0.25 µA; Bias Current-Max (IIB) @25C: 0.25 µA. From RFQ price checks to worldwide shipping, FindMyChip supports sourcing.
- Manufacturer
- Texas Instruments
- Package
- Small Outline Packages
- Pin Count
- 8
- Lifecycle
- OBSOLETE
- Datasheet
- LMV358IDE4 Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of LMV358IDE4?
- Average Bias Current-Max (IIB): 0.25 µA for operational amplifier design checks
- SOIC, 8 pins package information for PCB footprint and receiving inspection
- -40°C to 125°C operating temperature context for qualification planning
- OP Amp Dual GP R-R O/P 5.5V 8-Pin SOIC Tube source description preserved for buyer review
- Texas Instruments LMV358IDE4 identification for RFQ, traceability, and alternate checks
What is LMV358IDE4 used for?
LMV358IDE4 is suited to signal conditioning, sensor front ends, active filters, and precision analog stages where SOIC, 8 pins sourcing details matter. Buyers commonly verify -40°C to 125°C, lifecycle status, and manufacturer traceability before approving it for production or maintenance builds.
What are the specifications of LMV358IDE4?
| YTEOL | 0 |
| Amplifier Type | OPERATIONAL AMPLIFIER |
| Architecture | VOLTAGE-FEEDBACK |
| Average Bias Current-Max (IIB) | 0.25 µA |
| Bias Current-Max (IIB) @25C | 0.25 µA |
| Common-mode Reject Ratio-Min | 50dB |
| Common-mode Reject Ratio-Nom | 65dB |
| Frequency Compensation | YES |
| Input Offset Voltage-Max | 7000 µV |
| JESD-30 Code | R-PDSO-G8 |
| JESD-609 Code | e4 |
| Low-Bias | NO |
| Low-Offset | NO |
| Micropower | YES |
| Number of Functions | 2 |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | SOP8,.25 |
| Package Shape | RECTANGULAR |
| Package Style | SMALL OUTLINE |
| Packing Method | TUBE |
| Peak Reflow Temperature (Cel) | 260 |
| Power | NO |
| Programmable Power | NO |
| Qualification Status | Not Qualified |
| Slew Rate-Nom | 1V/us |
| Supply Current-Max | 0.615mA |
| Supply Voltage Limit-Max | 5.5V |
| Supply Voltage-Nom (Vsup) | 2.7V |
| Surface Mount | YES |
| Technology | BIPOLAR |
| Temperature Grade | AUTOMOTIVE |
| Terminal Finish | NICKEL PALLADIUM GOLD |
| Terminal Form | GULL WING |
| Terminal Pitch | 1.27mm |
| Terminal Position | DUAL |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Unity Gain BW-Nom | 1000 |
| Voltage Gain-Min | 10000 |
| Wideband | NO |
| Package | Small Outline Packages |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 1 |
| ECCN | EAR99 |
| HTS Code | 8542.33.00.01 |
Where can I find the LMV358IDE4 datasheet?
LMV358IDE4 Datasheet DownloadOfficial datasheet from Texas Instruments
What are equivalent replacements for LMV358IDE4?
Compatible alternatives and drop-in replacements for LMV358IDE4:
Frequently Asked Questions
Which design detail should engineers check first for LMV358IDE4?
Start with Average Bias Current-Max (IIB): 0.25 µA because it is the clearest numeric constraint in the available context. Also confirm the 8 pins package details before schematic reuse or AVL approval.
How should the package listing be used when sourcing LMV358IDE4?
LMV358IDE4 is listed with SOIC, 8 pins, giving buyers a concrete package target for footprint checks, incoming inspection, reel or tube planning, and approved-source matching.
What should procurement confirm before placing an RFQ for LMV358IDE4?
Confirm the exact Texas Instruments MPN, -40°C to 125°C operating context, and datasheet revision. For controlled builds, request date-code traceability and RoHS or lead-free evidence before release.
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Why Buy from FindMyChip
About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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