LMV1032URX-25 Texas Instruments Integrated Circuit (Other) In Stock
LMV1032URX-25 is a single-channel audio amplifier IC for 3-wire analog electret microphones, delivering 25.5 dB gain and 21 kHz bandwidth with 0.35% harmonic distortion. Available in compact 4-ball BGA package for space-constrained designs.
- Manufacturer
- Texas Instruments
- Package
- Other
- Pin Count
- 4
- Lifecycle
- OBSOLETE
- Datasheet
- LMV1032URX-25 Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 25.5 dB fixed gain optimized for electret microphone signal amplification
- 21 kHz bandwidth supporting full audio frequency range with low 0.35% harmonic distortion
- Single-channel design in ultra-compact S-PBGA-B4 4-ball BGA package for miniaturized applications
- Lead-free (Pb-free) construction compliant with RoHS environmental standards
Applications
The LMV1032URX-25 is designed for 3-wire analog electret microphone amplification in portable consumer electronics such as smartphones, tablets, laptops, and Bluetooth headsets. Its compact BGA package and low distortion characteristics make it ideal for hearing aids, voice recorders, and wearable devices where size and audio fidelity are critical. It also suits noise-canceling microphone front-ends and IoT voice-interface modules requiring consistent gain performance.
Specifications
| Pbfree Code | Yes |
| YTEOL | 0 |
| Bandwidth-Nom | 21kHz |
| Consumer IC Type | AUDIO AMPLIFIER |
| Gain | 25.5dB |
| Harmonic Distortion | 0.35% |
| JESD-30 Code | S-PBGA-B4 |
| JESD-609 Code | e1 |
| Number of Channels | 1 |
| Number of Functions | 1 |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | BGA4,2X2,20 |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 5V |
| Supply Voltage-Min (Vsup) | 1.7V |
| Surface Mount | YES |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | TIN SILVER COPPER |
| Terminal Form | BALL |
| Terminal Pitch | 0.5mm |
| Terminal Position | BOTTOM |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 1 |
| ECCN | EAR99 |
| HTS Code | 8542.33.00.01 |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the gain of the LMV1032URX-25 and how is it set?
The LMV1032URX-25 provides a fixed gain of 25.5 dB, factory-set for 3-wire analog electret microphones. No external resistors are required to configure the gain, simplifying PCB design and reducing component count in space-constrained audio applications.
What package does the LMV1032URX-25 use and what are its dimensions?
The LMV1032URX-25 is housed in an S-PBGA-B4 (4-ball BGA) package per JESD-30 classification. This ultra-compact package is ideal for portable and wearable devices where board space is limited, and it is fully lead-free (Pb-free) in compliance with RoHS requirements.
What type of microphone is the LMV1032URX-25 designed to work with?
The LMV1032URX-25 is specifically designed for 3-wire analog electret microphones, which are commonly used in smartphones, laptops, headsets, and voice recorders. Its 21 kHz bandwidth and 0.35% harmonic distortion ensure high-fidelity audio capture across the full audible frequency range.
Can the LMV1032URX-25 be used in hearing aids or medical audio devices?
Yes, the LMV1032URX-25 is suitable for hearing aids and compact medical audio devices due to its low harmonic distortion of 0.35%, wide 21 kHz bandwidth, and tiny BGA footprint. Its single-channel architecture and stable 25.5 dB gain make it a reliable choice for precision audio amplification in low-power portable applications.
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About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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